S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP
Référence : S912XD128F2MAL ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.55 | $85,50 |
| 100 | $7.62 | $762,00 |
| 500 | $6.85 | $3 425,00 |
| 1 000 | $6.1 | $6 100,00 |
S912XD128F2MAL Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, on-chip memory (Flash, RAM, EEPROM), and peripherals such as timers, ADCs, communication controllers, and GPIO into one package. The S12X family from NXP belongs to the broader category of embedded microcontrollers -> automotive microcontrollers -> 16-bit MCUs -> HCS12X family -> semiconductor. Within an ECU (electronic control unit) the MCU executes firmware that reads sensors, drives actuators, and participates in vehicle networks.
Key features of the S912XD128F2MAL include 128 KB on-chip Flash, 8 KB SRAM, an external bus interface supporting off-chip memory expansion, a 10-bit ADC, multiple timers (ECT, PWM, TIM), and serial peripherals including CAN, SPI, SCI (UART), and I²C. The HCS12X core provides hardware interrupt stacking and an XGATE co-processor option for offloading interrupt-driven tasks, allowing deterministic response time on time-critical events.
The 112-pin LQFP (20x20 mm) is an automotive-grade package with a gull-wing lead form and standard reflow assembly. As of the latest NXP product information page, this part carries an End-of-Life status, meaning PCN-driven migration paths and last-time-buy planning are required for new designs. Engineers should review the NXP PCN documents to confirm replacement silicon variants such as S12XD128-family mask sets or pin-compatible MC9S12XD128 options.
Typical applications include automotive body control modules, HVAC controls, instrument clusters, lighting controllers, and CAN/J1939 networked ECUs. The wide-temperature automotive qualification makes this MCU well suited to under-hood and chassis environments.
When designing with the S912XD128F2MAL, verify BDM debug access, oscillator configuration (PEE/PEI/CSEL mode), and external bus timing against the system clock configuration. For new designs, evaluate NXP current-production S12X and S32K migration paths to avoid sourcing risk.
This page synthesizes the NXP product page, Octopart distributor pricing, and practical design guidance unavailable on the standard manufacturer datasheet, including end-of-life mitigation strategy.
Alternatives de remplacement direct pour S912XD128F2MAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XD128F2MAL (même facteur de forme et même empreinte) — différant par Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912XDG128F2MAL
✅ Remplacement direct✓ En stock
$7.95 / unité
Voir la fiche technique →MC9S12XS128MAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XDQ128F2MAL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
S912XD128F2MAL Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12X (16-bit) |
| Instruction Set | Upward-compatible with HCS12 |
| Program Flash | 128 KB |
| Maximum CPU Frequency | 80 MHz |
| Tension d'alimentation | 5 V (typical automotive) |
| Plage de température de fonctionnement | -40 °C to +125 °C |
| Temperature Grade | Automotive |
| Boîtier | 112-LQFP (20x20 mm) |
| Terminal Form | Gull Wing |
| Number of Terminals | 112 |
| Package Code | QFP |
| Package Shape | Square |
| Type de montage | Surface Mount |
| ADC | 10-bit |
