10AS057H4F34I3SG - Arria 10 SX SoC FPGA 570K LE | Intel
Référence : 10AS057H4F34I3SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4262.19 | $4 262,19 |
| 10 | $4090.5 | $40 905,00 |
| 25 | $3945 | $98 625,00 |
| 50 | $3810 | $190 500,00 |
| 100 | $3685 | $368 500,00 |
10AS057H4F34I3SG Présentation
A SoC FPGA (System-on-Chip FPGA) is a hybrid device that fuses a hard processor system (typically ARM Cortex-A cores, memory controllers, and peripherals) with FPGA programmable logic and DSP blocks on a single die. This integration eliminates the latency and board complexity of a discrete CPU + FPGA pair, allowing deterministic real-time control loops, hardware-accelerated signal processing, and Linux/RTOS application software to coexist on one chip. Within the broader hierarchy, SoC FPGAs sit at the intersection of microcontrollers, ASSPs, and standalone FPGAs, giving engineers software-defined flexibility with hardware-defined performance.
Key features include 570K logic elements, embedded hard memory controllers, integrated transceivers supporting multi-gigabit serial links, dedicated variable-precision DSP blocks, and partial reconfiguration support. The industrial temperature grade enables deployment in harsh environments without thermal screening, while the FC-FBGA package provides high I/O density for high-pin-count designs such as 4K video processing, 100G Ethernet aggregation, and radar/sonar baseband processing. The Arria 10 SX family is widely used in prototyping and production for defense, medical imaging, and industrial motion control.
Typical applications include high-performance signal processing (radar, ultrasound, software-defined radio), embedded vision and video broadcast pipelines, 100G/40G Ethernet line cards, motor control and industrial drive firmware, and 4K/8K video processing. The dual ARM Cortex-A9 cores enable Linux or RTOS deployment for control-plane software while the FPGA fabric accelerates data-plane DSP functions in parallel. Engineers typically pair the device with DDR3/DDR4 memory, flash, and a multi-rail power solution sized for the SoC plus transceiver power domains.
When designing with this part, ensure your PCB footprint matches the 1152-ball FC-FBGA 35x35 mm land pattern and verify that your power tree provides the recommended 0.9 V core, 1.1 V/1.5 V transceiver, and 1.8 V/3.3 V I/O rails with proper sequencing. Programming is performed through JTAG or the on-chip configuration controller using Intel Quartus Prime software; pinout and configuration files (qsf/qpf) are generated per design. Lead times are typically long for industrial-grade Arria 10 devices, so plan early with your distributor for production quantities.
This page consolidates distributor pricing, drop-in same-brand alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate your BOM decision and PCB bring-up.
Alternatives de remplacement direct pour 10AS057H4F34I3SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS057H4F34I3SG (même facteur de forme et même empreinte) — différant par Package, Family, Mounting Type, Temperature Grade, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS057H4F34I3LG
✅ Remplacement direct✓ En stock
$2280 / unité
Voir la fiche technique →10AS057H4F34E3SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS057H4F34E3LG
✅ Remplacement direct✓ En stock
$1820 / unité
Voir la fiche technique →10AS057H3F34I2SG
✅ Remplacement direct✓ En stock
$2290 / unité
Voir la fiche technique →10AS057H3F34I2LG
✅ Remplacement direct✓ En stock
$2950 / unité
Voir la fiche technique →10AS057H3F34E2SG
✅ Remplacement direct✓ En stock
$3300 / unité
Voir la fiche technique →10AS057H4F34I3SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 1.5 GHz |
| Core Voltage (typ.) | 0.9 V |
| Boîtier | 1152-pin FC-FBGA (35x35 mm) |
| Package Code | F34 |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | H4 |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | RoHS Compliant |
| Configuration Memory | SRAM-based, volatile (external flash boot) |
| Lead-Free | Yes |
| Programming Tool | Intel Quartus Prime |
Guide de configuration des broches du 10AS057H4F34I3SG f34
Configuration des broches du 10AS057H4F34I3SG (boîtier f34). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS057H4F34I3SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS057H4F34I3SG convient pour 6 applications: Radar and Sonar Signal Processing, Medical Ultrasound Imaging, Software-Defined Radio Base Station, 4K/8K Video Broadcast Processing, Industrial Motor Control and Drives, Military and Defense Electronics.
Radar and Sonar Signal Processing
The 10AS057H4F34I3SG's 570K logic elements and variable-precision DSP blocks make it ideal for high-throughput radar/sonar baseband processing. The dual ARM Cortex-A9 cores run beamforming control software and target tracking algorithms, while the FPGA fabric accelerates FFT, pulse compression, and CFAR detection in parallel. Industrial temp grade supports outdoor naval and ground-radar installations. Pair with DDR4 and high-speed ADC daughter cards for multi-GS/s acquisition.
Recommandé
Medical Ultrasound Imaging
The 10AS057H4F34I3SG integrates the dual ARM Cortex-A9 HPS with sufficient FPGA fabric to beamform up to 128 channels of ultrasound receive data. Linux on the HPS handles user interface, DICOM networking, and probe identification, while the FPGA performs demodulation, I/Q beamforming, and image reconstruction at line rates above 5 kHz. The industrial temp grade plus IEC 60601-style reliability enable deployment in clinical ultrasound carts.
Recommandé
Software-Defined Radio Base Station
Arria 10 SX SoC FPGAs power SDR base stations by combining FPGA fabric (multi-channel DDC/DUC, crest factor reduction, DPD) with the ARM Cortex-A9 HPS running L1/L2 protocol stacks. The 10AS057H4F34I3SG's industrial temp grade and 20 nm power efficiency support small-cell and tactical-radio deployments. Transceivers connect to RF front-end ADCs/DACs at multi-GS/s rates over JESD204B/C.
Recommandé
4K/8K Video Broadcast Processing
Broadcast video routers and contribution encoders rely on the 10AS057H4F34I3SG to process uncompressed 12G-SDI and IP-based SMPTE ST 2110 streams. The FPGA fabric performs chroma subsampling, scaling, multiviewer composition, and ST 2110 packetization, while the ARM cores run control software and JSON-based NMOS discovery. Industrial temp grade supports fan-less broadcast equipment racks.
Recommandé
Industrial Motor Control and Drives
The 10AS057H4F34I3SG provides deterministic FPGA fabric for high-bandwidth current/torque loops plus an ARM Cortex-A9 HPS for velocity/position control, host communications (EtherCAT, PROFINET), and safety firmware. Industrial temp grade (-40C to +100C) supports outdoor and factory-floor cabinets. The HPS can run Linux with PREEMPT_RT for non-realtime tasks, leaving time-critical control entirely in FPGA hardware.
Recommandé
Military and Defense Electronics
The 10AS057H4F34I3SG industrial-temperature variant serves many defense programs that do not require full MIL-STD-1540 screening, including tactical communications, electronic warfare subsystems, and SIGINT capture platforms. FPGA fabric accelerates channelization and demodulation while the ARM HPS runs situational-awareness software. Long product lifecycle support from Intel is well-suited to multi-decade defense platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS057H4F34I3SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS057H4F34I3LG | 10AS057H4F34E3SG | 10AS057H4F34E3LG | 10AS057H3F34I2SG | 10AS057H3F34I2LG | 10AS057H3F34E2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 |
| Speed Grade | H4 | H4 | H4 | H4 | H3 (faster) | H3 (faster) | H3 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial | Industrial | Commercial |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Dual ARM Cortex-A9 hard processor system integrated on-die (vs Xilinx Kintex-7 FPGA family)
- Pin-compatible family with multiple speed grades and temperature variants (vs Single-configuration discrete ASSP)
- 20 nm process technology balances performance and power (vs Older 28 nm Arria V / Cyclone V families)
Notes de conception
Estimated: the 10AS057H4F34I3SG in a 35x35 mm FC-FBGA package can dissipate 25-40 W depending on FPGA utilization and transceiver activity. Use a thermal interface material (TIM) and a heatsink with a low-rise fin profile; for enclosed chassis designs add forced-air cooling. Reference Intel's AN 757 (Thermal Management for Arria 10 Devices) for theta_JA vs airflow curves. Always verify thermal performance under worst-case mission profile, not just nominal workloads.
Design the 1152-ball FC-FBGA PCB with microvia stack-up (e.g. 8-layer 1-2-6-1 or similar) per Intel's package PCB layout guidelines. Use 0.4 mm or 0.5 mm pitch fan-out, escape vias in pairs from inner rows, and use laser-drilled microvias. Match the BGA pad size and solder mask defined (SMD) or non-solder mask defined (NSMD) recommendation from Intel. Maintain a continuous ground plane under the device for return paths.
Implement a multi-rail power solution with the Arria 10 SmartVID or fixed 0.9 V core regulator (capable of 20+ A with tight load-line), 1.1 V/1.5 V/1.8 V for transceivers and HPS, and 2.5 V/3.3 V for I/O banks. Power sequencing must follow Intel's POR (power-on-reset) sequence: VCC before VCCP/VCCPT/VCCERAM, with no more than 200 ms rise time. Use a Power Management Bus (PMBus) sequencer with monitored telemetry.
Avoid these mistakes: (1) omitting the configuration flash (EPCS/EPCQ) and trying to boot from JTAG only in production; (2) confusing the F34 package code with F35 (different ball counts); (3) using LVDS lanes without proper bank I/O standards setup in Quartus Pin Planner; (4) missing HPS boot mode pin strapping resistors (BSEL, CSEL); (5) sharing reference clock outputs across banks with different I/O standards. Reference the Arria 10 device family datasheet and AN 692 for configuration and boot guidance.
Informations de conformité
RoHS compliant per Orelectronics and DigiKey product listings. Industrial temperature grade designated by 'I' suffix in MPN; H4 speed grade denotes slower silicon used for cost-sensitive designs. AEC-Q100 is not applicable as this is a programmable logic device rather than an automotive-grade IC. For full material declaration, request the Intel MDDS document.