10AS032E3F29I2SG - Arria 10 SX SoC FPGA 320K LE | Intel
Référence : 10AS032E3F29I2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1725 | $17 250,00 |
| 100 | $1560 | $156 000,00 |
| 500 | $1410 | $705 000,00 |
| 1 000 | $1295 | $1 295 000,00 |
10AS032E3F29I2SG Présentation
An SoC FPGA is a hybrid device that couples a general-purpose processor subsystem with a reconfigurable logic fabric on a single die, allowing deterministic hardware acceleration alongside software control. Within the broader taxonomy this places the Arria 10 SX in the embedded FPGA / SoC category (system on chip -> programmable logic device -> semiconductor), differentiating it from pure soft-core FPGAs that rely on external processors and from standalone ASICs that cannot be reconfigured after tape-out.
Key differentiating features include the dual ARM Cortex-A9 MPCore with CoreSight, up to approximately 1.5 GHz core frequency per HPS, integrated high-speed transceivers for multi-gigabit serial I/O, dedicated fractional PLLs, and on-chip hard memory controllers. These elements make the part well suited for applications needing simultaneous compute throughput and deterministic hardware pipelines such as wireless baseband, industrial vision, and protocol bridging. The 780-pin FC-FBGA with flip-chip interconnect supports the high I/O density and signal-integrity margins required by multi-gigabit transceivers.
Architecturally, the Arria 10 SX pairs the HPS (L2 cache, SDRAM controllers, peripherals) over a coherent backbone with the FPGA fabric. This co-location reduces system latency versus a discrete CPU-plus-FPGA design and simplifies PCB layout. Designers should pay attention to multi-rail sequencing requirements, transceiver reference-clock jitter, and thermal management given the 20nm power density at sustained workload. Configuration is via the Quartus Prime toolchain, which supports IP catalog integration, HPS firmware (typically U-boot plus Linux), and standard JTAG/AS configuration paths.
Typical applications include wireless infrastructure (small-cell baseband, fronthaul), industrial machine vision, military/aerospace signal processing, and test-and-measurement digitizer back-ends. When designing with this device, plan for multi-rail power-up sequencing, route HPS DDR traces with matched impedance, and verify transceiver channel compliance against the protocol standard required. This page consolidates distributor pricing, OPN-decoded variants, and practical design context not found in the bare datasheet.
Alternatives de remplacement direct pour 10AS032E3F29I2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS032E3F29I2SG (même facteur de forme et même empreinte) — différant par Package, Operating Temperature Grade, Mounting Type, Family, DSP Blocks.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS032E2F29I2SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS032E3F29I2LG
✅ Remplacement direct✓ En stock
$1390 / unité
Voir la fiche technique →10AS032E3F29I1SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS032H3F29E2SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AX032E3F29I2SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS032E3F29I2SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 SX SoC FPGA |
| Device Variant | 10AS032 |
| Logic Elements | 320,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Logic Voltage | 0.9 V |
| Boîtier | 780-pin FC-FBGA (F29), 29 x 29 mm |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Statut RoHS | Compliant |
| Configuration | JTAG / Active Serial (AS) via Quartus Prime |
| Ordering Code Speed Grade | E3 (transceiver / logic speed grade) |
| Lead-Free | Yes |
Guide de configuration des broches du 10AS032E3F29I2SG 780-pin fc-fbga (f29), 29 x 29 mm
Configuration des broches du 10AS032E3F29I2SG (boîtier 780-pin fc-fbga (f29), 29 x 29 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS032E3F29I2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS032E3F29I2SG convient pour 6 applications: Wireless Infrastructure / Small-Cell Baseband, Industrial Machine Vision Systems, Test & Measurement Digitizer Back-End, Aerospace & Defense Signal Processing, Industrial Protocol Bridging / Motor Control, Edge AI / Sensor Fusion Hubs.
Wireless Infrastructure / Small-Cell Baseband
The 10AS032E3F29I2SG fits wireless infrastructure applications because the dual ARM Cortex-A9 HPS runs the LTE/5G protocol stack and PHY control plane, while the FPGA fabric accelerates the baseband DSP (FFT, channel estimation, crest-factor reduction) at sample rate. The 320K logic elements accommodate multi-antenna processing with low latency, and the integrated multi-gigabit transceivers interface directly to CPRI/eCPRI fronthaul or backhaul SFP+/SFP28. Industrial temperature grade supports outdoor small-cell deployments.
Recommandé
Industrial Machine Vision Systems
For factory-floor machine vision, the 10AS032E3F29I2SG pairs an HPS running the camera stack and Linux with FPGA fabric performing pixel-pipeline pre-processing at line rate. The 320K logic elements handle Bayer demosaic, lens distortion correction, and feature extraction for high-resolution area-scan cameras. The 780-pin FC-FBGA exposes abundant GPIO and transceiver pairs for CoaXPress 2.0 / 10GigE Vision links, while industrial -40C to +100C operation tolerates factory environments.
Recommandé
Test & Measurement Digitizer Back-End
In high-channel-count oscilloscopes, spectrum analyzers, and protocol analyzers, the 10AS032E3F29I2SG provides the deterministic hardware pipeline needed for waveform triggering, real-time FFT, and protocol decoding at multi-GS/s rates. The HPS hosts the UI, network stack, and SCPI command parser, while the FPGA fabric drives ADC/DAC interfaces, PCIe Gen3 root complex, and trigger engines. Industrial temperature grade supports lab and field environments with controlled airflow.
