10AX115N3F45E2SG - Arria 10 GX FPGA, 1.15M LEs, 1932-FCBGA | Intel
Référence : 10AX115N3F45E2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4850 | $4 850,00 |
| 10 | $4365 | $43 650,00 |
| 100 | $3880 | $388 000,00 |
| 500 | $3490 | $1 745 000,00 |
| 1 000 | $3100 | $3 100 000,00 |
10AX115N3F45E2SG Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceiver tiles, all interconnected by a programmable routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> high-density transceivers-equipped FPGAs. Arria 10 devices target mid-range applications that demand a balance of logic capacity, transceiver bandwidth, and power efficiency, sitting between the lower-cost Cyclone family and the high-performance Stratix family in Intel's portfolio.
Key features include up to 24 backplane-capable transceivers running up to 12.5 Gbps (GX variant), hardened PCIe Gen3 and Gen2 IP blocks, dual ARM Cortex-A9 MPCore hard processor system support in the SoC variants, and configurable logic elements with adaptive logic modules (ALMs). The 20 nm process allows the device to integrate 1.15 M logic elements while maintaining typical core power consumption competitive with 28 nm predecessors.
Architecturally, the Arria 10 GX combines a heterogeneous fabric of ALMs, M20K embedded SRAM blocks, variable-precision DSP blocks (27 x 27 multipliers), and hard IP for memory controllers and PCIe. The transceiver tiles support protocols such as PCIe Gen3, 10 Gigabit Ethernet, CPRI, and JESD204B, while the device's hard floating-point multipliers accelerate DSP workloads in radar, beamforming, and machine-learning inference.
Typical applications include wireless baseband processing, radar signal processing, military secure communications, broadcast video encoding, medical imaging accelerators, test and measurement equipment with high-speed serial interfaces, and high-performance computing (HPC) accelerator cards. The 768 user I/Os support parallel LVDS and DDR4 memory interfaces for data-intensive designs.
When designing with the 10AX115N3F45E2SG, attention must be paid to PCB escape routing for the 1932-ball FCBGA; the 1.0 mm ball pitch requires HDI stack-up with micro-vias. Power integrity design must consider the device's multi-rail core, transceiver, and auxiliary supplies, each requiring decoupling and bulk capacitance sized per Intel's power distribution network guidelines.
Alternatives de remplacement direct pour 10AX115N3F45E2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX115N3F45E2SG (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Process Technology, DSP Blocks, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX115N3F45E2LG
✅ Remplacement direct✓ En stock
$4325 / unité
Voir la fiche technique →10AX115N2F45E2SG
✅ Remplacement direct✓ En stock
$3570 / unité
Voir la fiche technique →10AX115N3F45E2SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| User I/Os | 768 |
| Boîtier | 1932-ball FCBGA (45 x 45 mm, 1.0 mm pitch) |
| Process Technology | 20 nm TSMC |
| Speed Grade | -2 (middle) |
| Temperature Grade | E2 (extended) |
| Transceivers | Up to 24 channels, 12.5 Gbps GX |
| DSP Blocks | Variable-precision, 27 x 27 multipliers |
| Hard Memory Controllers | Yes (DDR3/DDR4/LPDDR3) |
| Hard PCIe IP | PCIe Gen3 x8 (hard IP) |
| Hard Processor System | Not included (FPGA-only variant) |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (SMT) |
Guide de configuration des broches du 10AX115N3F45E2SG 1932-ball fcbga (45 x 45 mm, 1.0 mm pitch)
Configuration des broches du 10AX115N3F45E2SG (boîtier 1932-ball fcbga (45 x 45 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX115N3F45E2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX115N3F45E2SG convient pour 6 applications: Wireless Baseband Processing, Radar Signal Processing, Military Secure Communications, Broadcast Video Encoding, Medical Imaging Accelerators, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AX115N3F45E2SG fits wireless baseband processing because its 24 transceivers deliver 12.5 Gbps per channel for CPRI and OBSAI fronthaul links, while the 1.150M logic elements and 27 x 27 DSP blocks process multi-carrier LTE and 5G NR channel decoding. Hardened PCIe Gen3 IP connects directly to baseband SoCs, and the 768 user I/Os interface with high-speed DDR4 memory for sample buffering. Compared with discrete DSP+ASIC solutions, the FPGA reconfigurability accelerates 3GPP algorithm updates without silicon respin.
Recommandé
Radar Signal Processing
The 10AX115N3F45E2SG is well suited to phased-array radar because its 27 x 27 variable-precision DSP blocks compute FFTs, beamforming weights, and pulse compression in real time across hundreds of channels. The 68.86 Mbit embedded SRAM buffers ADC samples between antenna elements and DSP stages without external memory bottleneck. The -2 speed grade and 12.5 Gbps transceivers accept direct IF sampling from ADCs, while the 1932-ball FCBGA supports the thermal envelope of continuously-running phased-array front ends.
Recommandé
Military Secure Communications
The 10AX115N3F45E2SG serves military secure-comm and crypto-offload applications thanks to its high logic density for bulk encryption algorithms, 768 user I/Os for parallel data path integration, and the E2 temperature grade supporting industrial environmental ranges. The device's reconfigurable fabric allows field updates to cryptographic key schedules and waveform libraries without hardware replacement. Intel's Arria 10 family has been adopted in defense programs requiring long-term lifecycle support and supply chain assurance for ITAR-controlled designs.
