10AX115N2F45E2SG - Arria 10 GX FPGA, 1.15M LE, 1932-BGA | Intel
Référence : 10AX115N2F45E2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4850 | $4 850,00 |
| 10 | $4520 | $45 200,00 |
| 100 | $4180 | $418 000,00 |
| 500 | $3860 | $1 930 000,00 |
| 1 000 | $3570 | $3 570 000,00 |
10AX115N2F45E2SG Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by the end user via a configuration bitstream. FPGAs occupy a distinct position in the programmable logic hierarchy, sitting between fixed-function Application-Specific Integrated Circuits (ASICs) and software-programmable processors, and are categorized by logic density, embedded transceiver count, and DSP/memory resources. The Arria 10 GX family specifically targets mid-range applications that need integrated transceivers (up to 17.4 Gbps) and floating-point DSP blocks.
Key features of the 10AX115N2F45E2SG include approximately 1,150,000 logic elements, 68,857,856 bits (about 8,029 Kbits per M20K block) of embedded SRAM, 1,518 18x19 multipliers, integrated PCI Express Gen3 hard IP blocks, and up to 17.4 Gbps transceivers. The part suffix encodes speed grade 2 (slower timing, lower power), commercial temperature grade (0C to +100C junction), and lead-free RoHS-compliant assembly. The F45 package variant denotes the 45mm body size with the F1932 flip-chip BGA ball pattern.
Architecturally, the Arria 10 GX combines a sea-of-lookup-tables fabric with column-based M20K SRAM blocks, variable-precision DSP blocks supporting IEEE 754 single-precision floating point, and a hardened memory controller plus PCIe Gen3 controller. The 20nm Tri-Gate process reduces static leakage by roughly 50% compared to the prior 28nm planar Arria V generation, while the partial reconfiguration region controller allows runtime re-loading of selected fabric tiles without disrupting the rest of the device.
Typical applications include 4K UHD video broadcast encoders, software-defined radio (SDR) baseband processing, 100 Gigabit Ethernet bridge/muxponder line cards, military radar signal processing, medical imaging accelerators, and ASIC prototyping. Designers choose this part when they need transceiver-rich mid-range density without paying for the full Stratix 10 fabric.
When designing with this part, allocate power budget carefully: at full fabric utilization the device can exceed 30W, and the FCBGA requires a heatsink plus minimum 8-layer PCB with continuous via arrays under the package for thermal dissipation. Quartus Prime Pro Edition is required for compilation.
Alternatives de remplacement direct pour 10AX115N2F45E2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX115N2F45E2SG (même facteur de forme et même empreinte) — différant par Package, Transceivers, Mounting Type, Process Technology, Embedded Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX115N2F45E2LG
✅ Remplacement direct✓ En stock
$7580.55 / unité
Voir la fiche technique →10AX115N2F45E1SG
✅ Remplacement direct✓ En stock
$6240 / unité
Voir la fiche technique →10AX115N2F40I2SG
✅ Remplacement direct✓ En stock
$3750 / unité
Voir la fiche technique →10AX115H2F34E2LG
✅ Remplacement direct✓ En stock
$5950 / unité
Voir la fiche technique →10AX090N2F45E2SG
✅ Remplacement direct✓ En stock
$4943.22 / unité
Voir la fiche technique →10AX115N2F45E2SG Valeurs maximales et caractéristiques électriques
| Series | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| Embedded Memory Type | M20K SRAM blocks |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| Maximum User I/Os | 768 |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 (optional HPS configuration) |
| PCI Express Hard IP | Gen3 x8 (hardened) |
| Process Technology | Intel 20nm Tri-Gate (FinFET) |
| Boîtier | 1932-ball FCBGA, 45mm body (F45) |
| Type de montage | Surface Mount |
| Température de jonction en fonctionnement | 0C to +100C (commercial grade) |
| Speed Grade | 2 |
| Statut RoHS | Compliant |
| Configuration Memory | Internal, supports serial and parallel configuration |
Guide de configuration des broches du 10AX115N2F45E2SG 1932-ball fcbga, 45mm body (f45)
Configuration des broches du 10AX115N2F45E2SG (boîtier 1932-ball fcbga, 45mm body (f45)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX115N2F45E2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX115N2F45E2SG convient pour 6 applications: 4K UHD Broadcast Video Encoder, Software Defined Radio (SDR) Baseband, 100G Ethernet Bridge / Muxponder, Military Radar Signal Processing, Medical Imaging Accelerator, ASIC Prototyping Platform.
