10AS032E3F29I2SG - Arria 10 SX SoC FPGA 320K LE | Intel
MPN: 10AS032E3F29I2SG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1560 | $156,000.00 |
| 500 | $1410 | $705,000.00 |
| 1,000 | $1295 | $1,295,000.00 |
Drop-in alternatives for 10AS032E3F29I2SG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10AS032E2F29I2SG
β Drop-Inπ Reference alternative (not in catalog)
10AS032E3F29I2LG
β Drop-Inβ In Stock
$1390 / Unit
View Datasheet β10AS032E3F29I1SG
β Drop-Inπ Reference alternative (not in catalog)
10AS032H3F29E2SG
β Drop-Inπ Reference alternative (not in catalog)
10AX032E3F29I2SG
β Drop-Inπ Reference alternative (not in catalog)
10AS032E3F29I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Device Variant | 10AS032 |
| Logic Elements | 320,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Logic Voltage | 0.9 V |
| Package | 780-pin FC-FBGA (F29), 29 x 29 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
| Configuration | JTAG / Active Serial (AS) via Quartus Prime |
| Ordering Code Speed Grade | E3 (transceiver / logic speed grade) |
| Lead-Free | Yes |
10AS032E3F29I2SG 780-pin fc-fbga (f29), 29 x 29 mm Pin Configuration Guide
Complete pinout information for 10AS032E3F29I2SG (780-pin fc-fbga (f29), 29 x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032E3F29I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032E3F29I2SG is suitable for 6 applications: Wireless Infrastructure / Small-Cell Baseband, Industrial Machine Vision Systems, Test & Measurement Digitizer Back-End, Aerospace & Defense Signal Processing, Industrial Protocol Bridging / Motor Control, Edge AI / Sensor Fusion Hubs.
Wireless Infrastructure / Small-Cell Baseband
The 10AS032E3F29I2SG fits wireless infrastructure applications because the dual ARM Cortex-A9 HPS runs the LTE/5G protocol stack and PHY control plane, while the FPGA fabric accelerates the baseband DSP (FFT, channel estimation, crest-factor reduction) at sample rate. The 320K logic elements accommodate multi-antenna processing with low latency, and the integrated multi-gigabit transceivers interface directly to CPRI/eCPRI fronthaul or backhaul SFP+/SFP28. Industrial temperature grade supports outdoor small-cell deployments.
Recommended
Industrial Machine Vision Systems
For factory-floor machine vision, the 10AS032E3F29I2SG pairs an HPS running the camera stack and Linux with FPGA fabric performing pixel-pipeline pre-processing at line rate. The 320K logic elements handle Bayer demosaic, lens distortion correction, and feature extraction for high-resolution area-scan cameras. The 780-pin FC-FBGA exposes abundant GPIO and transceiver pairs for CoaXPress 2.0 / 10GigE Vision links, while industrial -40C to +100C operation tolerates factory environments.
Recommended
Test & Measurement Digitizer Back-End
In high-channel-count oscilloscopes, spectrum analyzers, and protocol analyzers, the 10AS032E3F29I2SG provides the deterministic hardware pipeline needed for waveform triggering, real-time FFT, and protocol decoding at multi-GS/s rates. The HPS hosts the UI, network stack, and SCPI command parser, while the FPGA fabric drives ADC/DAC interfaces, PCIe Gen3 root complex, and trigger engines. Industrial temperature grade supports lab and field environments with controlled airflow.
Recommended
Aerospace & Defense Signal Processing
Defense signal-intelligence, radar preprocessing, and electronic-warfare subsystems benefit from the 10AS032E3F29I2SG's combination of HPS for mission control, FPGA fabric for beamforming FFTs, and high-speed transceivers for ADC/DAC data links. The industrial temperature grade and 20nm process deliver predictable timing margins. For radiation-hardened designs, screen the lot and add mitigation IP; for benign environments, the SX device is fully deployable.
Recommended
Industrial Protocol Bridging / Motor Control
The 10AS032E3F29I2SG supports deterministic protocol bridging between industrial Ethernet (EtherCAT, PROFINET), legacy fieldbuses, and motion-control servos. The HPS handles the real-time OS stack, while the FPGA fabric implements the deterministic cycle engine and EtherCAT distributed-clock (DC) synchronization with sub-microsecond jitter. With 320K logic elements, multiple protocol stacks can coexist on one device, reducing system BOM cost.
