10AS066H1F34E1HG - Arria 10 SX SoC FPGA, 660K LE | Intel
Référence : 10AS066H1F34E1HG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4850 | $4 850,00 |
| 10 | $4650 | $46 500,00 |
| 100 | $4350 | $435 000,00 |
| 500 | $4100 | $2 050 000,00 |
| 1 000 | $3900 | $3 900 000,00 |
10AS066H1F34E1HG Présentation
A SoC FPGA is a class of embedded device that fuses a general-purpose applications processor with programmable logic on a single die, allowing deterministic hardware acceleration to offload latency-critical DSP and packet-processing tasks from the CPU. The Arria 10 SX family sits in the mid-range of Intel's SoC portfolio, between the lower-power Cyclone V SoC and the high-end Stratix 10 SX, offering a balance of transceiver throughput, DSP density, and ARM subsystem performance.
Key features of this 10AS066 variant include 660K logic elements, embedded hard memory controllers, high-speed transceivers, variable-precision DSP blocks, and the 32-bit ARM Cortex-A9 dual-core hard processor system (HPS) with 32 KB I-cache, 32 KB D-cache per core, NEON media engine, and a CoreSight debug/trace infrastructure. The part supports DDR4/DDR3 external memory with hardware ECC.
Architecturally, Arria 10 SX uses a 20 nm process with heterogeneous fabric tiles combining adaptive logic modules (ALMs), M20K embedded SRAM blocks, and DSP blocks that can be configured for fixed- or floating-point arithmetic. The HPS connects to the FPGA fabric through high-bandwidth bridges that allow tight coupling between software running on the cores and custom logic accelerators.
Typical applications include software-defined radio baseband, radar and electronic warfare front-ends, video broadcast encoding/decoding, 4K/8K video processing, industrial machine-vision pipelines, and aerospace telemetry. Designers choose this part when they need a mid-density programmable platform with deterministic low-latency control and an integrated OS-capable processor.
A key design consideration is PCB complexity: the 1152-ball FCBGA demands a multilayer (typically 12+ layer) PCB with microvia stack-ups, controlled-impedance routing for transceivers, and careful power-plane segmentation for the HPS and FPGA core rails. Thermal management is also critical - the package exposes a large integrated heat spreader surface for cooling.
This page synthesizes distributor pricing, verified drop-in same-package alternatives from the Arria 10 SX family, and practical design notes that are not consolidated in the manufacturer datasheet PDF.
Alternatives de remplacement direct pour 10AS066H1F34E1HG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS066H1F34E1HG (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Logic Elements, Mounting Type, Operating Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS066H1F34I1HG
✅ Remplacement direct✓ En stock
$3720 / unité
Voir la fiche technique →10AS066H2F34I1HG
✅ Remplacement direct✓ En stock
$3500 / unité
Voir la fiche technique →10AS066H3F34I1HG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS066H1F34E2HG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS066H1F34E3HG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS066H1F34E1HG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 SX |
| Device Variant | 10AS066 |
| Logic Elements | 660,000 |
| Processor Hard Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency (max) | 1.5 GHz |
| Boîtier | 1152-FCBGA (F34), 35 x 35 mm |
| User I/O Count | 492 |
| Température de fonctionnement | -40C to +100C (Industrial / E1) |
| Speed Grade | H1 |
| Memory Interface | DDR4/DDR3 with ECC (via HPS + FPGA fabric) |
| Process Node | 20 nm |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (flip-chip BGA) |
| HPS Architecture | 32-bit ARM Cortex-A9 dual-core, NEON, CoreSight debug |
| Device Type | System on Chip (SoC) FPGA |
Guide de configuration des broches du 10AS066H1F34E1HG 1152-fcbga (f34), 35 x 35 mm
Configuration des broches du 10AS066H1F34E1HG (boîtier 1152-fcbga (f34), 35 x 35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS066H1F34E1HG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS066H1F34E1HG convient pour 6 applications: Software-Defined Radio Baseband, Radar and Electronic Warfare Front-End, Broadcast Video Encoding and Processing, Industrial Machine Vision, Aerospace Telemetry and Avionics, 5G Fronthaul and Baseband Aggregation.
Software-Defined Radio Baseband
The 10AS066H1F34E1HG's 660K logic elements and high-speed transceivers make it a strong fit for SDR baseband processing, where the hardened ARM Cortex-A9 HPS runs the host OS and MAC layer while the FPGA fabric executes FFT, channelization, and modulation/demodulation pipelines. Its 1.5 GHz HPS clock and wide DDR4 bandwidth keep the control plane responsive while the fabric sustains multi-hundred-MSPS sample rates. Compared with a discrete CPU + FPGA approach, the integrated SoC reduces board area, BOM, and latency between the processor and accelerators through the AXI bridges.
Recommandé
Radar and Electronic Warfare Front-End
Radar and EW systems demand deterministic low-latency DSP and high-throughput ADC interfaces, both of which the 10AS066H1F34E1HG supports through its variable-precision DSP blocks, hard memory controllers, and serial transceivers. The dual-core Cortex-A9 HPS executes tracker and beam-steering algorithms while the FPGA fabric performs pulse compression, Doppler processing, and CFAR detection in hardware. The F34 1152-ball FCBGA package provides the signal-integrity headroom needed for multi-GHz analog front-end clocks, and the industrial -40C to +100C grade covers ground-mobile and avionics envelopes.
Recommandé
Broadcast Video Encoding and Processing
The 10AS066H1F34E1HG's mid-density fabric and dual-core ARM HPS suit broadcast video encoders and contribution codecs, where the HPS handles network protocols and the fabric implements motion estimation, transform coding, and rate-control hardware acceleration. The 492 user I/O pins support multi-stream SDI inputs and outputs plus HDMI/DisplayPort interfaces, and the integrated memory controllers feed motion-compensated frame buffers at line rate. Compared with ASIC-only solutions, the SoC FPGA approach enables rapid codec evolution (H.264 to H.265 to VVC) without board redesign.
