XPC8260CVVIFBC vs MPC8260AZUPJDB Comparaison
Comparaison détaillée côte à côte de XPC8260CVVIFBC par NXP Semiconductors et MPC8260AZUPJDB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ ActifNXP Semiconductors
MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPC8260AZUPJDB ⚠ Dernier achatComparaison des spécifications
| Paramètre | XPC8260CVVIFBC | MPC8260AZUPJDB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $219,50 | $165,00 |
| Processor Type | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) | — |
| Core Architecture | PowerPC G2, 1 Core, 32-Bit | — |
| CPU Clock Speed | 200 MHz | — |
| Core Supply Voltage | 2.5 V | 1.9 V to 2.2 V |
| Communications Processor Module (CPM) | Integrated (per PowerQUICC II architecture) | Integrated (FCC, SCC, SMC) |
| Boîtier / Format | 480-LBGA (TBGA), 37.5 x 37.5 mm | — |
| Terminal Form | Ball | — |
| Number of Terminals | 480 | — |
| Package Body Material | Plastic / Epoxy | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | Tray |
| Manufacturer Lifecycle Source | NXP Semiconductors (Freescale/Motorola legacy) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | unknown |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Series | PowerQUICC II (PQ II HIP 3) | PowerQUICC II (MPC8260A HiP4) |
| Manufacturer | — | NXP Semiconductors |
| Core | — | PowerPC G2, single core |
| Largeur du bus de données | — | 32-bit |
| Fréquence d'horloge maximale | — | 300 MHz |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| I/O Supply Voltage | — | 3.3 V |
| Process Technology | — | 0.25 micrometer CMOS (HiP4) |
| Boîtier | — | 480-TBGA (37.5 x 37.5 mm) |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| External Bus | — | 60x bus, 64-bit data |
| Lifecycle | — | End-of-Life / Last Time Buy (per NXP PCN) |