MSC8156HAG1000B vs MSC8157TAG1000A Comparaison

Comparaison détaillée côte à côte de MSC8156HAG1000B par NXP Semiconductors et MSC8157TAG1000A par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Actif
NXP Semiconductors
MSC8157TAG1000A MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A ⚠ Dernier achat

Comparaison des spécifications

Paramètre MSC8156HAG1000B MSC8157TAG1000A
Marque NXP Semiconductors NXP Semiconductors
Catégorie DSP DSP
Statut du cycle de vie Actif Dernier achat
Statut du stock In Stock In Stock
Prix unitaire (USD) $198,75 $178,00
Product Type Multi-core Digital Signal Processor (DSP) —
DSP Cores 6 x StarCore SC3850 —
Core Clock Frequency 1 GHz per core —
On-chip RAM 576 KB (L1/L2 SRAM) —
On-chip ROM 96 KB —
Hardware Accelerator MAPLE-B (turbo/Viterbi FEC) —
External Memory Interface DDR2/DDR3 with ECC —
High-speed Serial Fabric 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 —
Ethernet 2 x Gigabit Ethernet (SGMII/RGMII) —
Queuing Engine Yes (QE for packet/traffic management) —
Peripheral Interfaces SPI, I2C, UART, PCI —
Process Technology CMOS —
Boîtier 783-ball FCBGA (FCP-BGA), 29 x 29 mm 783-FCPBGA (29x29 mm)
Type de montage Surface Mount —
Température de fonctionnement 0C to +105C -40C to +105C
Peak Reflow Temperature 245C (JEDEC J-STD-020) —
Terminal Finish Tin Silver Copper (e1 per JESD-609) —
Niveau MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED]
Statut RoHS Compliant (per distributor datasheet listing) [DATA_NEEDED]
Device Type — Six-core Digital Signal Processor (DSP)
DSP Architecture — StarCore SC3850 (6x cores)
Core Frequency — 1 GHz per core
L1 Instruction Cache — 32 KB per core
L1 Data Cache — 32 KB per core
Unified L2 Cache — 512 KB (configurable as M2 in 64 KB increments)
Accelerator — MAPLE-B2 baseband accelerator
Memory Controller — Dual-channel DDR2/DDR3 with ECC
High-Speed Serial I/O — 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI
Ball Pitch — 1.0 mm
Tension d'alimentation — [DATA_NEEDED: core/IO voltage]
MMU — Yes
Interrupt Controller — EPIC (Extended Programmable Interrupt Controller)
Timers — 2x 32-bit general-purpose per core

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