10AS066H1F34E1HG - Arria 10 SX SoC FPGA, 660K LE | Intel
부품 번호: 10AS066H1F34E1HG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4650 | $46,500.00 |
| 100 | $4350 | $435,000.00 |
| 500 | $4100 | $2,050,000.00 |
| 1,000 | $3900 | $3,900,000.00 |
10AS066H1F34E1HG 개요
A SoC FPGA is a class of embedded device that fuses a general-purpose applications processor with programmable logic on a single die, allowing deterministic hardware acceleration to offload latency-critical DSP and packet-processing tasks from the CPU. The Arria 10 SX family sits in the mid-range of Intel's SoC portfolio, between the lower-power Cyclone V SoC and the high-end Stratix 10 SX, offering a balance of transceiver throughput, DSP density, and ARM subsystem performance.
Key features of this 10AS066 variant include 660K logic elements, embedded hard memory controllers, high-speed transceivers, variable-precision DSP blocks, and the 32-bit ARM Cortex-A9 dual-core hard processor system (HPS) with 32 KB I-cache, 32 KB D-cache per core, NEON media engine, and a CoreSight debug/trace infrastructure. The part supports DDR4/DDR3 external memory with hardware ECC.
Architecturally, Arria 10 SX uses a 20 nm process with heterogeneous fabric tiles combining adaptive logic modules (ALMs), M20K embedded SRAM blocks, and DSP blocks that can be configured for fixed- or floating-point arithmetic. The HPS connects to the FPGA fabric through high-bandwidth bridges that allow tight coupling between software running on the cores and custom logic accelerators.
Typical applications include software-defined radio baseband, radar and electronic warfare front-ends, video broadcast encoding/decoding, 4K/8K video processing, industrial machine-vision pipelines, and aerospace telemetry. Designers choose this part when they need a mid-density programmable platform with deterministic low-latency control and an integrated OS-capable processor.
A key design consideration is PCB complexity: the 1152-ball FCBGA demands a multilayer (typically 12+ layer) PCB with microvia stack-ups, controlled-impedance routing for transceivers, and careful power-plane segmentation for the HPS and FPGA core rails. Thermal management is also critical - the package exposes a large integrated heat spreader surface for cooling.
This page synthesizes distributor pricing, verified drop-in same-package alternatives from the Arria 10 SX family, and practical design notes that are not consolidated in the manufacturer datasheet PDF.
드롭인 대체품: 10AS066H1F34E1HG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS066H1F34E1HG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Logic Elements, Mounting Type, Operating Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS066H1F34I1HG
✅ 드롭인✓ 재고 있음
$3720 / 개
데이터시트 보기 →10AS066H2F34I1HG
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →10AS066H3F34I1HG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS066H1F34E2HG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS066H1F34E3HG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS066H1F34E1HG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Device Variant | 10AS066 |
| Logic Elements | 660,000 |
| Processor Hard Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency (max) | 1.5 GHz |
| 패키지 | 1152-FCBGA (F34), 35 x 35 mm |
| User I/O Count | 492 |
| 동작 온도 | -40C to +100C (Industrial / E1) |
| Speed Grade | H1 |
| Memory Interface | DDR4/DDR3 with ECC (via HPS + FPGA fabric) |
| Process Node | 20 nm |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| HPS Architecture | 32-bit ARM Cortex-A9 dual-core, NEON, CoreSight debug |
| Device Type | System on Chip (SoC) FPGA |
10AS066H1F34E1HG 1152-fcbga (f34), 35 x 35 mm 핀 구성 가이드
10AS066H1F34E1HG(1152-fcbga (f34), 35 x 35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS066H1F34E1HG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS066H1F34E1HG 적합 용도: 6 애플리케이션s: Software-Defined Radio Baseband, Radar and Electronic Warfare Front-End, Broadcast Video Encoding and Processing, Industrial Machine Vision, Aerospace Telemetry and Avionics, 5G Fronthaul and Baseband Aggregation.
Software-Defined Radio Baseband
The 10AS066H1F34E1HG's 660K logic elements and high-speed transceivers make it a strong fit for SDR baseband processing, where the hardened ARM Cortex-A9 HPS runs the host OS and MAC layer while the FPGA fabric executes FFT, channelization, and modulation/demodulation pipelines. Its 1.5 GHz HPS clock and wide DDR4 bandwidth keep the control plane responsive while the fabric sustains multi-hundred-MSPS sample rates. Compared with a discrete CPU + FPGA approach, the integrated SoC reduces board area, BOM, and latency between the processor and accelerators through the AXI bridges.
추천
Radar and Electronic Warfare Front-End
Radar and EW systems demand deterministic low-latency DSP and high-throughput ADC interfaces, both of which the 10AS066H1F34E1HG supports through its variable-precision DSP blocks, hard memory controllers, and serial transceivers. The dual-core Cortex-A9 HPS executes tracker and beam-steering algorithms while the FPGA fabric performs pulse compression, Doppler processing, and CFAR detection in hardware. The F34 1152-ball FCBGA package provides the signal-integrity headroom needed for multi-GHz analog front-end clocks, and the industrial -40C to +100C grade covers ground-mobile and avionics envelopes.
추천
Broadcast Video Encoding and Processing
The 10AS066H1F34E1HG's mid-density fabric and dual-core ARM HPS suit broadcast video encoders and contribution codecs, where the HPS handles network protocols and the fabric implements motion estimation, transform coding, and rate-control hardware acceleration. The 492 user I/O pins support multi-stream SDI inputs and outputs plus HDMI/DisplayPort interfaces, and the integrated memory controllers feed motion-compensated frame buffers at line rate. Compared with ASIC-only solutions, the SoC FPGA approach enables rapid codec evolution (H.264 to H.265 to VVC) without board redesign.
