MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP
Référence : MC9S08QG4CFFE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.85 | $1,85 |
| 10 | $1.68 | $16,80 |
| 100 | $1.42 | $142,00 |
| 500 | $1.25 | $625,00 |
| 1 000 | $1.1 | $1 100,00 |
MC9S08QG4CFFE Présentation
An 8-bit microcontroller is a single-chip computer that integrates a processor core, program memory (flash), data RAM, and peripherals such as timers, ADC, and serial interfaces on one die. Microcontrollers sit at the lowest level of the embedded-system hierarchy - below 16/32-bit MCUs and application processors - and are chosen where cost, pin count, and power matter more than raw throughput. The S08 family is NXP (formerly Freescale) architecture descending from the HC08 instruction set.
Key features of the MC9S08QG4CFFE include the 20-MHz HCS08 CPU with the HC08 instruction set plus an added BGND instruction, an on-chip background debugging system supporting in-circuit debugging, and breakpoint capability with one breakpoint during in-circuit debugging plus additional on-chip breakpoints. The S08QG family provides serial interfaces and peripherals normally found in higher-end devices, all in a very small package, making S08QG devices a strong fit for battery-powered designs.
Technically, the device belongs to the S08 Family, S08QG Series (QG Series) of the S08 core architecture, a CISC 8-bit core with flash-based program storage. The QFN package code is HVQCCN (square, no-lead), 16 terminals, no-lead terminal form, industrial temperature grade, shipped in trays.
Typical applications include small battery-powered appliances, simple consumer electronics, low-cost sensing nodes, and replacement/continuation builds for legacy S08QG-based boards.
Design consideration: this part is End of Life per the NXP product page. Plan last-time-buy quantities or qualify a replacement before new designs.
This page consolidates verified distributor listings, lifecycle status, drop-in alternatives, and design guidance not found in any single manufacturer or distributor source.
Alternatives de remplacement direct pour MC9S08QG4CFFE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08QG4CFFE (même facteur de forme et même empreinte) — différant par Package, Core, RoHS Status, Debug Interface, Instruction Set.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08QG4CFDE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08QG4CFFR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08QG8CFDE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08QG4MPAE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08QG4CFFE Valeurs maximales et caractéristiques électriques
| Core Processor | S08 |
| Core Size | 8-Bit |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Fréquence d'horloge maximale | 20 MHz |
| Program Memory Size | 4KB (4K x 8) FLASH |
| Tension d'alimentation | 2.5 V / 3.3 V |
| Boîtier | 16-QFN-EP (5x5 mm), QFN EP |
| Package Code | HVQCCN |
| Package Shape | Square |
| Number of Terminals | 16 |
| Terminal Form | No Lead |
| Temperature Grade | Industrial |
| Series | S08QG (QG Series, S08 Family) |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Statut du cycle de vie | End of Life (per NXP product page) |
Guide de configuration des broches du MC9S08QG4CFFE square
Configuration des broches du MC9S08QG4CFFE (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S08QG4CFFE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S08QG4CFFE convient pour 6 applications: Battery-Powered Consumer Devices, Low-Cost Sensing Nodes, Small Appliance Control, Legacy S08QG Board Continuation, Educational and Hobby Embedded Projects, Simple Human-Machine Interface Controllers.
Battery-Powered Consumer Devices
The MC9S08QG4CFFE fits battery-powered consumer products because NXP designed the S08QG family explicitly as a 'perfect fit for battery-powered devices', pairing a low-power S08 8-bit core with 2.5V/3.3V operation. In a two-cell battery product, the MCU can run directly from the cell stack without a regulated rail, and its 20 MHz CPU delivers adequate performance for key scanning, LED control, and simple state machines while lower clock modes extend runtime. The compact 16-QFN-EP 5x5 mm footprint keeps the PCB small for handheld form factors. Firmware stored in 4KB flash with in-circuit background debugging simplifies field iteration.
Recommandé
Low-Cost Sensing Nodes
In distributed sensing nodes, the MC9S08QG4CFFE acts as the local controller that reads sensors, filters readings, and communicates over a serial link. The S08QG family provides serial interfaces and peripherals normally found in higher-end devices in a very small package, per NXP, so a single 16-pin QFN device can handle sensor digitization and communication with minimal board area. Operating from 2.5V or 3.3V aligns with typical low-power sensor rails, and the no-lead QFN-EP package supports compact two-layer layouts. Industrial temperature grade extends suitability to unconditioned environments such as outdoor or factory-floor nodes.
