RTAX2000D-CQ352B vs RTAX2000D-1CQ352B Comparaison
Comparaison détaillée côte à côte de RTAX2000D-CQ352B par Microsemi et RTAX2000D-1CQ352B par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microsemi
RTAX2000D-CQ352B - 2M-Gate Rad-Tolerant FPGA, CQFP-352 | Microchip
RTAX2000D-CQ352B ✓ ActifMicrochip Technology
RTAX2000D-1CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000D-1CQ352B ✓ ActifComparaison des spécifications
| Paramètre | RTAX2000D-CQ352B | RTAX2000D-1CQ352B |
|---|---|---|
| Marque | Microsemi | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3 100,00 | $3 120,00 |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs | RTAX-S/SL and RTAX-DSP (RTAX2000D) |
| Equivalent System Gates | 2000000 | 2,000,000 |
| Logic Cells | 29568 | — |
| CLBs | 19712 | — |
| Core Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) | 1.5 V nominal (1.425 V to 1.575 V) |
| Process Technology | CMOS antifuse | — |
| Configuration Type | One-time programmable antifuse, live at power-up | — |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | Up to 540 kbits SRAM with optional EDAC |
| Clocking Features | Segmentable clocks, chip-wide highway routing | — |
| Arithmetic Support | Carry logic | — |
| Boîtier | CQFP-352 ceramic quad flat pack | 352-pin Ceramic Column Grid Array (CQ352) |
| Screening / Speed Grade | B (burn-in screening); D suffix = tighter ICCA limits at 125C final test | — |
| Type de montage | Surface Mount | Surface Mount (ceramic column grid array) |
| Application Domain | Space-flight systems | Space-flight, radiation-tolerant |
| Radiation Tolerance | Radiation-tolerant (TID/SEE per family datasheet) | — |
| Statut RoHS | [DATA_NEEDED: RoHS Status] | — |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature Range] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O Bank Supply Voltage] | — |
| Maximum User I/O | [DATA_NEEDED: Maximum User I/O Count] | — |
| Technology | — | Antifuse (nonvolatile), Digital CMOS |
| CLBs (Logic Cells) | — | 19,712 CLBs / 29,568 logic cells (per family organization) |
| DSP Mathblocks | — | Up to 120 (18-bit x 18-bit MAC) |
| DSP Performance | — | 125 MHz 18-bit x 18-bit multiply-accumulate |
| Total Ionizing Dose | — | 300 krad (Si) functional / 200 krad (Si) with operation |
| Speed Grade | — | -1 |
| Temperature Range | — | Commercial (C) |
| Configuration | — | Live at power-up, no external configuration device (antifuse) |
| Routing Features | — | Segmentable clocks, chip-wide highway routing, carry logic |
| Embedded SRAM Features | — | Built-in FIFO control logic |