10AX115N2F45E2SG - Arria 10 GX FPGA, 1.15M LE, 1932-BGA | Intel
MPN: 10AX115N2F45E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4180 | $418,000.00 |
| 500 | $3860 | $1,930,000.00 |
| 1,000 | $3570 | $3,570,000.00 |
Drop-in alternatives for 10AX115N2F45E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115N2F45E2LG
✅ Drop-In✓ In Stock
$7580.55 / Unit
View Datasheet →10AX115N2F45E1SG
✅ Drop-In✓ In Stock
$6240 / Unit
View Datasheet →10AX115N2F40I2SG
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$3750 / Unit
View Datasheet →10AX115H2F34E2LG
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$5950 / Unit
View Datasheet →10AX090N2F45E2SG
✅ Drop-In✓ In Stock
$4943.22 / Unit
View Datasheet →10AX115N2F45E2SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| Embedded Memory Type | M20K SRAM blocks |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| Maximum User I/Os | 768 |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 (optional HPS configuration) |
| PCI Express Hard IP | Gen3 x8 (hardened) |
| Process Technology | Intel 20nm Tri-Gate (FinFET) |
| Package | 1932-ball FCBGA, 45mm body (F45) |
| Mounting Type | Surface Mount |
| Operating Junction Temperature | 0C to +100C (commercial grade) |
| Speed Grade | 2 |
| RoHS Status | Compliant |
| Configuration Memory | Internal, supports serial and parallel configuration |
10AX115N2F45E2SG 1932-ball fcbga, 45mm body (f45) Pin Configuration Guide
Complete pinout information for 10AX115N2F45E2SG (1932-ball fcbga, 45mm body (f45) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N2F45E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N2F45E2SG is suitable for 6 applications: 4K UHD Broadcast Video Encoder, Software Defined Radio (SDR) Baseband, 100G Ethernet Bridge / Muxponder, Military Radar Signal Processing, Medical Imaging Accelerator, ASIC Prototyping Platform.
4K UHD Broadcast Video Encoder
The 10AX115N2F45E2SG's 1.15M logic elements and 1,518 DSP multipliers make it well-suited for real-time 4K UHD (3840x2160p60) H.264/HEVC broadcast encoders. The hardened memory controller and PCI Express Gen3 IP block allow direct attachment to host video capture cards at full line rate, while the -2 speed grade keeps total board power under 30W in typical encoder firmware. With 768 user I/Os the device can drive multiple 12G-SDI outputs natively, replacing discrete ASSP encoder chips. Designers pair it with external H.265 codec IP and DDR4 memory controllers to hit broadcast-quality bitrate targets under tight latency budgets.
Recommended
Software Defined Radio (SDR) Baseband
For wideband SDR baseband processing in military and commercial wireless infrastructure, the 10AX115N2F45E2SG offers up to 17.4 Gbps transceivers that can directly digitize IF signals from a wideband ADC and run FFT-based channelization in firmware. The 68,857,856 bits of embedded M20K SRAM provide ample buffering for 4096-point FFT windows, while the floating-point DSP blocks accelerate polyphase filterbanks. With the optional hardened ARM Cortex-A9 subsystem, designers can run Linux for waveform management alongside FPGA fabric DSP. The -2 speed grade is favored here because DSP pipelines tolerate slightly lower Fmax in exchange for thermal headroom in sealed outdoor radio units.
Recommended
100G Ethernet Bridge / Muxponder
The 10AX115N2F45E2SG is widely deployed in OTN (Optical Transport Network) line cards as a 100G muxponder or bridge element. Four transceivers at 25.78 Gbps implement the CAUI-4 electrical interface to optical modules, while the fabric runs PCS, FEC (KP4 RS), and MAC layers. Designers use the hardened PCIe Gen3 IP to connect to the backplane CPU blade for management. Compared to an ASSP Ethernet switch, the Arria 10 variant offers custom packet processing at line rate, making it ideal for security appliances that must inspect encrypted flows. The F45 FCBGA package provides 768 I/Os, sufficient for multiple QSFP28 cages plus a CPU interface.
Recommended
Military Radar Signal Processing
Phased-array radar front-ends in defense electronics leverage the 10AX115N2F45E2SG for pulse compression, Doppler filtering, and constant false alarm rate (CFAR) detection across thousands of range bins. The DSP blocks accelerate FIR filters for matched pulse compression, while the embedded M20K SRAM holds 2D data matrices for synthetic aperture radar (SAR) imaging modes. The Arria 10's radiation-tolerant silicon-on-insulator variant (10AT115) is preferred for space, but the commercial 10AX115 is widely used in ground-based and naval radar cabinets. With up to 768 I/Os the FPGA can interface to multiple A/D converter banks and fibre-channel recorders simultaneously.
