N25Q512A13GSFA0F - 512Mb SPI NOR Flash 108MHz | Micron
Référence : N25Q512A13GSFA0F ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.45 | $7,45 |
| 10 | $6.85 | $68,50 |
| 100 | $6.25 | $625,00 |
| 500 | $5.8 | $2 900,00 |
| 1 000 | $5.35 | $5 350,00 |
N25Q512A13GSFA0F Présentation
Serial NOR flash is a non-volatile memory technology that stores code and data while retaining contents without power. Within the memory hierarchy it sits as the boot and code-storage device in embedded systems, feeding instructions to MCUs, SoCs, FPGAs, and networking processors. The SPI (Serial Peripheral Interface) bus reduces pin count and board area compared to parallel NOR, while multiple I/O (Single, Dual, Quad) and DTR modes multiply effective bandwidth.
Key features of the N25Q512A13GSFA0F include 512Mb density organized as 512M/256M/128M x 1/2/4-bit, a 2.7V to 3.6V single supply voltage, 4KB sector erase granularity for efficient code updates, and an operating temperature range of -40C to +125C suitable for automotive and industrial environments. The device is constructed as a stacked pair of two 256Mb die.
Architecturally, the device supports Standard, Dual Output, Dual I/O, Quad Output, Quad I/O, and DTR protocols, achieving a 7ns access performance class at full clock speed. Enhanced features such as subsector erase and execute-in-place (XIP) support allow direct code execution from the flash array.
Typical applications include automotive infotainment and ADAS boot code storage, networking equipment configuration memory, and industrial FPGA/MCU firmware storage where high density and -40C to +125C operation are required.
Design consideration: manage the 4KB sector erase latency in firmware by pre-erasing blocks during idle time; also verify signal integrity on SCK at 108 MHz with proper series termination and short traces.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour N25Q512A13GSFA0F — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec N25Q512A13GSFA0F (même facteur de forme et même empreinte) — différant par Interface, Memory Type, Organization, Package, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
N25Q512A13GSF40G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT25QL512ABB1EW9-0SIT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
W25Q512JV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
N25Q512A13GSFA0F Valeurs maximales et caractéristiques électriques
| Type de mémoire | SPI NOR Flash (Multiple I/O) |
| Density | 512 Mbit (64 MByte) |
| Organisation de la mémoire | 512M/256M/128M x 1Bit/2Bit/4Bit |
| Interface | SPI-compatible serial bus |
| Max Clock Frequency (STR) | 108 MHz |
| Max Clock Frequency (DTR) | 54 MHz |
| Tension d'alimentation | 2.7 V to 3.6 V |
| Sector Erase Size | 4 KB |
| Access Time | 7 ns |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 16-Pin SOIC (SOP-II 16/16) |
| Type de montage | Surface Mount |
| Construction | Stacked device (two 256Mb die) |
| Protocols | Standard, Dual Output, Dual I/O, Quad Output, Quad I/O, DTR |
| Packaging | Tape & Reel (T/R) |
| Temperature Grade | Automotive |
| Statut RoHS | unknown |
Configuration des broches de N25Q512A13GSFA0F
| Broche 1 | S# — Chip select (active low) |
| Broche 2 | DQ1 — Serial data output (SO) |
| Broche 3 | WP# — Write protect / DQ2 in quad mode |
| Broche 4 | GND — Ground |
| Broche 5 | DQ0 — Serial data input (SI) |
| Broche 6 | C — Serial clock (SCK) |
| Broche 7 | HOLD# — Hold / DQ3 in quad mode |
| Broche 8 | NC — Not connected (per datasheet) |
| Broche 9 | NC — Not connected (per datasheet) |
| Broche 10 | NC — Not connected (per datasheet) |
| Broche 11 | NC — Not connected (per datasheet) |
| Broche 12 | NC — Not connected (per datasheet) |
| Broche 13 | NC — Not connected (per datasheet) |
| Broche 14 | NC — Not connected (per datasheet) |
| Broche 15 | RESET#/SMB# — Hardware reset / secondary block protection |
| Broche 16 | VCC — Power supply (2.7V to 3.6V) |
Applications typiques
N25Q512A13GSFA0F convient pour 6 applications: Automotive Boot Code and Firmware Storage, FPGA Configuration Storage, Networking and Communications Equipment, Industrial Control and PLC Systems, Set-Top Box and Smart TV Platform Storage, Test and Measurement Instrumentation.
Automotive Boot Code and Firmware Storage
The N25Q512A13GSFA0F fits automotive infotainment, cluster, and ADAS designs because its -40C to +125C operating range and automotive temperature-grade classification survive harsh under-dash and under-hood conditions. Its 512Mb (64MB) density holds full boot images plus over-the-air update shadow copies, while 4KB sector erase granularity lets firmware update parameter tables without erasing boot code. Quad I/O mode at 108 MHz delivers approximately 54 MB/s read bandwidth, so ECUs boot quickly. Place the flash on a short SPI bus to the SoC and use hold/pin-based XIP for direct code execution; note that the stacked two-die construction adds modest internal latency at die boundaries.
Recommandé
FPGA Configuration Storage
For Xilinx and Intel FPGA systems, the N25Q512A13GSFA0F serves as the master configuration flash: 512Mb stores large bitstreams plus multiple reconfiguration images, and Quad Output read at 108 MHz shortens power-on configuration time versus x1 SPI parts. The 2.7V to 3.6V single supply connects directly to common 3.3V FPGA banks. Designers should verify the FPGA configuration manager supports the device's command opcodes and use the 4KB sector erase to update golden images in the field. The -40C to +125C range supports industrial deployments; DTR (54 MHz) mode doubles effective transfer rate for designs that support it.