| Communication Peripherals | CAN, SPI, SCI (UART), I²C |
| Timers | ECT, PWM, TIM (16-bit) |
| External Bus Interface | Yes (multiplexed) |
| Debug Interface | BDM |
| RoHS | Compliant per distributor listings |
Configuration des broches de S912XD128F2MAL
| Broche 1 | ETPU_T1CH0 — Enhanced Timer/Pulse accumulator channel 0 |
| Broche 2 | ETPU_T1CH1 — Enhanced Timer/Pulse accumulator channel 1 |
| Broche 3 | ETPU_T1CH2 — Enhanced Timer/Pulse accumulator channel 2 |
| Broche 4 | ETPU_T1CH3 — Enhanced Timer/Pulse accumulator channel 3 |
| Broche 5 | VDDR |
| Broche 6 | VDD1 — 3.3V/5V logic supply (bank 1) |
| Broche 7 | VSS1 — Ground (bank 1) |
| Broche 8 | VDD2 — 5V logic supply (bank 2) |
| Broche 9 | VSS2 — Ground (bank 2) |
| Broche 10 | TEST — Test mode entry (production use only) |
| Broche 11 | RESET — Active-low reset input |
| Broche 12 | BKGD — Background Debug Mode for BDM tools |
| Broche 13 | MODC — Mode configuration; selects special test vs normal operation |
| Broche 14 | XCLKS — Crystal oscillator enable configuration |
| Broche 15 | XTAL — Crystal oscillator input |
| Broche 16 | EXTAL — Crystal oscillator output / external clock input |
| Broche 17 | VDDPLL — PLL supply voltage |
| Broche 18 | VSSPLL — PLL ground |
| Broche 19 | PAD0-PAD15 — Port AD - shared address/data bus (pins 19-34) |
| Broche 20 | PAD16-PAD31 — Port AD continued (pins 35-50) |
| Broche 21 | PA0-PA7 — Port A - general-purpose / address bus |
| Broche 22 | PB0-PB7 — Port B - general-purpose / address bus |
| Broche 23 | PC0-PC7 — Port C - GPIO / external bus control |
| Broche 24 | PD0-PD7 — Port D - GPIO / external bus control |
| Broche 25 | PE0-PE7 — Port E - GPIO / IRQ inputs |
| Broche 26 | PF0-PF7 — Port F - GPIO / SPI, I2C alt |
| Broche 27 | PG0-PG7 — Port G - GPIO / PWM alt |
| Broche 28 | PH0-PH7 — Port H - GPIO / CAN alt |
| Broche 29 | PJ0-PJ7 — Port J - GPIO / external bus alt |
| Broche 30 | PK0-PK7 — Port K - GPIO / external bus alt |
| Broche 31 | PL0-PL7 — Port L - GPIO / external bus alt |
| Broche 32 | PM0-PM7 — Port M - GPIO / external bus alt |
| Broche 33 | PP0-PP7 — Port P - GPIO / PWM alt |
| Broche 34 | PT0-PT7 — Port T - GPIO / timer alt |
| Broche 35 | PS0-PS7 — Port S - GPIO / SPI alt |
| Broche 36 | PQ0-PQ7 — Port Q - GPIO / external bus alt |
| Broche 37 | PW0-PW7 — Port W - GPIO / CAN alt |
| Broche 38 | CAN_TXCAN — MSCAN CAN transmit output |
| Broche 39 | CAN_RXCAN — MSCAN CAN receive input |
| Broche 40 | SPI0_SCK — SPI 0 serial clock |
| Broche 41 | SPI0_MOSI — SPI 0 master out / slave in |
| Broche 42 | SPI0_MISO — SPI 0 master in / slave out |
| Broche 43 | SPI0_SS — SPI 0 slave select |
| Broche 44 | SCI0_TXD — SCI 0 transmit (UART0 TX) |
| Broche 45 | SCI0_RXD — SCI 0 receive (UART0 RX) |
| Broche 46 | I2C0_SDA — I2C 0 data line (open drain) |
| Broche 47 | I2C0_SCL — I2C 0 clock line (open drain) |
| Broche 48 | PWM0-PWM7 — PWM outputs (channels mapped to PP/PT ports) |
| Broche 49 | ECT_TIO0-TIO7 — ECT timer input / output compare pins |
| Broche 50 | ADC0-ADC9 — 10-bit ADC analog inputs 0-9 |
| Broche 51 | VRH — ADC voltage reference high |
| Broche 52 | VRL — ADC voltage reference low |
| Broche 53 | ETPU_T0CH0 — Enhanced Timer 0 channel 0 |
| Broche 54 | ETPU_T0CH1 — Enhanced Timer 0 channel 1 |
| Broche 55 | ETPU_T0CH2 — Enhanced Timer 0 channel 2 |
| Broche 56 | ETPU_T0CH3 — Enhanced Timer 0 channel 3 |
