XPC8260CVVIFBC vs MPC8260AZUPJDB Comparación
Comparación detallada lado a lado de XPC8260CVVIFBC por NXP Semiconductors y MPC8260AZUPJDB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
XPC8260CVVIFBC ✓ ActivoNXP Semiconductors
MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPC8260AZUPJDB ⚠ Última compraComparación de especificaciones
| Parámetro | XPC8260CVVIFBC | MPC8260AZUPJDB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $219,50 | $165,00 |
| Processor Type | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) | — |
| Core Architecture | PowerPC G2, 1 Core, 32-Bit | — |
| CPU Clock Speed | 200 MHz | — |
| Core Supply Voltage | 2.5 V | 1.9 V to 2.2 V |
| Communications Processor Module (CPM) | Integrated (per PowerQUICC II architecture) | Integrated (FCC, SCC, SMC) |
| Encapsulado / Carcasa | 480-LBGA (TBGA), 37.5 x 37.5 mm | — |
| Terminal Form | Ball | — |
| Number of Terminals | 480 | — |
| Package Body Material | Plastic / Epoxy | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | Tray |
| Manufacturer Lifecycle Source | NXP Semiconductors (Freescale/Motorola legacy) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | unknown |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Series | PowerQUICC II (PQ II HIP 3) | PowerQUICC II (MPC8260A HiP4) |
| Manufacturer | — | NXP Semiconductors |
| Core | — | PowerPC G2, single core |
| Ancho del bus de datos | — | 32-bit |
| Frecuencia de reloj máxima | — | 300 MHz |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| I/O Supply Voltage | — | 3.3 V |
| Process Technology | — | 0.25 micrometer CMOS (HiP4) |
| Encapsulado | — | 480-TBGA (37.5 x 37.5 mm) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| External Bus | — | 60x bus, 64-bit data |
| Lifecycle | — | End-of-Life / Last Time Buy (per NXP PCN) |