10AS048E2F29E2LG - Arria 10 SX SoC FPGA 480K LE | Intel | 780-FBGA
Référence : 10AS048E2F29E2LG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2700 | $27 000,00 |
| 100 | $2450 | $245 000,00 |
| 500 | $2200 | $1 100 000,00 |
| 1 000 | $1995 | $1 995 000,00 |
10AS048E2F29E2LG Présentation
What is an SoC FPGA? An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a class of programmable logic device that combines a general-purpose microprocessor subsystem (typically ARM Cortex-A cores) with traditional FPGA fabric (logic elements, DSP blocks, memory, transceivers) on a single die. The hierarchy is: SoC FPGA -> FPGA -> programmable logic -> semiconductor. SoC FPGAs serve the role of both a CPU host and a hardware accelerator, eliminating the need for a separate processor/MCU + FPGA pair on the board and reducing latency, BOM cost, and PCB area.
Key features of the 10AS048E2F29E2LG include 480K logic elements, embedded HPS block with dual ARM Cortex-A9 cores at up to 1.5 GHz, integrated CoreSight debug, 20 nm process technology, and a high-pin-count 780-BGA package suitable for transceiver-rich designs. The device is also marketed for medical-grade applications per the verified distributor description.
Architecturally, the part implements a heterogeneous fabric: FPGA logic elements handle custom datapath parallelism while the hard processor subsystem offloads control-plane OS workloads. The CoreSight block provides JTAG and trace instrumentation for both cores and the FPGA fabric, simplifying bring-up. The 20 nm process enables high logic density at moderate static power, and the flip-chip BGA package provides the thermal and signal-integrity margin required for multi-gigabit transceiver I/O.
Typical applications include medical imaging accelerators, industrial motor control with on-board HMI, software-defined radio baseband processing, broadcast video processing, and defense signal intelligence. The combination of ARM Cortex-A9 + FPGA fabric is well suited to pipelines where a Linux/RTOS host manages networking and storage while the FPGA performs real-time DSP.
When designing with this device, plan PCB escape routing for the 780-ball FCBGA early: the package is 29x29 mm and full-array, requiring HDI PCB with microvia stackups. Thermal management must dissipate both HPS and fabric power concurrently, and JTAG topology should account for the combined HPS+FPGA scan chain.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour 10AS048E2F29E2LG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS048E2F29E2LG (même facteur de forme et même empreinte) — différant par Package, Logic Elements, RoHS Status, Process Technology, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS048E2F29E1HG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →10AS048E1F29I1HG
✅ Remplacement direct✓ En stock
$1920 / unité
Voir la fiche technique →10AS032E4F29E3SG
✅ Remplacement direct✓ En stock
$1920 / unité
Voir la fiche technique →10AS032H4F35I3SG
✅ Remplacement direct✓ En stock
$1080 / unité
Voir la fiche technique →10AS048E2F29E2LG Valeurs maximales et caractéristiques électriques
| Device Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Clock | 1.5 GHz |
| Boîtier | 780-FBGA, FC (29x29 mm) |
| Type de montage | Surface Mount (flip-chip BGA) |
| Nombre de broches | 780 |
| Package Code | BGA, SQUARE |
| Terminal Form | BALL |
| Device Type | System On Chip (SoC) FPGA |
| Statut RoHS | Compliant (per manufacturer product page) |
| Lead-Free | Yes |
| Application Grade | Medical (per distributor description) |
Configuration des broches de 10AS048E2F29E2LG
| Broche A1 | VCC — Core supply (0.9 V) - representative; exact ball map per datasheet |
| Broche A2 | GND — Ground - representative; exact ball map per datasheet |
Applications typiques
10AS048E2F29E2LG convient pour 6 applications: Medical Imaging Accelerator, Software Defined Radio Baseband, Industrial Motor Control with HMI, Broadcast Video Processing, Defense Signal Intelligence, Test and Measurement Instrumentation.
Medical Imaging Accelerator
The 10AS048E2F29E2LG fits medical imaging pipelines (CT, MRI, ultrasound beamforming) because its 480K logic elements and 20 nm process deliver the DSP throughput required for real-time image reconstruction. The dual ARM Cortex-A9 HPS runs the patient-interface stack, DICOM networking, and display drivers while the FPGA fabric executes parallel FIR filters and FFT kernels. The 780-FBGA package provides the transceiver bandwidth to interface with high-speed analog front ends, and the medical-grade designation per the verified distributor description supports regulatory submissions. Power and thermal budgets must account for sustained HPS + fabric utilization during scan acquisition.
Recommandé
Software Defined Radio Baseband
The 10AS048E2F29E2LG is well matched to SDR baseband processing where multi-gigabit transceivers feed the FPGA fabric and the HPS runs the network stack. Its 480K LEs support wide-band channelizers, polyphase filterbanks, and digital up/down conversion in parallel, while the dual Cortex-A9 handles TCP/IP, MAC scheduling, and remote management. The 780-FBGA package escape-routes the high-speed serial links cleanly on HDI stackups, reducing jitter and ISI. The Cortex-A9 at 1.5 GHz is sufficient for protocol acceleration offload, keeping the fabric free for sample-rate DSP.