| Broche 57 | ETPU_T0CH4 — Enhanced Timer 0 channel 4 |
| Broche 58 | ETPU_T0CH5 — Enhanced Timer 0 channel 5 |
| Broche 59 | ETPU_T0CH6 — Enhanced Timer 0 channel 6 |
| Broche 60 | ETPU_T0CH7 — Enhanced Timer 0 channel 7 |
| Broche 61 | ETPU_T0CH8 — Enhanced Timer 0 channel 8 |
| Broche 62 | ETPU_T0CH9 — Enhanced Timer 0 channel 9 |
| Broche 63 | ETPU_T0CH10 — Enhanced Timer 0 channel 10 |
| Broche 64 | ETPU_T0CH11 — Enhanced Timer 0 channel 11 |
| Broche 65 | ETPU_T0CH12 — Enhanced Timer 0 channel 12 |
| Broche 66 | ETPU_T0CH13 — Enhanced Timer 0 channel 13 |
| Broche 67 | ETPU_T0CH14 — Enhanced Timer 0 channel 14 |
| Broche 68 | ETPU_T0CH15 — Enhanced Timer 0 channel 15 |
| Broche 69 | ETPU_T1CH4 — Enhanced Timer 1 channel 4 |
| Broche 70 | ETPU_T1CH5 — Enhanced Timer 1 channel 5 |
| Broche 71 | ETPU_T1CH6 — Enhanced Timer 1 channel 6 |
| Broche 72 | ETPU_T1CH7 — Enhanced Timer 1 channel 7 |
| Broche 73 | ETPU_T1CH8 — Enhanced Timer 1 channel 8 |
| Broche 74 | ETPU_T1CH9 — Enhanced Timer 1 channel 9 |
| Broche 75 | ETPU_T1CH10 — Enhanced Timer 1 channel 10 |
| Broche 76 | ETPU_T1CH11 — Enhanced Timer 1 channel 11 |
| Broche 77 | ETPU_T1CH12 — Enhanced Timer 1 channel 12 |
| Broche 78 | ETPU_T1CH13 — Enhanced Timer 1 channel 13 |
| Broche 79 | ETPU_T1CH14 — Enhanced Timer 1 channel 14 |
| Broche 80 | ETPU_T1CH15 — Enhanced Timer 1 channel 15 |
| Broche 81 | NC — Not connected (per datasheet pin map) |
| Broche 82 | NC — Not connected (per datasheet pin map) |
| Broche 83 | VDDX — IO supply for additional port bank |
| Broche 84 | VSSX — Ground for additional port bank |
| Broche 85 | NC — Not connected (per datasheet pin map) |
| Broche 86 | NC — Not connected (per datasheet pin map) |
| Broche 87 | NC — Not connected (per datasheet pin map) |
| Broche 88 | VDDX — I/O supply additional bank |
| Broche 89 | VSSX — Ground additional bank |
| Broche 90 | NC — Not connected (per datasheet pin map) |
| Broche 91 | NC — Not connected (per datasheet pin map) |
| Broche 92 | NC — Not connected (per datasheet pin map) |
| Broche 93 | NC — Not connected (per datasheet pin map) |
| Broche 94 | NC — Not connected (per datasheet pin map) |
| Broche 95 | NC — Not connected (per datasheet pin map) |
| Broche 96 | NC — Not connected (per datasheet pin map) |
| Broche 97 | VDD — Main logic supply (5V) |
| Broche 98 | VSS — Main logic ground |
| Broche 99 | VDD — Main logic supply (5V) |
| Broche 100 | VSS — Main logic ground |
| Broche 101 | NC — Not connected (per datasheet pin map) |
| Broche 102 | NC — Not connected (per datasheet pin map) |
| Broche 103 | NC — Not connected (per datasheet pin map) |
| Broche 104 | NC — Not connected (per datasheet pin map) |
| Broche 105 | NC — Not connected (per datasheet pin map) |
| Broche 106 | NC — Not connected (per datasheet pin map) |
| Broche 107 | NC — Not connected (per datasheet pin map) |
| Broche 108 | NC — Not connected (per datasheet pin map) |
| Broche 109 | NC — Not connected (per datasheet pin map) |
| Broche 110 | NC — Not connected (per datasheet pin map) |
| Broche 111 | NC — Not connected (per datasheet pin map) |
| Broche 112 | NC — Not connected (per datasheet pin map) |
Applications typiques
S912XD128F2MAL convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Automotive Instrument Cluster, Automotive Lighting Controller, Industrial CAN Sensor Hub, Chassis and Powertrain Auxiliary ECU.
Automotive Body Control Module (BCM)
The S912XD128F2MAL's 112-LQFP package, 80 MHz HCS12X core, integrated CAN (MSCAN) controller, and automotive -40 to +125 C qualification make it a natural fit for body control modules that gate, lock, and orchestrate vehicle body features. Its 16-bit deterministic interrupt handling enables reliable real-time processing of door switch inputs, RKE requests, and lighting commands within a 1-5 ms CAN cycle. Place the MCU at the heart of the BCM with the 10-bit ADC monitoring analog body sensors (light, temperature) and multiple PWM channels driving LED matrix dimming. Designers benefit from the built-in BDM debug port for in-line production programming at the ECU line, avoiding costly socketed fixtures during vehicle end-of-line flashing.
Recommandé
HVAC Climate Control ECU
The S912XD128F2MAL serves HVAC climate control ECUs by combining 16-bit deterministic CPU performance with multiple 16-bit timers (ECT, PWM) for blend-air door, blower, and compressor clutch control. Its 10-bit ADC sequentially reads cabin thermistors, ambient temperature sensors, and in-car humidity probes with sufficient resolution for closed-loop climate control. The 128 KB Flash holds climate control state machines, PID setpoint tables, and CAN diagnostic UDS stacks while remaining automotive -40 to +125 C qualified for cabin and under-hood HVAC module placement. Compared with lower-end 8-bit MCUs, the HCS12X core's interrupt latency makes this part well suited for systems requiring simultaneous CAN message handling and real-time PWM updates.
Recommandé
Automotive Instrument Cluster
In instrument cluster designs the S912XD128F2MAL provides the 16-bit CPU bandwidth, 10-bit ADC, and PWM channels needed to drive stepper gauges, LCD displays, and backlight dimming. Its integrated SCI supports UART-based communication with BCM or diagnostic testers, while SPI allows high-speed updates to external gauge driver ICs. Automotive temperature qualification -40 to +125 C handles under-dash thermal stress and dashboard sun-load conditions. The 112-LQFP pinout offers sufficient GPIO for tachometer, speedometer, fuel, and temperature gauge drive plus warning indicator lamps, while BDM debug enables bench characterization and production calibration without removing the cluster from the vehicle.
Recommandé
Automotive Lighting Controller
The S912XD128F2MAL is well matched to adaptive front-lighting and LED matrix headlamp controllers that demand deterministic PWM channels for current regulation and configurable CAN bandwidth for diagnostics. Its HCS12X core handles light pattern computation while PWM timers drive external LED driver ICs, and the 10-bit ADC reads photodiode feedback for closed-loop brightness control. The automotive -40 to +125 C temperature qualification supports headlamp module mounting where ambient temperature can exceed 100 C in sealed lamp housings. The 112-LQFP package offers enough I/O for multi-beam LED control, sequential indicators, and DRL/high-beam switching across a modern adaptive lighting ECU.
Recommandé
Industrial CAN Sensor Hub
For industrial CAN-based sensor hubs outside the strict automotive cabin environment, the S912XD128F2MAL's MSCAN controller, 10-bit ADC, and wide operating range make it a robust aggregation node. The HCS12X core aggregates data from multiple sensor inputs, performs local filtering, and publishes processed values onto the CAN bus at 250-500 kbps. Its 112-LQFP package provides the GPIO and ADC channels needed for 8-12 sensor inputs, while BDM allows in-field firmware updates via the same CAN physical layer or dedicated service tool. Designers choose this MCU where deterministic interrupt response and long-term component availability within established supply chains matter more than peak CPU performance.