4K UHD Broadcast Video Encoder
The 10AX115N2F45E2SG's 1.15M logic elements and 1,518 DSP multipliers make it well-suited for real-time 4K UHD (3840x2160p60) H.264/HEVC broadcast encoders. The hardened memory controller and PCI Express Gen3 IP block allow direct attachment to host video capture cards at full line rate, while the -2 speed grade keeps total board power under 30W in typical encoder firmware. With 768 user I/Os the device can drive multiple 12G-SDI outputs natively, replacing discrete ASSP encoder chips. Designers pair it with external H.265 codec IP and DDR4 memory controllers to hit broadcast-quality bitrate targets under tight latency budgets.
Recommandé
Software Defined Radio (SDR) Baseband
For wideband SDR baseband processing in military and commercial wireless infrastructure, the 10AX115N2F45E2SG offers up to 17.4 Gbps transceivers that can directly digitize IF signals from a wideband ADC and run FFT-based channelization in firmware. The 68,857,856 bits of embedded M20K SRAM provide ample buffering for 4096-point FFT windows, while the floating-point DSP blocks accelerate polyphase filterbanks. With the optional hardened ARM Cortex-A9 subsystem, designers can run Linux for waveform management alongside FPGA fabric DSP. The -2 speed grade is favored here because DSP pipelines tolerate slightly lower Fmax in exchange for thermal headroom in sealed outdoor radio units.
Recommandé
100G Ethernet Bridge / Muxponder
The 10AX115N2F45E2SG is widely deployed in OTN (Optical Transport Network) line cards as a 100G muxponder or bridge element. Four transceivers at 25.78 Gbps implement the CAUI-4 electrical interface to optical modules, while the fabric runs PCS, FEC (KP4 RS), and MAC layers. Designers use the hardened PCIe Gen3 IP to connect to the backplane CPU blade for management. Compared to an ASSP Ethernet switch, the Arria 10 variant offers custom packet processing at line rate, making it ideal for security appliances that must inspect encrypted flows. The F45 FCBGA package provides 768 I/Os, sufficient for multiple QSFP28 cages plus a CPU interface.
Recommandé
Military Radar Signal Processing
Phased-array radar front-ends in defense electronics leverage the 10AX115N2F45E2SG for pulse compression, Doppler filtering, and constant false alarm rate (CFAR) detection across thousands of range bins. The DSP blocks accelerate FIR filters for matched pulse compression, while the embedded M20K SRAM holds 2D data matrices for synthetic aperture radar (SAR) imaging modes. The Arria 10's radiation-tolerant silicon-on-insulator variant (10AT115) is preferred for space, but the commercial 10AX115 is widely used in ground-based and naval radar cabinets. With up to 768 I/Os the FPGA can interface to multiple A/D converter banks and fibre-channel recorders simultaneously.
Recommandé
Medical Imaging Accelerator
In CT and MRI reconstruction pipelines, the 10AX115N2F45E2SG accelerates filtered back-projection (FBP) and iterative reconstruction algorithms, offloading the host workstation CPU. The DSP blocks perform floating-point convolutions and matrix rotations, while the embedded SRAM buffers 512x512x32 voxel volumes. Hospitals benefit from reduced scan reconstruction times, enabling real-time 3D visualization during procedures. The lead-free RoHS-compliant assembly meets medical device material restrictions, and the 100C junction temperature rating suits the airflow conditions of imaging-cart chassis. Compared to GPU-based solutions, the FPGA delivers deterministic latency critical for image-guided surgery.