Recommandé
Aerospace & Defense Signal Processing
Defense signal-intelligence, radar preprocessing, and electronic-warfare subsystems benefit from the 10AS032E3F29I2SG's combination of HPS for mission control, FPGA fabric for beamforming FFTs, and high-speed transceivers for ADC/DAC data links. The industrial temperature grade and 20nm process deliver predictable timing margins. For radiation-hardened designs, screen the lot and add mitigation IP; for benign environments, the SX device is fully deployable.
Recommandé
Industrial Protocol Bridging / Motor Control
The 10AS032E3F29I2SG supports deterministic protocol bridging between industrial Ethernet (EtherCAT, PROFINET), legacy fieldbuses, and motion-control servos. The HPS handles the real-time OS stack, while the FPGA fabric implements the deterministic cycle engine and EtherCAT distributed-clock (DC) synchronization with sub-microsecond jitter. With 320K logic elements, multiple protocol stacks can coexist on one device, reducing system BOM cost.
Recommandé
Edge AI / Sensor Fusion Hubs
For edge-AI inference and sensor-fusion gateways, the 10AS032E3F29I2SG combines ARM Cortex-A9 Linux hosting (TensorFlow Lite, ONNX Runtime) with FPGA acceleration of pre-processing pipelines (DNN layer 1, FFT, FIR, sensor DSP). The HPS handles Ethernet/Wi-Fi host links and time-series logging, while FPGA fabric performs low-latency sensor fusion at line rate. Industrial temperature grade supports outdoor and factory deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS032E3F29I2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS032E2F29I2SG | 10AS032E3F29I2LG | 10AS032E3F29I1SG | 10AS032H3F29E2SG | 10AX032E3F29I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-pin FC-FBGA (F29), 29x29 mm | 780-pin FC-FBGA (F29) - same | 780-pin FC-FBGA (F29) - same | 780-pin FC-FBGA (F29) - same | 780-pin FC-FBGA (F29) - same | 780-pin FC-FBGA (F29) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | None (logic-only FPGA) |
| Speed Grade | E3 | E2 (slower) | E3 (same) | E3 (same) | H3 (faster, enhanced) | E3 (same) |
| Temperature Grade | Industrial -40C to +100C (I2) | Industrial -40C to +100C (I2) | Industrial -40C to +100C (I2) | Industrial -40C to +85C (I1) | Commercial/Industrial E2 | Industrial -40C to +100C (I2) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| RoHS / Lead-Free | RoHS compliant / Lead-free | RoHS compliant / Lead-free | RoHS compliant / Lead-free (LG suffix) | RoHS compliant / Lead-free | RoHS compliant / Lead-free | RoHS compliant / Lead-free |
Principaux différenciateurs
- Drop-in same-package speed-grade flexibility (vs 10AS032E2F29I2SG)
- Industrial-grade upper temperature (vs 10AS032E3F29I1SG)
- Hardened HPS over soft-core implementations (vs 10AX032E3F29I2SG)
Notes de conception
The 10AS032E3F29I2SG requires multiple supply rails (0.9 V core, 1.1/1.2 V transceiver, 1.8 V/2.5 V/3.3 V I/O, HPS dedicated rails). Follow Intel's power-tree sequence in the Arria 10 GX/SX Device Family Pin Connection Guidelines: bring up core before HPS supplies, and respect monotonic ramp. Estimated: at 320K LE utilization around 60-70%, expect 8-12 W from core plus 1-3 W per active transceiver channel - verify against Quartus Prime PowerPlay early.
Estimated: at 8-12 W core dissipation in the 29x29 mm FC-FBGA with theta_JA in the 12-18 C/W range (still air, JEDEC test board), junction temperature can approach 100C without airflow. Add 200-400 LFM forced-air cooling or a heatsink with thermal interface material. Confirm with Quartus thermal analysis on your actual utilization vector; industrial-grade parts must keep Tj under +100C.
Use a 14-16 layer PCB with dedicated ground and power planes. Match DDR3 trace impedance to 50 ohm single-ended / 100 ohm differential and length-match within 50 mil for HPS external SDRAM. Keep HPS JTAG traces short and length-matched if you use the TRACE debugging interface. Recommended: a minimum 8-layer stack-up with 1 oz copper on outer layers for thermal spreading.
Multi-gigabit transceivers are sensitive to reference-clock jitter; place a low-jitter crystal or jitter-cleaner (e.g. Silicon Labs Si5341) within 50 mm of the REFCLK pins. Verify return-loss and crosstalk with 3D EM simulation at the BGA breakout. Per the Arria 10 SX Device Datasheet, RX/TX serial data rates up to 12.5 Gbps (varies by transceiver block) require controlled-impedance stripline routing.
Common pitfalls with the 10AS032E3F29I2SG: (1) attempting to substitute 10AX032 (no HPS) without re-validating pinout, (2) ignoring I2 vs I1 temperature grade differences, (3) underestimating HPS DDR trace-matching, (4) omitting configuration mode jumpers for AS vs JTAG, and (5) choosing the wrong speed grade (E2 vs E3 vs H3). Always re-run Quartus Prime fitter and timing analysis after any OPN change.
Informations de conformité
RoHS and lead-free compliance per Intel/Altera product page. AEC-Q100 not applicable (industrial FPGA, not automotive-qualified). REACH and conflict-minerals statements follow Intel's published policies.
