10AS032E4F29I3LG - Arria 10 SX SoC FPGA, 320K LE, 780-FBGA | Altera
Référence : 10AS032E4F29I3LG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2620 | $26 200,00 |
| 100 | $2380 | $238 000,00 |
| 500 | $2150 | $1 075 000,00 |
| 1 000 | $1920 | $1 920 000,00 |
10AS032E4F29I3LG Présentation
A System on Chip FPGA combines a microprocessor subsystem and programmable logic on a single die. Within the broader silicon taxonomy, the Arria 10 SX belongs to the SoC FPGA family, itself a subclass of FPGAs (field programmable gate arrays) and PLDs (programmable logic devices) within the digital semiconductor category. The hard ARM cores execute software workloads while the FPGA fabric accelerates custom dataplanes, allowing deterministic latency for DSP, video, or protocol processing tasks that would be inefficient on a general-purpose processor.
Key features include dual 32-bit ARM Cortex-A9 cores with CoreSight debug and trace, NEON media engine, single/double-precision floating-point unit, 320K logic elements, 1.5 GHz maximum fabric frequency, integrated DDR4/DDR3 memory controllers with ECC, multiple high-speed transceiver banks, and a rich peripheral set including USB, EMAC, SPI, UART, and I2C. Security extensions (boot, keys, anti-tamper) and SEU detection mitigate soft-error risk in long-lifecycle deployments.
The Arria 10 SX 320 variant targets mid-range SoC integration where software stack maturity, deterministic hardware acceleration, and high-bandwidth memory access matter more than absolute logic capacity. Hard IP for memory and transceivers reduces soft-logic overhead and accelerates timing closure versus pure FPGA fabrics. The 28nm process balances performance, leakage, and cost for industrial, broadcast, and defense programs.
Typical applications include industrial machine vision and video surveillance, software-defined radio front ends, motor control and industrial automation controllers, broadcast video processing, medical imaging pipelines, and military/aerospace secure compute platforms. The hard ARM cores run Linux or RTOS while the FPGA fabric handles pixel pipelines, FFTs, or custom protocols.
When designing with this device, ensure that PCB thermal management accounts for industrial-temperature operation. Use Intel/Altera Quartus Prime with the SoC EDS toolkit to integrate HPS firmware and FPGA bitstreams, and verify pin assignments against the device-specific pinout file. Plan for transceiver reference clock cleanliness and DDR4 write leveling during board bring-up.
This page synthesizes distributor pricing, SoC-FPGA drop-in alternatives within the same Arria 10 SX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for evaluation, sourcing, and second-source qualification.
Alternatives de remplacement direct pour 10AS032E4F29I3LG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS032E4F29I3LG (même facteur de forme et même empreinte) — différant par Package, Operating Temperature Grade, Mounting Type, Logic Elements, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS032E4F29E3LG
✅ Remplacement direct✓ En stock
$2295 / unité
Voir la fiche technique →10AS032E4F29I3SG
✅ Remplacement direct✓ En stock
$2250 / unité
Voir la fiche technique →10AS032E4F27I3LG
✅ Remplacement direct✓ En stock
$1085.1 / unité
Voir la fiche technique →10AS032E4F27I3SG
✅ Remplacement direct✓ En stock
$1465 / unité
Voir la fiche technique →10AS032E3F29I2LG
✅ Remplacement direct✓ En stock
$1390 / unité
Voir la fiche technique →10AS032E4F29I3LG Valeurs maximales et caractéristiques électriques
| Device Family | Arria 10 SX |
| Logic Elements | 320K |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency | 1.5 GHz |
| Fabric Speed Grade | 4 |
| Temperature Grade | Industrial |
| Boîtier | 780-FBGA, FC (29x29 mm) |
| Type de montage | Surface Mount |
| Terminal Form | Ball |
| Number of Terminals | 780 |
| Package Code | BGA |
| Package Shape | Square |
| Lead-Free / RoHS | Yes (RoHS compliant) |
Guide de configuration des broches du 10AS032E4F29I3LG square
Configuration des broches du 10AS032E4F29I3LG (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS032E4F29I3LG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS032E4F29I3LG convient pour 6 applications: Industrial Machine Vision, Software-Defined Radio (SDR) Front End, Broadcast Video Processing, Medical Imaging and Diagnostics, Motor Control and Industrial Automation, Defense and Aerospace Secure Compute.
Industrial Machine Vision
The 10AS032E4F29I3LG fits industrial machine vision because the hard ARM Cortex-A9 cores run a Linux-based image processing stack while the 320K logic elements accelerate pixel pipelines, Bayer demosaicing, and object detection at deterministic latency. The integrated DDR4 controller with ECC supports the high-bandwidth memory access required by multi-stream GigE Vision or CoaXPress cameras, and the industrial temperature grade ensures reliable operation on factory floors. The 780-FBGA package provides the I/O density for parallel sensor aggregation, while 1.5 GHz fabric frequency keeps frame-to-frame latency predictable.
Recommandé
Software-Defined Radio (SDR) Front End
The 10AS032E4F29I3LG suits SDR front ends because the FPGA fabric executes wideband DDC/DUC, FFTs, and channelization at line rate, while the dual ARM cores handle waveform firmware, synchronization, and network protocol stacks. The device's high-speed transceivers support multi-Gbps data conversion links to ADCs and DACs, and the hard memory controller sustains the buffering required by wide instantaneous bandwidth captures. Compared with pure soft-core implementations, the integrated ARM subsystem reduces latency and BOM in tactical and commercial SDR platforms.
