10AS066H1F34E1HG - Arria 10 SX SoC FPGA, 660K LE | Intel
MPN: 10AS066H1F34E1HG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4650 | $46,500.00 |
| 100 | $4350 | $435,000.00 |
| 500 | $4100 | $2,050,000.00 |
| 1,000 | $3900 | $3,900,000.00 |
Drop-in alternatives for 10AS066H1F34E1HG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS066H1F34I1HG
β Drop-Inβ In Stock
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β Drop-Inπ Reference alternative (not in catalog)
10AS066H1F34E2HG
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10AS066H1F34E3HG
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10AS066H1F34E1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device Variant | 10AS066 |
| Logic Elements | 660,000 |
| Processor Hard Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency (max) | 1.5 GHz |
| Package | 1152-FCBGA (F34), 35 x 35 mm |
| User I/O Count | 492 |
| Operating Temperature | -40C to +100C (Industrial / E1) |
| Speed Grade | H1 |
| Memory Interface | DDR4/DDR3 with ECC (via HPS + FPGA fabric) |
| Process Node | 20 nm |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (flip-chip BGA) |
| HPS Architecture | 32-bit ARM Cortex-A9 dual-core, NEON, CoreSight debug |
| Device Type | System on Chip (SoC) FPGA |
10AS066H1F34E1HG 1152-fcbga (f34), 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS066H1F34E1HG (1152-fcbga (f34), 35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H1F34E1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H1F34E1HG is suitable for 6 applications: Software-Defined Radio Baseband, Radar and Electronic Warfare Front-End, Broadcast Video Encoding and Processing, Industrial Machine Vision, Aerospace Telemetry and Avionics, 5G Fronthaul and Baseband Aggregation.
Software-Defined Radio Baseband
The 10AS066H1F34E1HG's 660K logic elements and high-speed transceivers make it a strong fit for SDR baseband processing, where the hardened ARM Cortex-A9 HPS runs the host OS and MAC layer while the FPGA fabric executes FFT, channelization, and modulation/demodulation pipelines. Its 1.5 GHz HPS clock and wide DDR4 bandwidth keep the control plane responsive while the fabric sustains multi-hundred-MSPS sample rates. Compared with a discrete CPU + FPGA approach, the integrated SoC reduces board area, BOM, and latency between the processor and accelerators through the AXI bridges.
Recommended
Radar and Electronic Warfare Front-End
Radar and EW systems demand deterministic low-latency DSP and high-throughput ADC interfaces, both of which the 10AS066H1F34E1HG supports through its variable-precision DSP blocks, hard memory controllers, and serial transceivers. The dual-core Cortex-A9 HPS executes tracker and beam-steering algorithms while the FPGA fabric performs pulse compression, Doppler processing, and CFAR detection in hardware. The F34 1152-ball FCBGA package provides the signal-integrity headroom needed for multi-GHz analog front-end clocks, and the industrial -40C to +100C grade covers ground-mobile and avionics envelopes.
Recommended
Broadcast Video Encoding and Processing
The 10AS066H1F34E1HG's mid-density fabric and dual-core ARM HPS suit broadcast video encoders and contribution codecs, where the HPS handles network protocols and the fabric implements motion estimation, transform coding, and rate-control hardware acceleration. The 492 user I/O pins support multi-stream SDI inputs and outputs plus HDMI/DisplayPort interfaces, and the integrated memory controllers feed motion-compensated frame buffers at line rate. Compared with ASIC-only solutions, the SoC FPGA approach enables rapid codec evolution (H.264 to H.265 to VVC) without board redesign.
Recommended
Industrial Machine Vision
The 10AS066H1F34E1HG enables high-throughput machine-vision pipelines by parallelizing Bayer demosaicing, defect detection, and image preprocessing in the FPGA fabric while the ARM HPS runs the inspection decision logic and the factory-network stack (EtherCAT, PROFINET). Its industrial temperature range supports factory-floor mounting, and the abundant transceivers and LVDS pairs drive CoaXPress, Camera Link, and GigE Vision interfaces. Compared with a CPU-only vision system, the SoC FPGA offload delivers deterministic frame rates at multi-megapixel resolutions.
Recommended
Aerospace Telemetry and Avionics
Avionics subsystems benefit from the 10AS066H1F34E1HG's hardened ARM Cortex-A9 HPS for RTOS-hosted flight-control and telemetry handling, paired with the FPGA fabric for sensor-fusion and actuator signal conditioning. The industrial temperature grade meets DO-160 environmental envelopes for unmanned aerial vehicles and ground-mobile platforms, and the wide HPS-to-fabric bandwidth supports tight-loop control with sub-microsecond latency. Compared with discrete processor-plus-FPGA designs, the integrated SoC reduces SWaP-C in size, weight, power, and cost.