Recommandé
Broadcast Video Encoding
The 10AX115N3F45E2SG accelerates broadcast video encoding (HEVC/H.265, AVC/H.264) because its 1.150M logic elements sustain multiple 4K60p encode pipelines in parallel, while the 24 transceivers at 12.5 Gbps handle 12G-SDI and SMPTE 2110 IP video ingest. Hard PCIe Gen3 x8 IP offloads encoded streams to host servers at line rate. Compared with software-only encoders on x86 servers, the FPGA solution delivers approximately 10x better watts-per-stream for multi-channel 4K broadcast head-ends.
Recommandé
Medical Imaging Accelerators
The 10AX115N3F45E2SG fits CT, MRI, and ultrasound imaging accelerator cards where its 27 x 27 DSP blocks execute back-projection, beamforming, and image-reconstruction kernels at sub-second latency. The 68.86 Mbit embedded SRAM holds 3D voxel volumes during iterative reconstruction, while DDR4 hard memory controllers stream completed image slices to display subsystems. The Arria 10 family is widely adopted in IEC 62304-compliant medical devices requiring IEC 60601-1 isolation between FPGA and patient-connected analog front ends.
Recommandé
Test and Measurement Instrumentation
The 10AX115N3F45E2SG is deployed in high-end oscilloscopes, protocol analyzers, and BERT testers because its 12.5 Gbps transceivers capture multi-lane PCIe Gen3, USB 3.1, and 10GbE traffic for protocol compliance testing. The 768 user I/Os interface with proprietary probe front ends, and 27 x 27 DSP blocks accelerate real-time FFT spectrum analysis. The 1932-ball FCBGA package provides the thermal headroom needed for instruments with continuous full-bandwidth acquisition and analysis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX115N3F45E2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX115N3F45E2LG | 10AX115N2F45E2SG | 10AX115N3F40E2SG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (45x45 mm) | 1932-ball FCBGA (45x45 mm) - same | 1932-ball FCBGA (45x45 mm) - same | 1517-ball FCBGA (40x40 mm) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/Os | 768 | 768 | 768 | 342 |
| Speed Grade | -2 | -2 | -2 | -2 |
| Temperature Grade | E2 (extended) | E2 (extended) | E2 (extended) | E2 (extended) |
| Transceiver Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Lead-Free Finish | Yes (G suffix) | Yes (LG suffix, RoHS) | Yes (G suffix) | Yes (G suffix) |
Principaux différenciateurs
- Highest I/O count in F45 package (vs 10AX115N3F40E2SG)
- Same-package speed grade flexibility (vs 10AX115N2F45E2SG)
- Lead-free packaging option (vs 10AX115N3F45E2LG)
Notes de conception
Estimated: The 1932-ball FCBGA at 1.0 mm pitch requires an HDI PCB stack-up with laser-drilled micro-vias (typically 0.1 mm pad, 0.25 mm capture). A 1-2 (build-up) -N-2 (core) -2-1 stack-up with 0.4 mm core pitch is recommended for BGA escape. Use blind and buried vias on the outer build-up layers; via-in-pad is allowed with proper filling and planarization. Maintain 50 ohm controlled impedance for transceiver channels and 100 ohm differential for LVDS pairs.
Estimated: At 20 nm process, the 10AX115N3F45E2SG may dissipate 15-25W typical workload depending on transceiver count and logic utilization. A heatsink with thermal interface material (TIM) is required for continuous operation; the FCBGA exposed-die variant requires a heat spreader or integrated heatsink (IHS) solution. Thermal simulation should target junction temperatures below 100C for industrial-grade E2 parts. Heat dissipation in non-forced-air environments requires a copper heat-spreader lid soldered to the BGA substrate.
The 10AX115N3F45E2SG requires multiple supply rails including core VCC (typically 0.9V), VCCPT (1.0V), VCCAUX (1.8V or 2.5V), VCCA_PLL, and VCCIO for each I/O bank. Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet before layout to size the voltage regulators. Decoupling strategy must follow Intel's PDN guidelines with bulk capacitors (typically 100-470 uF polymer) and high-frequency ceramics placed close to each supply pin. Power-on sequencing per Intel specifications must be respected to avoid latch-up.
The 12.5 Gbps transceivers require channel loss budgets under 12 dB at Nyquist frequency; use Megtron 6 or equivalent low-loss PCB material for backplane channels. AC-coupling capacitors must be placed close to the receiver pins; reference clock jitter must be under 500 fs RMS for 10GbE compliance. Pre-emphasis and equalization settings should be tuned via Intel's Transceiver Toolkit after PCB fabrication to compensate for channel variations.
Common pitfalls when designing with the 10AX115N3F45E2SG include: (1) attempting to use legacy Cyclone V power tools instead of Arria 10 PowerPlay EPE, (2) forgetting the VCCBAT battery for the security key fuse, (3) not respecting the MSL3 moisture sensitivity level and baking before reflow, (4) failing to program the configuration bitstream with proper CRC, and (5) ignoring the configuration clock source selection in the Quartus Prime Pin Planner.
Informations de conformité
RoHS compliant per Intel product family. AEC-Q100 not applicable for FPGAs (FPGAs are not automotive-qualified ICs in the AEC-Q100 sense). For automotive applications, the Cyclone 10 GX and Agilex 7 families offer AEC-Q100 variants.
