M1AFS600-2FG256 vs AFS600-FG256I Vergleich
Detaillierter Direktvergleich von M1AFS600-2FG256 von Microchip Technology und AFS600-FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ AktivMicrochip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS600-2FG256 | AFS600-FG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Series | M1AFS600 (Fusion) | — |
| System Gates | 600000 gates | 600,000 gates |
| Logic Elements | 110592 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Number of I/Os | 119 I/O | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm flash-based | — |
| Gehäuse / Bauform | 256-LBGA (FBGA-256) | — |
| Montagestil | SMD/SMT | — |
| Operating Temperature - Minimum | 0 C | — |
| Operating Temperature - Maximum | +70 C | — |
| Packaging | Tray | — |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management (PLL) | — |
| Configuration | Flash-based, live at power-up, no external config PROM required | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Maximum Operating Frequency | [DATA_NEEDED: maximum fabric operating frequency] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Blocks | — | 13,824 CLBs |
| User I/O | — | 119 I/O |
| Versorgungsspannung | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Nonvolatile flash memory |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Logic Family | — | CMOS |
| Package Type | — | 256-LBGA |
| Package Pitch | — | 1.0 mm |
| Number of Package Balls | — | 256 balls |
| Package Shape | — | Square |
| Montageart | — | Surface mount |
| Betriebstemperatur | — | 0 C to 70 C |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |