MPC8260ACZUMIBB vs XPC8260CVVIFBC 对比
详细并排对比 MPC8260ACZUMIBB 出自 NXP Semiconductors 和 XPC8260CVVIFBC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteNXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ 量产中规格对比
| 参数 | MPC8260ACZUMIBB | XPC8260CVVIFBC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $200.00 | $219.50 |
| Core Processor | PowerPC G2 | — |
| Architecture | RISC 32-bit | — |
| Number of Cores | 1 | — |
| Core Clock Speed | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None (per datasheet) | — |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.25 µm CMOS | — |
| 封装 | 480-TBGA (37.5 x 37.5 mm) | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| 工作温度 | [DATA_NEEDED: full operating temperature range] | — |
| Part Status | Not For New Designs (No Longer Manufactured) | — |
| Processor Type | — | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | — | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| Communications Processor Module (CPM) | — | Integrated (per PowerQUICC II architecture) |
| 封装 / 外壳 | — | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | — | Ball |
| Number of Terminals | — | 480 |
| Package Body Material | — | Plastic / Epoxy |
| Packaging | — | Tray |
| Manufacturer Lifecycle Source | — | NXP Semiconductors (Freescale/Motorola legacy) |
| RoHS 状态 | — | [DATA_NEEDED: RoHS compliance] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Series | — | PowerQUICC II (PQ II HIP 3) |