Recommandé
Small Appliance Control
Small appliances - fans, chargers, kettles, and similar mains-powered products - need a low-cost controller for button inputs, indicator LEDs, and simple thermal or timing logic. The MC9S08QG4CFFE covers these needs with a 20 MHz S08 core, 4KB flash, and on-chip peripherals in a 16-QFN-EP package, keeping BOM cost and board area minimal. Its industrial temperature grade tolerates the elevated internal temperatures typical of enclosed appliances. The on-chip background debugging system allows in-circuit firmware updates during production line programming, and the HC08 instruction set heritage ensures broad toolchain and legacy-code compatibility for appliance platforms.
Recommandé
Legacy S08QG Board Continuation
Boards already designed around the S08QG family face sourcing risk now that the MC9S08QG4CFFE is End of Life per NXP. For continuity builds, same-footprint family variants such as the MC9S08QG4CFDE and MC9S08QG8CFDE provide drop-in replacements on the existing 16-QFN-EP land pattern, preserving the validated PCB while extending supply. Authorized aftermarket sources such as Rochester Electronics also list the original part number for legacy programs. When migrating firmware to the QG8 variant, the identical S08 core and instruction set minimize code changes to linker settings and memory mapping.
Recommandé
Educational and Hobby Embedded Projects
The MC9S08QG4CFFE and its S08QG family are attractive for learning embedded development: an 8-bit CISC core with a documented HC08-derived instruction set, 4KB flash for small programs, and a background debugging system that supports single-wire in-circuit debugging on inexpensive hardware. NXP's S08 toolchain and CodeWarrior-class environments provide assembly and C development. The 5x5 mm QFN-EP package suits adapter boards and breadboard carriers, and 2.5V/3.3V operation matches common low-voltage peripherals. Breakpoint capability with one in-circuit breakpoint plus additional on-chip breakpoints makes step-by-step debugging practical for students.
Recommandé
Simple Human-Machine Interface Controllers
Simple HMIs - button panels, indicator clusters, small status displays - need a controller with enough I/O and timers but minimal cost. The MC9S08QG4CFFE provides this in 16 pins: the S08 core executes key-scan and debounce loops at up to 20 MHz while 4KB flash stores look-up tables and display logic. NXP notes the S08QG family carries serial interfaces and peripherals normally found in higher-end devices, useful when the panel must talk to a host over a serial link. The QFN-EP no-lead package mounts flush on the back of a membrane-panel PCB, and 2.5V/3.3V operation suits battery or logic-rail powered panels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08QG4CFFE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08QG4CFDE | MC9S08QG8CFDE | MC9S08QG4CDTE | MC9S08QG4MPAE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S08 (HCS08), 8-bit | S08 (HCS08), 8-bit | S08 (HCS08), 8-bit | S08 (HCS08), 8-bit | S08 (HCS08), 8-bit |
| Max Clock Frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Flash Memory | 4KB (4K x 8) | 4KB | 8KB (+100%) | 4KB | 4KB |
Principaux différenciateurs
- Largest memory in the true drop-in set (vs MC9S08QG4CFDE)
- Upgradability within the same footprint (vs MC9S08QG8CFDE)
- Small-footprint choice over leaded variant (vs MC9S08QG4CDTE)
Notes de conception
The MC9S08QG4CFFE is End of Life according to the NXP product page, which also hosts the discontinuance notice and replacement Product Change Notice. Do not start new designs on this exact MPN. Place last-time-buy orders sized to your field-support horizon, and qualify a same-footprint family variant (e.g., MC9S08QG4CFDE or MC9S08QG8CFDE on the same 16-QFN-EP land pattern) as the second source before existing stock is exhausted.
The 16-QFN-EP package has an exposed pad on the underside that must be soldered to a ground Via pattern on the PCB for reliable grounding and thermal performance. Use an NSMD pad pattern with an approximately 50-60% solder-mask aperture reduction for the center pad per standard QFN assembly practice, and verify the pad geometry against the manufacturer's footprint drawing in the datasheet. No-lead packages require X-ray or visible-joint inspection criteria agreed with your assembler.
The device operates from 2.5V or 3.3V supplies. Provide local 0.1 uF decoupling directly at the supply pin and a bulk capacitor near the regulator output. For battery-powered designs, exploit the S08 low-power stop and wait modes and reduce bus clock frequency during idle periods; verify exact per-mode current figures in the NXP datasheet table rather than estimating, since these values are not stated in the distributor summaries used here.
Informations de conformité
The NXP product page includes an 'Environmental Quality' section for MC9S08QG4CFFE, but specific RoHS/REACH/lead-free status was not stated in the retrieved snippets. Consult the NXP Environmental Quality page for this exact ordering code.