Recommandé
Networking and Communications Equipment
Routers, switches, and base-station line cards use the N25Q512A13GSFA0F to store bootloader, OS images, and configuration files. The 64MB capacity comfortably holds redundant firmware images for A/B fail-safe upgrades, a common requirement in carrier equipment. Quad I/O streaming at 108 MHz provides roughly 54 MB/s so the CPU loads large OS images quickly at boot, and 4KB sectors allow per-file configuration edits. The wide -40C to +125C operating range covers outdoor telecom cabinets. Layout-wise, keep SCK and DQ traces length-matched and add series resistors to control ringing at the 108 MHz clock rate.
Recommandé
Industrial Control and PLC Systems
Industrial controllers benefit from the N25Q512A13GSFA0F's combination of 512Mb non-volatile storage and -40C to +125C tolerance, covering control cabinets exposed to temperature swings. PLCs store the application program, retentive data tables, and firmware in the 64MB array, using 4KB sector erase to log process data without frequent full-chip erases. The 7ns access-time class and 108 MHz Quad I/O interface let the main MCU execute code directly (XIP) from flash, reducing RAM requirements. Designers should implement wear-leveling for data-logging sectors and add 0.1uF local decoupling to suppress noise on the SPI lines in electrically noisy factory environments.
Recommandé
Set-Top Box and Smart TV Platform Storage
Set-top boxes and smart TVs boot from SPI NOR, and the N25Q512A13GSFA0F's 512Mb density holds the secure bootloader,DRM keys, and environment blocks that consumer SoCs require, while large application payloads typically live in eMMC or NAND behind it. Quad I/O reads at 108 MHz cut boot time because the SoC streams the loader quickly. The 2.7V to 3.6V supply integrates with standard 3.3V consumer boards, and low standby current preserves compliance with energy-efficiency rules in standby mode. Choose 4KB sector erase to update network settings without touching the bootloader region, preserving recovery capability after failed updates.
Recommandé
Test and Measurement Instrumentation
Oscilloscopes, spectrum analyzers, and data loggers store calibration constants, firmware, and waveform configuration in SPI NOR. The N25Q512A13GSFA0F provides 64MB for calibration sets of multiple probes plus firmware images, and its -40C to +125C range suits benchtop instruments near heat-generating front ends. The 108 MHz Quad I/O interface restores instrument settings quickly at power-up, and 4KB sectors isolate per-probe calibration records so one recalibration does not disturb others. Because instruments run continuously, flash endurance matters: reserve calibration sectors with low erase cycles and use the HOLD# pin to pause reads without releasing the SPI bus during multi-byte transactions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour N25Q512A13GSFA0F — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | N25Q512A13GSF40G | MT25QL512ABB1EW9-0SIT | N25Q512A13G12A0F | W25Q512JV |
|---|---|---|---|---|---|
| Package | 16-Pin SOIC (SOP-II) | 16-Pin SOIC (SOP-II) - same | 16-Pin SOIC (SOP-II) - same | 24-Ball FBGA - different | SOIC-16 / WSON-8 variant dependent |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Winbond Electronics |
| Density | 512 Mbit | 512 Mbit | 512 Mbit | 512 Mbit | 512 Mbit |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Sector Erase Size | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Generation / Lifecycle | N25Q (Legacy generation, active) | N25Q generation | MT25 successor generation (recommended for new designs) | N25Q generation | W25Q active generation |
Principaux différenciateurs
- Extended -40C to +125C automotive-grade temperature range (vs MT25QL512ABB1EW9-0SIT)
- Legacy-generation command-set compatibility (vs MT25QL512ABB1EW9-0SIT)
- DTR mode support (vs W25Q512JV)
Notes de conception
At the 108 MHz maximum STR clock rate, SPI trace integrity becomes a real constraint. Keep SCK traces under 10 cm to the flash and add 22-33 ohm series termination at the driver to control ringing. Length-match DQ0-DQ3 in Quad I/O mode to within a few millimeters to avoid skew between data lanes. Use a solid ground plane under the bus, and place 0.1uF plus 10uF decoupling at pin 16 (VCC) as close to the package as possible. Verify signal quality with an oscilloscope at maximum clock and at both supply-voltage extremes (2.7V and 3.6V).
The N25Q512A13GSFA0F is a stacked device built from two 256Mb die; internal addressing crosses a die boundary, so firmware that assumes monolithic erase/read timing may see slightly longer latencies at the 256Mb boundary. Also, DTR mode tops out at 54 MHz - do not assume the 108 MHz STR rating applies to double-transfer-rate operation. If migrating from a Winbond W25Q512JV or another vendor, re-verify quad-protocol opcodes and status register bit definitions, as these differ across manufacturers and can silently disable quad mode at boot.
Estimated: peak read current occurs during 108 MHz Quad I/O streaming; budget supply decoupling for transient current spikes using 10uF bulk plus 0.1uF ceramic at VCC. Program and erase operations draw substantially more current than reads, so a shared 3.3V rail with other peripherals should be sized for concurrent program current plus headroom, or firmware should serialize erase operations to avoid brownout. Add a hardware RESET# tie-through or supervised reset for systems that must recover from corrupted command sequences.
Informations de conformité
Compliance data not explicitly stated in retrieved distributor data. Verify via Micron product page or material declaration request. Partstack classifies the device as automotive temperature grade; AEC-Q100 qualification level should be confirmed with Micron.
