MPC8260ACZUMIBB vs XPC8260CVVIFBC Comparación
Comparación detallada lado a lado de MPC8260ACZUMIBB por NXP Semiconductors y XPC8260CVVIFBC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteNXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ ActivoComparación de especificaciones
| Parámetro | MPC8260ACZUMIBB | XPC8260CVVIFBC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $200,00 | $219,50 |
| Core Processor | PowerPC G2 | — |
| Architecture | RISC 32-bit | — |
| Number of Cores | 1 | — |
| Core Clock Speed | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None (per datasheet) | — |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.25 µm CMOS | — |
| Encapsulado | 480-TBGA (37.5 x 37.5 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | [DATA_NEEDED: full operating temperature range] | — |
| Part Status | Not For New Designs (No Longer Manufactured) | — |
| Processor Type | — | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | — | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| Communications Processor Module (CPM) | — | Integrated (per PowerQUICC II architecture) |
| Encapsulado / Carcasa | — | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | — | Ball |
| Number of Terminals | — | 480 |
| Package Body Material | — | Plastic / Epoxy |
| Packaging | — | Tray |
| Manufacturer Lifecycle Source | — | NXP Semiconductors (Freescale/Motorola legacy) |
| Estado RoHS | — | [DATA_NEEDED: RoHS compliance] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Series | — | PowerQUICC II (PQ II HIP 3) |