Recommandé
ASIC Prototyping Platform
Semiconductor design houses use the 10AX115N2F45E2SG as a building block in multi-FPGA ASIC prototyping, where it emulates the target ASIC's logic at near-ASIC speed with full visibility into internal nodes. Quartus Prime Pro supports Logic Lock regions, partial reconfiguration, and incremental compile flows that let design teams iterate on RTL quickly. With 1.15M LEs per device, a 5M-gate ASIC typically maps to four 10AX115 FPGAs with a TDM-based pin-multiplexing debug fabric. The 17.4 Gbps transceivers emulate high-speed SERDES interfaces that are otherwise expensive to validate in software simulation, accelerating pre-silicon bring-up by months.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX115N2F45E2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX115N2F45E2LG | 10AX115N2F45E1SG | 10AX115N2F40I2SG | 10AX090N2F45E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F40) | 1932-ball FCBGA (F45) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 53,248,000 |
| Speed Grade | -2 | -2 | -1 (fastest) | -2 | -2 |
| Temperature Grade | Commercial (0C to +100C junction) | Commercial (0C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +100C) |
| Process Technology | 20nm Tri-Gate (FinFET) | 20nm Tri-Gate | 20nm Tri-Gate | 20nm Tri-Gate | 20nm Tri-Gate |
| RoHS Compliance | Yes (lead-free) | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Higher logic density within the same F45 FCBGA footprint (vs 10AX090N2F45E2SG)
- Lower power via -2 speed grade (vs 10AX115N2F45E1SG)
- Commercial temperature grade optimized for indoor deployment (vs 10AX115N2F40I2SG)
Notes de conception
Estimated: The 10AX115N2F45E2SG dissipates approximately 30-35W at full fabric utilization and active transceivers. The F45 FCBGA's exposed die thermal pad requires a heatsink with thermal interface material rated at <0.1 C-in2/W, plus a minimum 8-layer PCB with continuous via-in-pad arrays under the package. Without 1 oz copper pours in inner layers, junction temperature can exceed 100C and trigger thermal throttling. Plan for 400 LFM forced-air cooling in rack-mounted applications.
The 1932-ball FCBGA F45 package demands a high-density PCB stack-up: minimum 8 layers with 1 oz copper, 0.4mm pitch microvia-in-pad, and depth-controlled back-drilling on high-speed transceiver channels to suppress stub resonance. Reference Intel's AN522 and the Arria 10 PCB layout user guide for via pattern geometry. The 17.4 Gbps transceivers need 100-ohm differential pair routing with no more than two vias and continuous reference plane stitching every 200 mil.
Use Intel's Early Power Estimator (EPE) and PowerPlay Power Analyzer to model VCC, VCCP, and VCCERAM rail currents before committing to a regulator design. The -2 speed grade typically draws 15-20% less core current than -3. Decoupling requires 0402 100nF X7R capacitors within 2mm of every VCC pin plus bulk 22uF tantalum or polymer caps on each rail. Sequence core voltage before transceiver supplies to avoid in-rush latch-up.
Common pitfalls: (1) Using commercial-grade part in outdoor enclosure - select industrial 10AX115N2F40I2SG instead. (2) Omitting MSL3 bake-out before reflow can cause die-package delamination. (3) Configuration bitstream loaded from incompatible flash causes soft CRC errors - always use supported EPCQ-L or EPCQ-A devices. (4) Driving JTAG signals without series resistors causes reflection on the TCK line at 30 MHz.
Informations de conformité
Lead-free RoHS compliant per Intel Altera product ordering information. Halogen-free status not explicitly confirmed in provided data - set to unknown. AEC-Q100 not applicable for FPGA. Conflict-minerals compliance per Intel's standard disclosure.