Recommended
Edge AI / Sensor Fusion Hubs
For edge-AI inference and sensor-fusion gateways, the 10AS032E3F29I2SG combines ARM Cortex-A9 Linux hosting (TensorFlow Lite, ONNX Runtime) with FPGA acceleration of pre-processing pipelines (DNN layer 1, FFT, FIR, sensor DSP). The HPS handles Ethernet/Wi-Fi host links and time-series logging, while FPGA fabric performs low-latency sensor fusion at line rate. Industrial temperature grade supports outdoor and factory deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032E3F29I2SG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032E2F29I2SG | 10AS032E3F29I2LG | 10AS032E3F29I1SG | 10AS032H3F29E2SG | 10AX032E3F29I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-pin FC-FBGA (F29), 29x29 mm | 780-pin FC-FBGA (F29) - same | 780-pin FC-FBGA (F29) - same | 780-pin FC-FBGA (F29) - same | 780-pin FC-FBGA (F29) - same | 780-pin FC-FBGA (F29) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | None (logic-only FPGA) |
| Speed Grade | E3 | E2 (slower) | E3 (same) | E3 (same) | H3 (faster, enhanced) | E3 (same) |
| Temperature Grade | Industrial -40C to +100C (I2) | Industrial -40C to +100C (I2) | Industrial -40C to +100C (I2) | Industrial -40C to +85C (I1) | Commercial/Industrial E2 | Industrial -40C to +100C (I2) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| RoHS / Lead-Free | RoHS compliant / Lead-free | RoHS compliant / Lead-free | RoHS compliant / Lead-free (LG suffix) | RoHS compliant / Lead-free | RoHS compliant / Lead-free | RoHS compliant / Lead-free |
Key Differentiators
- Drop-in same-package speed-grade flexibility (vs 10AS032E2F29I2SG)
- Industrial-grade upper temperature (vs 10AS032E3F29I1SG)
- Hardened HPS over soft-core implementations (vs 10AX032E3F29I2SG)
Design Notes
The 10AS032E3F29I2SG requires multiple supply rails (0.9 V core, 1.1/1.2 V transceiver, 1.8 V/2.5 V/3.3 V I/O, HPS dedicated rails). Follow Intel's power-tree sequence in the Arria 10 GX/SX Device Family Pin Connection Guidelines: bring up core before HPS supplies, and respect monotonic ramp. Estimated: at 320K LE utilization around 60-70%, expect 8-12 W from core plus 1-3 W per active transceiver channel - verify against Quartus Prime PowerPlay early.
Estimated: at 8-12 W core dissipation in the 29x29 mm FC-FBGA with theta_JA in the 12-18 C/W range (still air, JEDEC test board), junction temperature can approach 100C without airflow. Add 200-400 LFM forced-air cooling or a heatsink with thermal interface material. Confirm with Quartus thermal analysis on your actual utilization vector; industrial-grade parts must keep Tj under +100C.
Use a 14-16 layer PCB with dedicated ground and power planes. Match DDR3 trace impedance to 50 ohm single-ended / 100 ohm differential and length-match within 50 mil for HPS external SDRAM. Keep HPS JTAG traces short and length-matched if you use the TRACE debugging interface. Recommended: a minimum 8-layer stack-up with 1 oz copper on outer layers for thermal spreading.
Multi-gigabit transceivers are sensitive to reference-clock jitter; place a low-jitter crystal or jitter-cleaner (e.g. Silicon Labs Si5341) within 50 mm of the REFCLK pins. Verify return-loss and crosstalk with 3D EM simulation at the BGA breakout. Per the Arria 10 SX Device Datasheet, RX/TX serial data rates up to 12.5 Gbps (varies by transceiver block) require controlled-impedance stripline routing.
Common pitfalls with the 10AS032E3F29I2SG: (1) attempting to substitute 10AX032 (no HPS) without re-validating pinout, (2) ignoring I2 vs I1 temperature grade differences, (3) underestimating HPS DDR trace-matching, (4) omitting configuration mode jumpers for AS vs JTAG, and (5) choosing the wrong speed grade (E2 vs E3 vs H3). Always re-run Quartus Prime fitter and timing analysis after any OPN change.
Compliance Information
RoHS and lead-free compliance per Intel/Altera product page. AEC-Q100 not applicable (industrial FPGA, not automotive-qualified). REACH and conflict-minerals statements follow Intel's published policies.