Recommandé
Broadcast Video Processing
The 10AS032E4F29I3LG is well-matched to broadcast video processing because 320K logic elements deliver enough capacity for 4K/UHD HEVC/H.265 mezzanine compression, color space conversion, and on-screen graphics compositing in a single device. The dual ARM cores orchestrate transport stream muxing and IP-based delivery, while the FPGA fabric handles pixel-rate operations at deterministic frame delay. The industrial temperature rating and lead-free package suit broadcast equipment deployed in mixed-temperature headends and outdoor OB trucks.
Recommandé
Medical Imaging and Diagnostics
The 10AS032E4F29I3LG fits medical imaging systems because the integrated HPS runs the application and UI stack on Linux while the FPGA fabric accelerates CT/MRI back-projection, ultrasound beamforming, or X-ray flat-panel pre-processing at deterministic latency. The hard DDR4 controller with ECC is critical for diagnostic image fidelity, and the security extensions help meet HIPAA-style data-at-rest requirements. Industrial temperature grading allows deployment in controlled but unconditioned clinical environments where commercial-grade parts would be marginal.
Recommandé
Motor Control and Industrial Automation
The 10AS032E4F29I3LG suits motor control and industrial automation because the FPGA fabric executes high-resolution field-oriented control (FOC), Sigma-Delta modulation, and deterministic encoder interfaces at sub-microsecond loop times. The hard ARM cores run the PLC runtime, EtherCAT or PROFINET master stacks, and HMI logic. The industrial temperature grade and 780-ball BGA's high I/O count allow aggregation of multiple motor axes, safety I/O, and fieldbus interfaces on a single SoC, reducing bill of materials versus discrete MCU plus FPGA designs.
Recommandé
Defense and Aerospace Secure Compute
The 10AS032E4F29I3LG fits secure defense and aerospace compute platforms because the hard ARM cores run trusted execution firmware and crypto libraries while the FPGA fabric accelerates packet processing, secure I/O, and signal conditioning. Security features including secure boot, key storage, and anti-tamper align with defense program requirements. Industrial temperature operation covers many ground-vehicle and sheltered-aerospace deployments, and the lead-free RoHS finish satisfies modern environmental mandates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS032E4F29I3LG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS032E4F29E3LG | 10AS032E4F29I3SG | 10AS032E4F27I3LG | 10AS032E3F29I2LG |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 780-FBGA (29x29 mm, F29) | 780-FBGA (29x29 mm, F29) - same | 780-FBGA (27x27 mm, F27) | 780-FBGA (27x27 mm, F27) | 780-FBGA (29x29 mm, F29) - same |
| Logic Elements | 320K | 320K | 320K | 320K | 320K |
| Speed Grade | 4 | 3 | 3 | 4 | 2 |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
| Hard Processor Subsystem | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| RoHS / Lead-Free | Yes | Yes | Yes | Yes | Yes |
| Drop-in Footprint | Reference | Yes (F29) | No (F27 vs F29) | No (F27 vs F29) | Yes (F29) |
Principaux différenciateurs
- Hard ARM Cortex-A9 HPS integrated on die (vs Cyclone V SX (older SoC FPGA))
- Industrial temperature grade in F29 ballmap (vs 10AS032E4F29I3SG (F27 ballmap, industrial))
- Speed grade 4 for tightest timing margins (vs 10AS032E4F29E3LG (speed grade 3))
Notes de conception
The 780-FBGA Arria 10 SX device dissipates significant power under typical industrial workloads, including the HPS subsystem. Estimate: at 1.5 GHz core frequency and mid-utilization fabric, plan for 8-15W dissipation and design the PCB with a thermal via array under the BGA plus a heat spreader for closed-enclosure deployments. Use the Arria 10 power estimator early in the design to validate thermal assumptions before PCB layout freeze.
The 780-FBGA F29 ballmap requires a high-density PCB with microvia stackups and matched-length routing for transceiver and DDR4 signals. Use the Intel/Altera pinout file and Quartus Prime pin planner to assign banks before layout. Place decoupling capacitors on the bottom side of the BGA for shortest return paths and dedicate continuous ground and power planes beneath the device for signal integrity.
Do not confuse the F29 (29x29 mm) ballmap with the F27 (27x27 mm) ballmap: both are 780-pin FBGA but the footprints are not interchangeable. Verify the OPN before PCB fab: 10AS032E4F29xx = F29, 10AS032E4F27xx = F27. Mixing the two ballmaps causes assembly yield loss and unrecoverable rework cost.
Arria 10 SX transceivers are sensitive to reference clock jitter; source the refclk from a low-jitter oscillator and isolate it from noisy digital supplies. For DDR4 interfaces, follow the Intel pinout guideline for write leveling and read deskew; do not relax the matching constraints to ease routing, or you risk intermittent bit errors at temperature corners.
Informations de conformité
RoHS compliant per Altera product page; lead-free finish confirmed by 'G' suffix in OPN. AEC-Q100 not applicable - this is an FPGA SoC, not an automotive-grade IC. Halogen-free status not stated in provided data.