MPC8260ACZUMIBB vs XPC8260CVVIFBC 비교
다음의 상세 나란히 비교: MPC8260ACZUMIBB 제조: NXP Semiconductors 및 XPC8260CVVIFBC 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteNXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ 활성사양 비교
| 파라미터 | MPC8260ACZUMIBB | XPC8260CVVIFBC |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | Obsolete | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $200.00 | $219.50 |
| Core Processor | PowerPC G2 | — |
| Architecture | RISC 32-bit | — |
| Number of Cores | 1 | — |
| Core Clock Speed | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None (per datasheet) | — |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.25 µm CMOS | — |
| 패키지 | 480-TBGA (37.5 x 37.5 mm) | — |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| 동작 온도 | [DATA_NEEDED: full operating temperature range] | — |
| Part Status | Not For New Designs (No Longer Manufactured) | — |
| Processor Type | — | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | — | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| Communications Processor Module (CPM) | — | Integrated (per PowerQUICC II architecture) |
| 패키지 / 케이스 | — | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | — | Ball |
| Number of Terminals | — | 480 |
| Package Body Material | — | Plastic / Epoxy |
| Packaging | — | Tray |
| Manufacturer Lifecycle Source | — | NXP Semiconductors (Freescale/Motorola legacy) |
| RoHS 상태 | — | [DATA_NEEDED: RoHS compliance] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Series | — | PowerQUICC II (PQ II HIP 3) |