Recommended
5G Fronthaul and Baseband Aggregation
The 10AS066H1F34E1HG's high-speed transceivers and DSP density suit 5G fronthaul CPRI/eCPRI aggregation nodes, where the FPGA fabric implements PHY-layer processing, fronthaul splitting, and L1 offload, while the ARM HPS runs the management plane and synchronization (PTP/SyncE) stack. The DDR4 memory controllers feed fronthaul buffers at line rate, and the integrated SoC architecture eliminates the latency penalty of chip-to-chip links used in discrete processor-plus-FPGA designs. Industrial temperature grade supports outdoor radio unit (RU) deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H1F34E1HG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H1F34I1HG | 10AS066H2F34I1HG | 10AS066H3F34I1HG | 10AS066H1F34E2HG | 10AS066H1F34E3HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FCBGA (F34), 35 x 35 mm | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | H1 | H1 | H2 (faster) | H3 (fastest) | H1 | H1 |
| Reliability / Screening | E1 (industrial) | I1 (industrial higher tier) | I1 | I1 | E2 (extended screening) | E3 (higher screening) |
| HPS Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
| Approx. Unit Price (USD) | 4,850 | ~4,950 | ~5,400 | ~6,000 | ~5,100 | ~5,300 |
Key Differentiators
- Hardened ARM Cortex-A9 dual-core HPS in the same package (vs 10AS048H1F34E1HG (lower-density Arria 10 SX in same F34))
- Higher logic density with same F34 FCBGA footprint (vs 10AS057H1F34E1HG (570K LE Arria 10 SX))
- Higher logic density with same F34 FCBGA footprint (vs 10AS032H1F34E1HG (320K LE Arria 10 SX))
Design Notes
Estimated: the 1152-ball F34 FCBGA at 35 x 35 mm demands a high-density PCB stack-up (typically 12+ layers) with laser-drilled microvias and 0.4 mm or finer ball pitch routing. Use a symmetric stack-up with dedicated ground and power planes for each HPS and FPGA core/supply rail. Decoupling: place 100 nF X7R capacitors in a uniform pattern under the package and bulk 22 uF/47 uF polymer or tantalum capacitors on each power rail. Refer to Intel/Altera Arria 10 SoC FPGA pin connection guidelines for the exact ball-by-ball decoupling and pin-keeper recommendations.
Estimated: a 660K-logic-element SoC FPGA at full fabric and HPS utilization can dissipate 15 to 25 W, so a thermal solution is mandatory. The F34 FCBGA exposes a heat-spreader-compatible surface; pair it with a heat sink (passive for moderate loads, active for high utilization) and thermal interface material (TIM) of 0.05 to 0.1 C/W. Provide thermal vias in the PCB land pattern under the package per the Intel thermal design guide. Mount the heat sink with a clip or epoxy-rated for the industrial temperature range (-40C to +100C).
Arria 10 SX requires multiple rails - typically 0.95 V core, 1.1 V for HPS and transceivers, 1.8 V/3.3 V I/O, and a 2.5 V analog supply. Power-on sequence: the 1.8 V supply must ramp before or together with the 1.1 V supply, and the 0.95 V core must come up last; consult the device datasheet for the exact sequence. Use a multi-rail PMIC such as an Intel Enpirion or Texas Instruments TPS65086x family, and provide POR (power-on reset) and spread-spectrum clocking if electromagnetic compliance is required. A common pitfall is leaving the PORn pin floating - it must be driven by the PMIC.
Estimate/routine guidance: (1) Do not boot the HPS from NAND and QSPI simultaneously - configure the BOOTSEL pins for a single boot source. (2) When migrating between speed grades (H1, H2, H3), the same bitstream may fail timing closure at higher speed grades; re-run the Quartus Prime timing analyzer. (3) The configuration JTAG pins are 1.8 V tolerant only - level-shift if connecting to a 3.3 V host. (4) For boundary-scan, pull CONFIG_DONE high before reprogramming to avoid configuration failures. (5) Avoid routing high-speed transceiver lanes across plane splits, which introduces return-path discontinuities.
Compliance Information
RoHS and lead-free compliant per Intel/Altera product page. AEC-Q100 is automotive-qualified - this part is not qualified; choose the Cyclone V or Arria 10 automotive-grade variants for that segment.