추천
Industrial Machine Vision
The 10AS066H1F34E1HG enables high-throughput machine-vision pipelines by parallelizing Bayer demosaicing, defect detection, and image preprocessing in the FPGA fabric while the ARM HPS runs the inspection decision logic and the factory-network stack (EtherCAT, PROFINET). Its industrial temperature range supports factory-floor mounting, and the abundant transceivers and LVDS pairs drive CoaXPress, Camera Link, and GigE Vision interfaces. Compared with a CPU-only vision system, the SoC FPGA offload delivers deterministic frame rates at multi-megapixel resolutions.
추천
Aerospace Telemetry and Avionics
Avionics subsystems benefit from the 10AS066H1F34E1HG's hardened ARM Cortex-A9 HPS for RTOS-hosted flight-control and telemetry handling, paired with the FPGA fabric for sensor-fusion and actuator signal conditioning. The industrial temperature grade meets DO-160 environmental envelopes for unmanned aerial vehicles and ground-mobile platforms, and the wide HPS-to-fabric bandwidth supports tight-loop control with sub-microsecond latency. Compared with discrete processor-plus-FPGA designs, the integrated SoC reduces SWaP-C in size, weight, power, and cost.
추천
5G Fronthaul and Baseband Aggregation
The 10AS066H1F34E1HG's high-speed transceivers and DSP density suit 5G fronthaul CPRI/eCPRI aggregation nodes, where the FPGA fabric implements PHY-layer processing, fronthaul splitting, and L1 offload, while the ARM HPS runs the management plane and synchronization (PTP/SyncE) stack. The DDR4 memory controllers feed fronthaul buffers at line rate, and the integrated SoC architecture eliminates the latency penalty of chip-to-chip links used in discrete processor-plus-FPGA designs. Industrial temperature grade supports outdoor radio unit (RU) deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS066H1F34E1HG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS066H1F34I1HG | 10AS066H2F34I1HG | 10AS066H3F34I1HG | 10AS066H1F34E2HG | 10AS066H1F34E3HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FCBGA (F34), 35 x 35 mm | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | H1 | H1 | H2 (faster) | H3 (fastest) | H1 | H1 |
| Reliability / Screening | E1 (industrial) | I1 (industrial higher tier) | I1 | I1 | E2 (extended screening) | E3 (higher screening) |
| HPS Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
| Approx. Unit Price (USD) | 4,850 | ~4,950 | ~5,400 | ~6,000 | ~5,100 | ~5,300 |
주요 차별점
- Hardened ARM Cortex-A9 dual-core HPS in the same package (vs 10AS048H1F34E1HG (lower-density Arria 10 SX in same F34))
- Higher logic density with same F34 FCBGA footprint (vs 10AS057H1F34E1HG (570K LE Arria 10 SX))
- Higher logic density with same F34 FCBGA footprint (vs 10AS032H1F34E1HG (320K LE Arria 10 SX))
설계 노트
Estimated: the 1152-ball F34 FCBGA at 35 x 35 mm demands a high-density PCB stack-up (typically 12+ layers) with laser-drilled microvias and 0.4 mm or finer ball pitch routing. Use a symmetric stack-up with dedicated ground and power planes for each HPS and FPGA core/supply rail. Decoupling: place 100 nF X7R capacitors in a uniform pattern under the package and bulk 22 uF/47 uF polymer or tantalum capacitors on each power rail. Refer to Intel/Altera Arria 10 SoC FPGA pin connection guidelines for the exact ball-by-ball decoupling and pin-keeper recommendations.
Estimated: a 660K-logic-element SoC FPGA at full fabric and HPS utilization can dissipate 15 to 25 W, so a thermal solution is mandatory. The F34 FCBGA exposes a heat-spreader-compatible surface; pair it with a heat sink (passive for moderate loads, active for high utilization) and thermal interface material (TIM) of 0.05 to 0.1 C/W. Provide thermal vias in the PCB land pattern under the package per the Intel thermal design guide. Mount the heat sink with a clip or epoxy-rated for the industrial temperature range (-40C to +100C).
Arria 10 SX requires multiple rails - typically 0.95 V core, 1.1 V for HPS and transceivers, 1.8 V/3.3 V I/O, and a 2.5 V analog supply. Power-on sequence: the 1.8 V supply must ramp before or together with the 1.1 V supply, and the 0.95 V core must come up last; consult the device datasheet for the exact sequence. Use a multi-rail PMIC such as an Intel Enpirion or Texas Instruments TPS65086x family, and provide POR (power-on reset) and spread-spectrum clocking if electromagnetic compliance is required. A common pitfall is leaving the PORn pin floating - it must be driven by the PMIC.
Estimate/routine guidance: (1) Do not boot the HPS from NAND and QSPI simultaneously - configure the BOOTSEL pins for a single boot source. (2) When migrating between speed grades (H1, H2, H3), the same bitstream may fail timing closure at higher speed grades; re-run the Quartus Prime timing analyzer. (3) The configuration JTAG pins are 1.8 V tolerant only - level-shift if connecting to a 3.3 V host. (4) For boundary-scan, pull CONFIG_DONE high before reprogramming to avoid configuration failures. (5) Avoid routing high-speed transceiver lanes across plane splits, which introduces return-path discontinuities.
규정 준수 정보
RoHS and lead-free compliant per Intel/Altera product page. AEC-Q100 is automotive-qualified - this part is not qualified; choose the Cyclone V or Arria 10 automotive-grade variants for that segment.
