M1AFS600-2FG256 vs AFS600-FG256I 比較

詳細並排比較 M1AFS600-2FG256 由 Microchip Technology 與 AFS600-FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ 啟用中
Microchip Technology
AFS600-FG256I AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology

AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology

AFS600-FG256I ✓ 啟用中

規格比較

參數 M1AFS600-2FG256 AFS600-FG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series M1AFS600 (Fusion) —
System Gates 600000 gates 600,000 gates
Logic Elements 110592 —
Embedded Processor ARM Cortex-M1 —
Number of I/Os 119 I/O —
Core Supply Voltage 1.5 V —
Technology 130 nm flash-based —
封裝 / 外殼 256-LBGA (FBGA-256) —
安裝方式 SMD/SMT —
Operating Temperature - Minimum 0 C —
Operating Temperature - Maximum +70 C —
Packaging Tray —
Analog Peripherals Configurable analog block (Fusion mixed-signal) —
On-chip Memory Large flash memory blocks —
Clock Management On-chip clock generation and management (PLL) —
Configuration Flash-based, live at power-up, no external config PROM required —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Maximum Operating Frequency [DATA_NEEDED: maximum fabric operating frequency] —
Device Type — Fusion mixed-signal FPGA
Configurable Logic Blocks — 13,824 CLBs
User I/O — 119 I/O
供應電壓 — 1.5 V
Process Technology — 130 nm CMOS
Metal Layers — 7 layers
Configuration Memory — Nonvolatile flash memory
Power-Up Feature — Live at Power-Up (LAPU)
Logic Family — CMOS
Package Type — 256-LBGA
Package Pitch — 1.0 mm
Number of Package Balls — 256 balls
Package Shape — Square
安裝類型 — Surface mount
工作溫度 — 0 C to 70 C
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

資料表與資源

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