10AS057H4F34I3SG - Arria 10 SX SoC FPGA 570K LE | Intel
MPN: 10AS057H4F34I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4262.19 | $4,262.19 |
| 10 | $4090.5 | $40,905.00 |
| 25 | $3945 | $98,625.00 |
| 50 | $3810 | $190,500.00 |
| 100 | $3685 | $368,500.00 |
Drop-in alternatives for 10AS057H4F34I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS057H4F34I3LG
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$2280 / Unit
View Datasheet →10AS057H4F34E3SG
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10AS057H4F34E3LG
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$1820 / Unit
View Datasheet →10AS057H3F34I2SG
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$2290 / Unit
View Datasheet →10AS057H3F34I2LG
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$2950 / Unit
View Datasheet →10AS057H3F34E2SG
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$3300 / Unit
View Datasheet →10AS057H4F34I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 1.5 GHz |
| Core Voltage (typ.) | 0.9 V |
| Package | 1152-pin FC-FBGA (35x35 mm) |
| Package Code | F34 |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | H4 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | RoHS Compliant |
| Configuration Memory | SRAM-based, volatile (external flash boot) |
| Lead-Free | Yes |
| Programming Tool | Intel Quartus Prime |
10AS057H4F34I3SG f34 Pin Configuration Guide
Complete pinout information for 10AS057H4F34I3SG (f34 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H4F34I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H4F34I3SG is suitable for 6 applications: Radar and Sonar Signal Processing, Medical Ultrasound Imaging, Software-Defined Radio Base Station, 4K/8K Video Broadcast Processing, Industrial Motor Control and Drives, Military and Defense Electronics.
Radar and Sonar Signal Processing
The 10AS057H4F34I3SG's 570K logic elements and variable-precision DSP blocks make it ideal for high-throughput radar/sonar baseband processing. The dual ARM Cortex-A9 cores run beamforming control software and target tracking algorithms, while the FPGA fabric accelerates FFT, pulse compression, and CFAR detection in parallel. Industrial temp grade supports outdoor naval and ground-radar installations. Pair with DDR4 and high-speed ADC daughter cards for multi-GS/s acquisition.
Recommended
Medical Ultrasound Imaging
The 10AS057H4F34I3SG integrates the dual ARM Cortex-A9 HPS with sufficient FPGA fabric to beamform up to 128 channels of ultrasound receive data. Linux on the HPS handles user interface, DICOM networking, and probe identification, while the FPGA performs demodulation, I/Q beamforming, and image reconstruction at line rates above 5 kHz. The industrial temp grade plus IEC 60601-style reliability enable deployment in clinical ultrasound carts.
Recommended
Software-Defined Radio Base Station
Arria 10 SX SoC FPGAs power SDR base stations by combining FPGA fabric (multi-channel DDC/DUC, crest factor reduction, DPD) with the ARM Cortex-A9 HPS running L1/L2 protocol stacks. The 10AS057H4F34I3SG's industrial temp grade and 20 nm power efficiency support small-cell and tactical-radio deployments. Transceivers connect to RF front-end ADCs/DACs at multi-GS/s rates over JESD204B/C.
Recommended
4K/8K Video Broadcast Processing
Broadcast video routers and contribution encoders rely on the 10AS057H4F34I3SG to process uncompressed 12G-SDI and IP-based SMPTE ST 2110 streams. The FPGA fabric performs chroma subsampling, scaling, multiviewer composition, and ST 2110 packetization, while the ARM cores run control software and JSON-based NMOS discovery. Industrial temp grade supports fan-less broadcast equipment racks.
Recommended
Industrial Motor Control and Drives
The 10AS057H4F34I3SG provides deterministic FPGA fabric for high-bandwidth current/torque loops plus an ARM Cortex-A9 HPS for velocity/position control, host communications (EtherCAT, PROFINET), and safety firmware. Industrial temp grade (-40C to +100C) supports outdoor and factory-floor cabinets. The HPS can run Linux with PREEMPT_RT for non-realtime tasks, leaving time-critical control entirely in FPGA hardware.
Recommended
Military and Defense Electronics
The 10AS057H4F34I3SG industrial-temperature variant serves many defense programs that do not require full MIL-STD-1540 screening, including tactical communications, electronic warfare subsystems, and SIGINT capture platforms. FPGA fabric accelerates channelization and demodulation while the ARM HPS runs situational-awareness software. Long product lifecycle support from Intel is well-suited to multi-decade defense platforms.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H4F34I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H4F34I3LG | 10AS057H4F34E3SG | 10AS057H4F34E3LG | 10AS057H3F34I2SG | 10AS057H3F34I2LG | 10AS057H3F34E2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 |
| Speed Grade | H4 | H4 | H4 | H4 | H3 (faster) | H3 (faster) | H3 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial | Industrial | Commercial |
| Transceiver Count / Rate | [DATA_NEEDED] | [DATA_NEEDED] | Higher transceiver count variant per Intel ordering scheme | Higher transceiver count variant per Intel ordering scheme | |||
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Dual ARM Cortex-A9 hard processor system integrated on-die (vs Xilinx Kintex-7 FPGA family)
- Pin-compatible family with multiple speed grades and temperature variants (vs Single-configuration discrete ASSP)
- 20 nm process technology balances performance and power (vs Older 28 nm Arria V / Cyclone V families)
Design Notes
Estimated: the 10AS057H4F34I3SG in a 35x35 mm FC-FBGA package can dissipate 25-40 W depending on FPGA utilization and transceiver activity. Use a thermal interface material (TIM) and a heatsink with a low-rise fin profile; for enclosed chassis designs add forced-air cooling. Reference Intel's AN 757 (Thermal Management for Arria 10 Devices) for theta_JA vs airflow curves. Always verify thermal performance under worst-case mission profile, not just nominal workloads.
Design the 1152-ball FC-FBGA PCB with microvia stack-up (e.g. 8-layer 1-2-6-1 or similar) per Intel's package PCB layout guidelines. Use 0.4 mm or 0.5 mm pitch fan-out, escape vias in pairs from inner rows, and use laser-drilled microvias. Match the BGA pad size and solder mask defined (SMD) or non-solder mask defined (NSMD) recommendation from Intel. Maintain a continuous ground plane under the device for return paths.
Implement a multi-rail power solution with the Arria 10 SmartVID or fixed 0.9 V core regulator (capable of 20+ A with tight load-line), 1.1 V/1.5 V/1.8 V for transceivers and HPS, and 2.5 V/3.3 V for I/O banks. Power sequencing must follow Intel's POR (power-on-reset) sequence: VCC before VCCP/VCCPT/VCCERAM, with no more than 200 ms rise time. Use a Power Management Bus (PMBus) sequencer with monitored telemetry.
Avoid these mistakes: (1) omitting the configuration flash (EPCS/EPCQ) and trying to boot from JTAG only in production; (2) confusing the F34 package code with F35 (different ball counts); (3) using LVDS lanes without proper bank I/O standards setup in Quartus Pin Planner; (4) missing HPS boot mode pin strapping resistors (BSEL, CSEL); (5) sharing reference clock outputs across banks with different I/O standards. Reference the Arria 10 device family datasheet and AN 692 for configuration and boot guidance.
Compliance Information
RoHS compliant per Orelectronics and DigiKey product listings. Industrial temperature grade designated by 'I' suffix in MPN; H4 speed grade denotes slower silicon used for cost-sensitive designs. AEC-Q100 is not applicable as this is a programmable logic device rather than an automotive-grade IC. For full material declaration, request the Intel MDDS document.