Recommended
Medical Imaging Accelerator
In CT and MRI reconstruction pipelines, the 10AX115N2F45E2SG accelerates filtered back-projection (FBP) and iterative reconstruction algorithms, offloading the host workstation CPU. The DSP blocks perform floating-point convolutions and matrix rotations, while the embedded SRAM buffers 512x512x32 voxel volumes. Hospitals benefit from reduced scan reconstruction times, enabling real-time 3D visualization during procedures. The lead-free RoHS-compliant assembly meets medical device material restrictions, and the 100C junction temperature rating suits the airflow conditions of imaging-cart chassis. Compared to GPU-based solutions, the FPGA delivers deterministic latency critical for image-guided surgery.
Recommended
ASIC Prototyping Platform
Semiconductor design houses use the 10AX115N2F45E2SG as a building block in multi-FPGA ASIC prototyping, where it emulates the target ASIC's logic at near-ASIC speed with full visibility into internal nodes. Quartus Prime Pro supports Logic Lock regions, partial reconfiguration, and incremental compile flows that let design teams iterate on RTL quickly. With 1.15M LEs per device, a 5M-gate ASIC typically maps to four 10AX115 FPGAs with a TDM-based pin-multiplexing debug fabric. The 17.4 Gbps transceivers emulate high-speed SERDES interfaces that are otherwise expensive to validate in software simulation, accelerating pre-silicon bring-up by months.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N2F45E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F45E2LG | 10AX115N2F45E1SG | 10AX115N2F40I2SG | 10AX090N2F45E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F40) | 1932-ball FCBGA (F45) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 53,248,000 |
| Speed Grade | -2 | -2 | -1 (fastest) | -2 | -2 |
| Temperature Grade | Commercial (0C to +100C junction) | Commercial (0C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +100C) |
| Process Technology | 20nm Tri-Gate (FinFET) | 20nm Tri-Gate | 20nm Tri-Gate | 20nm Tri-Gate | 20nm Tri-Gate |
| RoHS Compliance | Yes (lead-free) | Yes | Yes | Yes | Yes |
Key Differentiators
- Higher logic density within the same F45 FCBGA footprint (vs 10AX090N2F45E2SG)
- Lower power via -2 speed grade (vs 10AX115N2F45E1SG)
- Commercial temperature grade optimized for indoor deployment (vs 10AX115N2F40I2SG)
Design Notes
Estimated: The 10AX115N2F45E2SG dissipates approximately 30-35W at full fabric utilization and active transceivers. The F45 FCBGA's exposed die thermal pad requires a heatsink with thermal interface material rated at <0.1 C-in2/W, plus a minimum 8-layer PCB with continuous via-in-pad arrays under the package. Without 1 oz copper pours in inner layers, junction temperature can exceed 100C and trigger thermal throttling. Plan for 400 LFM forced-air cooling in rack-mounted applications.
The 1932-ball FCBGA F45 package demands a high-density PCB stack-up: minimum 8 layers with 1 oz copper, 0.4mm pitch microvia-in-pad, and depth-controlled back-drilling on high-speed transceiver channels to suppress stub resonance. Reference Intel's AN522 and the Arria 10 PCB layout user guide for via pattern geometry. The 17.4 Gbps transceivers need 100-ohm differential pair routing with no more than two vias and continuous reference plane stitching every 200 mil.
Use Intel's Early Power Estimator (EPE) and PowerPlay Power Analyzer to model VCC, VCCP, and VCCERAM rail currents before committing to a regulator design. The -2 speed grade typically draws 15-20% less core current than -3. Decoupling requires 0402 100nF X7R capacitors within 2mm of every VCC pin plus bulk 22uF tantalum or polymer caps on each rail. Sequence core voltage before transceiver supplies to avoid in-rush latch-up.
Common pitfalls: (1) Using commercial-grade part in outdoor enclosure - select industrial 10AX115N2F40I2SG instead. (2) Omitting MSL3 bake-out before reflow can cause die-package delamination. (3) Configuration bitstream loaded from incompatible flash causes soft CRC errors - always use supported EPCQ-L or EPCQ-A devices. (4) Driving JTAG signals without series resistors causes reflection on the TCK line at 30 MHz.
Compliance Information
Lead-free RoHS compliant per Intel Altera product ordering information. Halogen-free status not explicitly confirmed in provided data - set to unknown. AEC-Q100 not applicable for FPGA. Conflict-minerals compliance per Intel's standard disclosure.