Recommandé
Industrial Motor Control with HMI
The 10AS048E2F29E2LG suits multi-axis motor control platforms where the HPS runs the HMI stack, EtherCAT master, and safety logic while the FPGA fabric executes high-resolution PWM, encoder decoding, and current-loop control. Its 480K LEs permit 8-16 axes of field-oriented control in a single device, and the dual Cortex-A9 isolates the deterministic motion code from networking tasks via SMP. The 780-FBGA thermal envelope handles continuous switching losses, and the medical-grade qualification per distributor description indicates the underlying silicon's robustness for industrial environments. PCB escape routing must prioritize isolated grounds for the analog sense paths.
Recommandé
Broadcast Video Processing
The 10AS048E2F29E2LG supports broadcast video processing including 4K/UHD up/down/cross conversion, HDR tone mapping, and codec pre-processing. Its 480K LEs handle multi-stream pixel pipelines at full UHD frame rates, while the dual Cortex-A9 manages IP transport (SMPTE 2022, NDI, SMPTE 2110), talkback, and metadata. The 780-FBGA package and high I/O count support multi-link SDI aggregation at 12G-SDI rates. The 20 nm process balances logic density against the static power budget of always-on broadcast head-ends. Reference designs from Intel/Altera simplify multi-link SDI bridging.
Recommandé
Defense Signal Intelligence
The 10AS048E2F29E2LG is used in defense signal-intelligence platforms where wide-bandwidth RF capture feeds FPGA-based demodulators and protocol decoders, with the HPS running crypto offload and secure networking. The 480K LE fabric supports real-time cross-correlation and pattern matching across many channels, while the Cortex-A9 host isolates trusted vs untrusted code via TrustZone. The 780-FBGA package and 20 nm process are well established in defense supply chains, with extended temperature variants available. Board design must include anti-tamper mesh and TEMPEST considerations around the SoC.
Recommandé
Test and Measurement Instrumentation
The 10AS048E2F29E2LG fits high-end test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators. Its 480K LEs support deep capture memory and parallel trigger logic, while the dual Cortex-A9 host runs the UI, file I/O, and remote control (LXI, USBTMC). The 780-FBGA package supports the high-pin-count mixed-signal front end typical of these instruments. The Cortex-A9 at 1.5 GHz provides responsive UI feedback, and the FPGA fabric handles the real-time acquisition. Reference designs for PCIe Gen3 and 10GbE accelerate development.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS048E2F29E2LG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS048E2F29E1HG | 10AS048E1F29I1HG | 10AS032E4F29E3SG |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 780-FBGA, FC (29x29) | 780-FBGA, FC (29x29) | 780-FBGA, FC (29x29) | 780-FBGA, FC (29x29) |
| Device Family | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC |
| Logic Elements | 480,000 | 480,000 | 480,000 | 320,000 (-33%) |
| HPS Processor | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight |
| HPS Max Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Suffix Grade (Speed/Temp/Lead) | E2 (commercial speed, ext temp, lead-free) | E1 (faster speed grade) | I1 (industrial temp grade) | E3 (different family, same package footprint) |
Principaux différenciateurs
- Highest logic density in the 780-FBGA 29x29 Arria 10 SX family (vs 10AS032E4F29E3SG)
- Standard commercial speed grade (E2) tuned for mainstream SoC FPGA designs (vs 10AS048E2F29E1HG)
- Industrial temperature availability within the same 10AS048 family (vs 10AS048E1F29I1HG)
Notes de conception
The 780-FBGA 29x29 mm package is a full-array flip-chip BGA that mandates HDI PCB stackups with laser-drilled microvias and via-in-pad for clean escape routing. Plan a 1-2-1 or 2-4-2 stackup with the top layer dedicated to BGA escape, a ground plane on layer 2, and signal routing on layer 3. Beyond-row-8 signals require longer microvia stubs - simulate with 3D EM tools (ANSYS HFSS, Cadence Clarity) to confirm 25 Gbps+ channel margin.
The 10AS048E2F29E2LG dissipates power from both the FPGA fabric and the dual Cortex-A9 HPS concurrently. Estimated: at 0.9 V core, with the HPS running Linux (~5 W) and the fabric at 70 percent utilization (~10 W), the package junction temperature rises 30-50 C above ambient with the recommended thermal pad and a moderate heatsink. Use a thermal interface material rated for the 780-BGA land pattern, and ensure airflow or a heat spreader covers both HPS and fabric hot zones. The FBGA does not have an integrated heat slug - thermal performance is entirely board-dependent.
Combine the HPS and FPGA JTAG scan chains into a single chain for board-level debug; use series termination on TCK and parallel termination on TMS/TDI/TDO. Reserve a 10-pin Cortex debug header (or Mictor-38 for trace) for the HPS CoreSight trace, and a separate 10-pin Altera JTAG header for the FPGA fabric. Ensure both chains can be isolated via TAP selection so a failing HPS does not break FPGA fabric debug access.
Do not assume a 10AS032 part will behave like a 10AS048 in the same footprint - logic density, DSP count, and transceiver count differ and will silently fail utilization-driven compilation. Verify the target logic utilization against the chosen device's published LE/DSP/memory counts before PCB layout commits. Do not mix the 780-FBGA 29x29 pinout with the 1152-BGA F35 pinout - both are 780/1152-family parts but the ball maps are not interchangeable.
Informations de conformité
RoHS and lead-free compliance per Intel/Altera manufacturer product page. Medical-grade application designation per distributor description; AEC-Q100 not applicable for FPGAs. Material declarations and conflict-minerals statements published on the Altera product page.