MPC8260ACZUMIBB vs XPC8260CVVIFBC Comparaison
Comparaison détaillée côte à côte de MPC8260ACZUMIBB par NXP Semiconductors et XPC8260CVVIFBC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteNXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ ActifComparaison des spécifications
| Paramètre | MPC8260ACZUMIBB | XPC8260CVVIFBC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $200,00 | $219,50 |
| Core Processor | PowerPC G2 | — |
| Architecture | RISC 32-bit | — |
| Number of Cores | 1 | — |
| Core Clock Speed | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None (per datasheet) | — |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.25 µm CMOS | — |
| Boîtier | 480-TBGA (37.5 x 37.5 mm) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Température de fonctionnement | [DATA_NEEDED: full operating temperature range] | — |
| Part Status | Not For New Designs (No Longer Manufactured) | — |
| Processor Type | — | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | — | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| Communications Processor Module (CPM) | — | Integrated (per PowerQUICC II architecture) |
| Boîtier / Format | — | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | — | Ball |
| Number of Terminals | — | 480 |
| Package Body Material | — | Plastic / Epoxy |
| Packaging | — | Tray |
| Manufacturer Lifecycle Source | — | NXP Semiconductors (Freescale/Motorola legacy) |
| Statut RoHS | — | [DATA_NEEDED: RoHS compliance] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Series | — | PowerQUICC II (PQ II HIP 3) |