M1AFS600-2FG256 vs AFS600-FG256I तुलना
विस्तृत दोनों ओर की तुलना M1AFS600-2FG256 द्वारा Microchip Technology और AFS600-FG256I द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ सक्रियMicrochip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ सक्रियविशेषता तुलना
| पैरामीटर | M1AFS600-2FG256 | AFS600-FG256I |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | M1AFS600 (Fusion) | — |
| System Gates | 600000 gates | 600,000 gates |
| Logic Elements | 110592 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Number of I/Os | 119 I/O | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm flash-based | — |
| पैकेज / केस | 256-LBGA (FBGA-256) | — |
| माउंटिंग स्टाइल | SMD/SMT | — |
| Operating Temperature - Minimum | 0 C | — |
| Operating Temperature - Maximum | +70 C | — |
| Packaging | Tray | — |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management (PLL) | — |
| Configuration | Flash-based, live at power-up, no external config PROM required | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Maximum Operating Frequency | [DATA_NEEDED: maximum fabric operating frequency] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Blocks | — | 13,824 CLBs |
| User I/O | — | 119 I/O |
| सप्लाई वोल्टेज | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Nonvolatile flash memory |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Logic Family | — | CMOS |
| Package Type | — | 256-LBGA |
| Package Pitch | — | 1.0 mm |
| Number of Package Balls | — | 256 balls |
| Package Shape | — | Square |
| माउंटिंग प्रकार | — | Surface mount |
| ऑपरेटिंग तापमान | — | 0 C to 70 C |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |