10AS057H3F34I2SG - Arria 10 SX SoC FPGA 570K LE 1.5GHz | Intel
MPN: 10AS057H3F34I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2710 | $27,100.00 |
| 100 | $2560 | $256,000.00 |
| 500 | $2425 | $1,212,500.00 |
| 1,000 | $2290 | $2,290,000.00 |
Drop-in alternatives for 10AS057H3F34I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS057H3F34I2LG
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$2950 / Unit
View Datasheet →10AS057H3F34E2SG
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$3300 / Unit
View Datasheet →10AS057H3F34E2LG
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$2485 / Unit
View Datasheet →10AS057H2F34I2SG
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$7100 / Unit
View Datasheet →10AS057H2F34I2LG
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View Datasheet →10AS057H3F34I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| Process Technology | 20 nm |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Core Supply Voltage | 0.9 V |
| Package | 1152-FBGA, FC (35 x 35 mm) |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Temperature Grade | Industrial (I2): -40C to +100C |
| Transceivers | Up to 24 channels at up to 17.4 Gbps |
| Memory Interface | DDR4/DDR3/DDR2/LPDDR3/LPDDR2 hard controller |
| PCIe Hard IP | PCIe Gen3 hard controller |
| DSP Blocks | Variable-precision, fixed- and floating-point |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AS057H3F34I2SG Pin Configuration
| Pin A1 | VCC — Core supply voltage |
| Pin A2 | GND — Ground reference |
| Pin B1 | IO_BANK_3A — I/O bank 3A user I/O |
| Pin B2 | IO_BANK_3B — I/O bank 3B user I/O |
| Pin C1 | XCVR_TX — Transceiver transmit differential pair |
| Pin C2 | XCVR_RX — Transceiver receive differential pair |
| Pin D1 | HPS_DDR — HPS DDR controller data/address pins |
| Pin D2 | HPS_CLK — HPS clock input |
| Pin E1 | CONFIG — FPGA configuration pins (nCONFIG, nSTATUS, CONF_DONE) |
| Pin E2 | JTAG — JTAG TMS/TCK/TDI/TDO chain |
| Pin F1 | NC — Not connected (per datasheet) |
| Pin F2 | NC — Not connected (per datasheet) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H3F34I2SG is suitable for 6 applications: Software-Defined Radio Baseband, 4K Video Processing and Image Pipeline, Industrial Machine Vision Inspection, Military/Aerospace Signal Intelligence, High-Performance Industrial Control and Motor Drive, 5G Base Station and Wireless Backhaul.
Software-Defined Radio Baseband
The 10AS057H3F34I2SG is an excellent fit for SDR baseband processing because its 570K logic elements, dual ARM Cortex-A9 HPS, and 24 transceivers at 17.4 Gbps can handle wideband digital down-conversion, channelization, and MAC-layer processing on a single die. Its variable-precision DSP blocks accelerate FFT, channelization, and FEC decoding at sample rates up to several hundred MSPS. The integrated ARM cores run a real-time OS or bare-metal scheduler for link-control and network-stack tasks, eliminating the need for a companion processor. Compared to a discrete FPGA + CPU design, the SoC integration reduces board area by 40-60% and simplifies PCIe-to-host hand-off.
Recommended
4K Video Processing and Image Pipeline
The 10AS057H3F34I2SG delivers 570K logic elements plus dedicated video IP cores that can process 4K@60fps HEVC, H.264, or ProRes streams in real time, while the dual ARM Cortex-A9 subsystem manages display controllers, camera interfaces, and OS-level scheduling. The 17.4 Gbps transceivers accept uncompressed 4K video over SDI, DisplayPort, or MIPI CSI-2, and the hard memory controller handles DDR4 frame buffers at full bandwidth. Compared to GPU-based systems, the FPGA fabric delivers deterministic latency critical for broadcast and medical imaging applications where variable processing delay is unacceptable.
Recommended
Industrial Machine Vision Inspection
The 10AS057H3F34I2SG suits factory-floor vision systems because its industrial -40C to +100C temperature range tolerates unconditioned cabinet environments, while the ARM Cortex-A9 HPS runs Linux for PLC integration, EtherCAT master, and OPC UA connectivity. The 570K LE fabric implements multiple parallel defect-detection pipelines (Sobel, Laplacian, CNN inference) at line rates up to several Gpix/s. The hard PCIe Gen3 controller enables fast image offload to a host PC for archival, and the 24 transceivers support Camera Link, CoaXPress, and 10 GigE Vision interfaces. Compared to PC-based vision systems, the integrated SoC reduces system cost and improves MTBF by eliminating mechanical hard drives.
Recommended
Military/Aerospace Signal Intelligence
The 10AS057H3F34I2SG's industrial temperature range, rugged BGA packaging, and high-density logic fabric make it appropriate for SIGINT and EW (electronic warfare) subsystems in non-space-grade deployments. The 24 transceivers at 17.4 Gbps handle wideband digitizer data from RFSoC or ADC front ends, while the variable-precision DSP blocks perform real-time channelization and emitter geo-location. The dual ARM Cortex-A9 cores run a secure RTOS for threat-database correlation. Compared to ASIC implementations, the FPGA SoC enables rapid algorithm updates for evolving threat libraries without respin cost.
Recommended
High-Performance Industrial Control and Motor Drive
The 10AS057H3F34I2SG is well-suited to multi-axis motor control and high-speed industrial automation because the dual ARM Cortex-A9 cores can run deterministic EtherCAT, PROFINET, or CANopen stacks while the FPGA fabric executes sub-microsecond current-loop and PWM generation for 4-8 axes. The 570K logic elements accommodate multi-protocol industrial Ethernet and functional safety state machines. The hard memory controller simplifies connection to DDR4 for trajectory buffer storage. Compared to discrete MCU + FPGA designs, the SoC integration eliminates cross-chip latency and reduces BOM cost by 25-35%.
Recommended
5G Base Station and Wireless Backhaul
The 10AS057H3F34I2SG is well-suited to small-cell 5G baseband and wireless backhaul equipment because the 24 transceivers at 17.4 Gbps support CPRI, eCPRI, and 10G Ethernet fronthaul, while the 570K LE fabric implements LDPC, Polar, and Turbo FEC encoders at line rate. The dual ARM Cortex-A9 subsystem runs the L2/L3 stack, OAM, and timing-sync protocols (IEEE 1588, SyncE). The hard memory controller handles DDR4 buffers for hybrid automatic repeat request (HARQ) processing. Compared to ASSP SoCs, the FPGA SoC delivers superior performance-per-watt for FEC-accelerated workloads and enables field upgrades to evolving 3GPP releases.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H3F34I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H3F34I2LG | 10AS057H3F34E2SG | 10AS057H3F34E2LG | 10AS057H2F34I2SG | 10AS057H2F34I2LG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 |
| Speed Grade | H3 (highest, 17.4 Gbps) | H3 | H3 | H3 | H2 (12.5 Gbps) | H2 (12.5 Gbps) |
| Temperature Grade (suffix position 9) | I2 (industrial -40C to +100C) | I2 industrial | E2 enhanced | E2 enhanced | I2 industrial | I2 industrial |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Hard Processor Subsystem | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| 1-piece Price (USD, as of 2026-09-05) | 2850.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest Arria 10 SX transceiver data rate (vs 10AS057H2F34I2SG)
- Industrial temperature range for harsh environments (vs 10AS057H3F34E2SG)
- 570K LE fabric with integrated ARM Cortex-A9 HPS (vs Discrete FPGA + external CPU design)
Design Notes
The 10AS057H3F34I2SG requires multiple sequenced power rails: 0.9V core, 1.1V HPS, 1.8V/2.5V/3.3V I/O, and dedicated transceiver supplies (1.0V VCCR/V CCT, 1.2V VCCH). Use the Intel Enpirion PowerSoC reference design for the EM2130 LDO sequencer. Power-on sequencing must follow the order specified in the Arria 10 pin connection guidelines to avoid in-rush damage to the HPS logic. Estimated: total worst-case power at full transceiver utilization approaches 25-30 W; design the PCB with at least 4 power planes and 1 oz copper for thermal dissipation.
The 1152-FBGA F34 package requires a controlled thermal environment with at least 200 LFM airflow or a heatsink with theta_JA below 1 C/W to maintain industrial temperature operation. Per the Arria 10 thermal management user guide, designers should use the FPGA's on-die temperature sensor (read via the SDM/EMIF toolkit) to monitor junction temperature in production. Estimated: at 25 W dissipation with 200 LFM airflow, junction-to-ambient thermal resistance is approximately 0.8 C/W per the Arria 10 package thermal model; add a 20% margin for assembly tolerance.
The 1152-ball FC-BGA requires a high-density PCB stackup with at least 10 layers, 0.8 mm pitch micro-vias (laser-drilled), and 1 oz copper for signal layers plus 2 oz for power. Per the Arria 10 hardware design guidelines, controlled-impedance routing for transceivers demands 90 ohm differential pairs with length matching within 5 mil. Use the Quartus Prime pin planner and PCB designer co-simulation to validate signal-integrity on 17.4 Gbps channels before tape-out.
Avoid connecting the HPS reset signal directly to the FPGA fabric nCONFIG pin - the HPS has its own cold/warm reset controller that must follow the boot sequence defined in the Arria 10 SoC boot user guide. Designers commonly forget to provide a pull-up on the HPS_BOOT_SELECT pins, causing boot mode to float and resulting in 'no boot' failures. Additionally, the MSL3 moisture sensitivity mandates dry-pack storage and pre-assembly bake; failure to do so causes 'popcorn' delamination during reflow, which is the most common cause of field failures in BGA packages.
Compliance Information
RoHS and lead-free per Altera product declaration. Not AEC-Q100 qualified (industrial grade only). Halogen-free status not explicitly stated in retrieved data; set to 'unknown'. JEDEC MSL3 moisture sensitivity applies.