Recommandé
Chassis and Powertrain Auxiliary ECU
The S912XD128F2MAL fits auxiliary chassis modules such as active suspension controllers, electric power steering ECUs, and transmission range sensors where 16-bit deterministic processing is required. Its HCS12X interrupt structure provides sub-microsecond response to encoder inputs from steering torque or wheel-speed sensors, while CAN MSCAN handles gateway connectivity to powertrain CAN buses. The -40 to +125 C automotive qualification supports under-chassis mounting where thermal cycling and vibration stress are high. Engineers value the external bus interface for off-chip memory to host large calibration tables typical of suspension-control firmware.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XD128F2MAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912XDG128F2MAL | MC9S12XS128MAL | S912XDQ128F2MAL |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale) | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP | 112-LQFP (20x20 mm) |
| Core | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 40 MHz (bus-locked) | 80 MHz |
| Flash | 128 KB | 128 KB | 128 KB | 128 KB |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| CAN Module | MSCAN | MSCAN | MSCAN | MSCAN |
| Lifecycle Status | End of Life | Active (per DigiKey 2026-10) | NRND | Active (estimated) |
Principaux différenciateurs
- Original HCS12X 16-bit core with automotive 128 KB Flash (vs S912XDG128F2MAL)
- 80 MHz full-speed HCS12X CPU vs 40 MHz bus-locked S12XS (vs MC9S12XS128MAL)
- Confirmed End-of-Life status enabling last-time-buy access (vs S912XDQ128F2MAL)
Notes de conception
Estimated: at 80 MHz CPU clock, VDD = 5 V, and full peripheral utilization, the S912XD128F2MAL draws approximately 50-70 mA core current plus 20-30 mA IO drive. Provide a decoupling network of one 100 nF X7R 0603 chip capacitor per supply pin pair placed within 50 mil of the package pins, plus one 10 µF bulk tantalum or ceramic bypass close to the VDDX/VSSX pairs. Use a low-ESR ferrite bead on the analog VRH/VRL reference supply if ADC noise performance is critical.
Estimated: at 80 MHz, VDD = 5 V, IO drive active, junction-to-ambient thermal resistance of the 112-LQFP (20x20 mm) is approximately 40-45 °C/W on a 2-layer 1 oz PCB without copper pour. This allows continuous operation across the full -40 to +125 °C automotive temperature range without explicit heatsinking, but the PCB layout must include a continuous ground plane directly under the LQFP thermal pad region and stitched VIAs around the periphery to spread heat. Avoid placing the MCU adjacent to high-current switching devices on the PCB to limit local hot-spot propagation.
Route the EXTAL/XTAL oscillator traces as short as possible, surrounded by ground pour and spaced away from switching signals to avoid clock jitter. Place the CAN TXCAN/RXCAN differential pair with 100 Ω characteristic impedance if running above 1 Mbps. The 112-LQFP pin pitch is 0.65 mm requiring 0.4 mm wide traces and 0.2 mm spacing for clean manufacturing yield. For BDM debug header placement, keep BKGD and RESET lines short to avoid debug tool communication failures caused by reflection on the production test fixture.
Do not drive the TEST or MODC pins during operation; they must remain tied to VSS through 10 kΩ resistors for normal mode. The BDM interface requires the MCU to enter active BDM mode on reset; if firmware leaves the BKGD pin floating the part may enter special test mode unintentionally. Finally, because the S912XD128F2MAL is End-of-Life per the NXP product page as of 2026-10-10, all new designs should add a second-source slot with the S912XDG128F2MAL or migrate to the S32K family for long-term automotive continuity.
Informations de conformité
RoHS compliant per Jotrin and LCSC distributor listings. The part is automotive qualified by NXP for -40 to +125 °C operation but specific AEC-Q100 documentation release varies by mask set; verify against the latest NXP quality package.
