10AX090N3F40I2SG - Arria 10 GX FPGA 900K LE, 1517-FCBGA | Intel
MPN: 10AX090N3F40I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2720 | $27,200.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2410 | $1,205,000.00 |
| 1,000 | $2250 | $2,250,000.00 |
Drop-in alternatives for 10AX090N3F40I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090N3F40I2LG
✅ Drop-In✓ In Stock
$9800 / Unit
View Datasheet →10AX090N3F40E2LG
✅ Drop-In✓ In Stock
$2280 / Unit
View Datasheet →10AX090N2F40I2SG
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$6185 / Unit
View Datasheet →10AX090N2F40I2LG
✅ Drop-In✓ In Stock
$6903.28 / Unit
View Datasheet →10AX090N2F40I1SG
✅ Drop-In✓ In Stock
$2985 / Unit
View Datasheet →10AX090N3F40I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| Number of LABs/CLBs | 339,620 |
| Number of User I/Os | 600 |
| Package | 1517-BBGA, FCBGA (F40) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Speed Grade | N3 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 Hours) |
| Moisture Sensitivity | MSL3 |
| Packaging | Tray |
| RoHS Status | Compliant |
10AX090N3F40I2SG 1517-bbga, fcbga (f40) Pin Configuration Guide
Complete pinout information for 10AX090N3F40I2SG (1517-bbga, fcbga (f40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N3F40I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N3F40I2SG is suitable for 6 applications: 100G/400G Networking Line Cards, 5G Baseband and Fronthaul Processing, Radar and Beamforming Signal Processing, High-Frame-Rate Video Broadcast Processing, ASIC Prototyping and Emulation, Industrial High-Performance DSP and Test Instrumentation.
100G/400G Networking Line Cards
The 10AX090N3F40I2SG fits 100G and 400G wire-speed networking line cards because its 900K logic elements and embedded multi-gigabit transceivers provide the parallel processing bandwidth required for MAC-to-transceiver bridging, packet classification, and traffic shaping. The hard PCI Express Gen3 controllers enable direct host-side connectivity, while the 600 user I/Os support dense external memory interfaces for packet buffers. Designers place the FPGA between QSFP28/QSFP-DD cages and the host CPU, leveraging partial reconfiguration to swap in different protocol stacks without power-cycling the line card.
Recommended
5G Baseband and Fronthaul Processing
The 10AX090N3F40I2SG is well-suited for 5G baseband and fronthaul units where high DSP density and low-latency serial I/O matter. Its hard floating-point DSP blocks accelerate FFT/IFFT, channel estimation, and beamforming math, while the integrated transceivers connect directly to CPRI/eCPRI radio units. The industrial -40C to +100C temperature rating supports outdoor or hardened base-station deployments. Power sequencing and thermal design must follow Intel's transceiver signal-integrity guidelines for reliable 12.5 Gbps+ links.
Recommended
Radar and Beamforming Signal Processing
The 10AX090N3F40I2SG suits phased-array radar and acoustic beamforming where hundreds of DSP operations must execute per antenna sample. Its 900K logic elements and hardened floating-point DSP deliver the throughput needed for adaptive nulling and direction-of-arrival algorithms. The 1517-ball FCBGA package supports the high pin count demanded by multi-element antenna interfaces and high-speed ADC/DAC connections. With the N3 speed grade, designers close timing on the most aggressive DSP pipelines.
Recommended
High-Frame-Rate Video Broadcast Processing
The 10AX090N3F40I2SG fits UHD and high-frame-rate video broadcast workflows including 8K signal processing, real-time color grading, and HDR conversion. Its 600 user I/Os support multiple parallel camera or SDI links at full 12G-SDI rates, while the embedded memory bandwidth handles multi-stream pixel processing. The hardened memory controllers can drive external DDR4 frame buffers at full throughput. Designers implement color-space conversion and scaling directly in FPGA fabric to offload host CPU cycles.
Recommended
ASIC Prototyping and Emulation
The 10AX090N3F40I2SG serves as an ASIC prototyping vehicle where 900K logic elements accommodate large SoC designs partitioned across multiple FPGAs. Its embedded transceivers simplify chip-to-chip bridging in multi-FPGA prototype boards, while the high I/O count enables rapid bring-up of test interfaces. The N3 speed grade provides realistic timing margin studies before tape-out. The industrial temperature rating also supports validation under extended environmental stress tests.
Recommended
Industrial High-Performance DSP and Test Instrumentation
The 10AX090N3F40I2SG is appropriate for industrial test and measurement platforms where real-time signal processing on high-bandwidth analog front-ends is required. Its hardened floating-point DSP supports FFT-based spectrum analysis, and the embedded transceivers handle ADC-to-FPGA JESD204B/C link connectivity at multi-gigabit rates. The industrial temperature rating ensures operation in factory-floor enclosures. Designers integrate custom measurement IP alongside vendor soft cores to shorten time-to-market.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N3F40I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N3F40I2LG | 10AX090N3F40E2LG | 10AX090N2F40I2SG | 10AX090N2F40I2LG | 10AX090N2F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | N3 | N3 | N3 | N2 | N2 | N2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (Mbits) | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit |
| User I/Os | 600 | 600 | 600 | 600 | 600 | 600 |
| Lead-Free Reflow Variant | Standard | Yes (lead-free) | Yes (lead-free) | Standard | Yes (lead-free) | Standard |
Key Differentiators
- Highest-density Arria 10 GX with N3 speed grade (vs 10AX090N2F40I2SG)
- Industrial temperature rating (vs 10AX090N3F40E2SG)
- Pin-compatible with full Arria 10 GX F40 family (vs 10AX066H3F34E2SG)
Design Notes
Estimated: Arria 10 FPGAs in 1517-ball FCBGA packages can dissipate 15-25W at full transceiver and DSP utilization. With a typical theta_JA around 8-12 C/W (depending on PCB copper and airflow), a heatsink with thermal interface material is mandatory for industrial-grade operation at +100C junction. Designers should perform thermal simulation under worst-case traffic patterns, not just steady-state idle.
The 1517-ball FCBGA F40 package demands a high-density PCB stackup with microvia or via-in-pad technology. Decoupling must include a 1uF and a 0.1uF capacitor pair per supply pin within 5mm of the ball. Transceiver reference clocks require impedance-controlled routing and tight jitter budgets; place AC-coupling capacitors within 500 mils of the device ball.
Do not mix transceiver reference voltages between banks without consulting Intel's Arria 10 device handbook. Incorrect pin assignments for JTAG, MSEL, or configuration pins can prevent the device from booting. Always validate the Quartus Prime pin-out file against the F40 package ball-map before tape-out. Industrial-grade silicon has tighter timing derating than commercial-grade.
Compliance Information
RoHS compliance per Altera/Intel product page; this is an FPGA, so AEC-Q100 automotive qualification is not applicable. Lead-free reflow is supported; lead-free variant 10AX090N3F40I2LG available for higher reflow-temperature compatibility.