Recommandé
Industrial Machine Vision
The 10AS066H1F34E1HG enables high-throughput machine-vision pipelines by parallelizing Bayer demosaicing, defect detection, and image preprocessing in the FPGA fabric while the ARM HPS runs the inspection decision logic and the factory-network stack (EtherCAT, PROFINET). Its industrial temperature range supports factory-floor mounting, and the abundant transceivers and LVDS pairs drive CoaXPress, Camera Link, and GigE Vision interfaces. Compared with a CPU-only vision system, the SoC FPGA offload delivers deterministic frame rates at multi-megapixel resolutions.
Recommandé
Aerospace Telemetry and Avionics
Avionics subsystems benefit from the 10AS066H1F34E1HG's hardened ARM Cortex-A9 HPS for RTOS-hosted flight-control and telemetry handling, paired with the FPGA fabric for sensor-fusion and actuator signal conditioning. The industrial temperature grade meets DO-160 environmental envelopes for unmanned aerial vehicles and ground-mobile platforms, and the wide HPS-to-fabric bandwidth supports tight-loop control with sub-microsecond latency. Compared with discrete processor-plus-FPGA designs, the integrated SoC reduces SWaP-C in size, weight, power, and cost.
Recommandé
5G Fronthaul and Baseband Aggregation
The 10AS066H1F34E1HG's high-speed transceivers and DSP density suit 5G fronthaul CPRI/eCPRI aggregation nodes, where the FPGA fabric implements PHY-layer processing, fronthaul splitting, and L1 offload, while the ARM HPS runs the management plane and synchronization (PTP/SyncE) stack. The DDR4 memory controllers feed fronthaul buffers at line rate, and the integrated SoC architecture eliminates the latency penalty of chip-to-chip links used in discrete processor-plus-FPGA designs. Industrial temperature grade supports outdoor radio unit (RU) deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS066H1F34E1HG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS066H1F34I1HG | 10AS066H2F34I1HG | 10AS066H3F34I1HG | 10AS066H1F34E2HG | 10AS066H1F34E3HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FCBGA (F34), 35 x 35 mm | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | H1 | H1 | H2 (faster) | H3 (fastest) | H1 | H1 |
| Reliability / Screening | E1 (industrial) | I1 (industrial higher tier) | I1 | I1 | E2 (extended screening) | E3 (higher screening) |
| HPS Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
| Approx. Unit Price (USD) | 4,850 | ~4,950 | ~5,400 | ~6,000 | ~5,100 | ~5,300 |
Principaux différenciateurs
- Hardened ARM Cortex-A9 dual-core HPS in the same package (vs 10AS048H1F34E1HG (lower-density Arria 10 SX in same F34))
- Higher logic density with same F34 FCBGA footprint (vs 10AS057H1F34E1HG (570K LE Arria 10 SX))
- Higher logic density with same F34 FCBGA footprint (vs 10AS032H1F34E1HG (320K LE Arria 10 SX))
Notes de conception
Estimated: the 1152-ball F34 FCBGA at 35 x 35 mm demands a high-density PCB stack-up (typically 12+ layers) with laser-drilled microvias and 0.4 mm or finer ball pitch routing. Use a symmetric stack-up with dedicated ground and power planes for each HPS and FPGA core/supply rail. Decoupling: place 100 nF X7R capacitors in a uniform pattern under the package and bulk 22 uF/47 uF polymer or tantalum capacitors on each power rail. Refer to Intel/Altera Arria 10 SoC FPGA pin connection guidelines for the exact ball-by-ball decoupling and pin-keeper recommendations.
Estimated: a 660K-logic-element SoC FPGA at full fabric and HPS utilization can dissipate 15 to 25 W, so a thermal solution is mandatory. The F34 FCBGA exposes a heat-spreader-compatible surface; pair it with a heat sink (passive for moderate loads, active for high utilization) and thermal interface material (TIM) of 0.05 to 0.1 C/W. Provide thermal vias in the PCB land pattern under the package per the Intel thermal design guide. Mount the heat sink with a clip or epoxy-rated for the industrial temperature range (-40C to +100C).
Arria 10 SX requires multiple rails - typically 0.95 V core, 1.1 V for HPS and transceivers, 1.8 V/3.3 V I/O, and a 2.5 V analog supply. Power-on sequence: the 1.8 V supply must ramp before or together with the 1.1 V supply, and the 0.95 V core must come up last; consult the device datasheet for the exact sequence. Use a multi-rail PMIC such as an Intel Enpirion or Texas Instruments TPS65086x family, and provide POR (power-on reset) and spread-spectrum clocking if electromagnetic compliance is required. A common pitfall is leaving the PORn pin floating - it must be driven by the PMIC.
Estimate/routine guidance: (1) Do not boot the HPS from NAND and QSPI simultaneously - configure the BOOTSEL pins for a single boot source. (2) When migrating between speed grades (H1, H2, H3), the same bitstream may fail timing closure at higher speed grades; re-run the Quartus Prime timing analyzer. (3) The configuration JTAG pins are 1.8 V tolerant only - level-shift if connecting to a 3.3 V host. (4) For boundary-scan, pull CONFIG_DONE high before reprogramming to avoid configuration failures. (5) Avoid routing high-speed transceiver lanes across plane splits, which introduces return-path discontinuities.
Informations de conformité
RoHS and lead-free compliant per Intel/Altera product page. AEC-Q100 is automotive-qualified - this part is not qualified; choose the Cyclone V or Arria 10 automotive-grade variants for that segment.
