10AX115U1F45E1SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
Référence : 10AX115U1F45E1SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8500 | $8 500,00 |
| 10 | $7820 | $78 200,00 |
| 100 | $7050 | $705 000,00 |
| 500 | $6320 | $3 160 000,00 |
| 1 000 | $5680 | $5 680 000,00 |
10AX115U1F45E1SG Présentation
What is a FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O routing are defined after manufacture via a hardware description language and configuration bitstream. FPGAs sit between fixed-function ASICs and software-driven CPUs in the programmable-logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. The Arria 10 GX family specifically targets mid-range applications requiring a balance of logic density, embedded transceiver bandwidth, and power efficiency.
Key features of the 10AX115U1F45E1SG include 1,150,000 logic elements, 68,857,560 embedded memory bits, 427,200 adaptive logic modules (ALMs), and 480 user I/Os supporting multiple I/O standards. The device integrates up to 24 transceivers capable of 14.4 Gbps, embedded DSP blocks for fixed‑ and floating‑point signal processing, and a Hard Processor System option via external host CPU. Configuration is via SRAM-based volatile bitstream with AES-256 encryption support.
Architecturally, the Arria 10 GX fabric uses 20 nm Tri-Gate transistors combined with a redundant Adaptive Logic Module (ALM) structure, an embedded Hard Memory Block (M20K) hierarchy, and variable-precision DSP blocks. The transceiver tiles integrate hard PCIe Gen3 and 10 Gbps Ethernet PCS, offloading MAC-layer functions from the programmable fabric. The 0.9 V core supply achieves up to 40% lower power than the prior 28 nm Arria V generation at equivalent throughput.
Typical applications include 10/40/100 Gbps packet processing line cards, wireless baseband aggregation units, broadcast video processing, software-defined radio, ASIC prototyping, and high-speed serial backplane bridging. The high transceiver count also suits test and measurement instrumentation requiring multi-channel serial capture.
A key design consideration is PCB BGA breakout routing - 1932 balls on a 45 x 45 mm substrate typically requires an 8- to 10-layer stackup with microvia-in-pad. Power delivery to the 0.9 V core must use a multiphase VRM with bulk decoupling placed adjacent to the BGA footprint. Quartus Prime is the required design-entry and synthesis tool.
This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and BGA layout guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour 10AX115U1F45E1SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX115U1F45E1SG (même facteur de forme et même empreinte) — différant par Package, Embedded Memory Bits, Process Node, Hard Memory Controllers, Max Transceiver Data Rate.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX115U2F45E1SG
✅ Remplacement direct✓ En stock
$13900 / unité
Voir la fiche technique →10AX115U1F45E2SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AX115U1F45I1SG
✅ Remplacement direct✓ En stock
$3720 / unité
Voir la fiche technique →10AX115N2F45E2SG
✅ Remplacement direct✓ En stock
$3570 / unité
Voir la fiche technique →10AX090U1F45E1SG
✅ Remplacement direct✓ En stock
$8750 / unité
Voir la fiche technique →10AX115U1F45E1LG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AX115U1F45E1SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Device Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,560 |
| Adaptive Logic Modules (ALMs) | 427,200 |
| User I/Os | 480 |
| Transceivers | Up to 24 channels |
| Max Transceiver Data Rate | 14.4 Gbps |
| Process Node | 20 nm |
| Core Voltage | 0.9 V |
| Boîtier | 1932-ball FCBGA (F45) |
| Package Dimensions | 45 x 45 mm |
| Configuration | SRAM, AES-256 encrypted bitstream |
| Statut RoHS | Compliant |
| Lead Free | Yes |
| Design Tool | Quartus Prime |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du 10AX115U1F45E1SG 45 x 45 mm
Configuration des broches du 10AX115U1F45E1SG (boîtier 45 x 45 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX115U1F45E1SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX115U1F45E1SG convient pour 6 applications: 100G Ethernet Line Card, Wireless Baseband Aggregation, Broadcast Video Processing, ASIC Prototyping, Software-Defined Radio (SDR), Test & Measurement Instrumentation.
100G Ethernet Line Card
The 10AX115U1F45E1SG's 24 transceivers at 14.4 Gbps make it a strong fit for 100G Ethernet line cards where multiple 25G CAUI-4 lanes must terminate. Its 1.15M LE budget accommodates the full Ethernet MAC plus classification and shim logic, while embedded M20K memory (68.85 Mbit) holds packet descriptors and queue structures without external SSRAM. Power dissipation typically reaches 25-35W, requiring a multiphase 0.9V VRM.
Recommandé
Wireless Baseband Aggregation
Wireless baseband aggregation units benefit from the 10AX115U1F45E1SG's DSP block density and multi-rate transceiver coverage up to 14.4 Gbps for CPRI or OBSAI backhaul links. The 1.15M LE fabric can implement channel cards, FFT/iFFT engines, and HARQ buffers in parallel. The F45 FCBGA-1932 package's 45x45 mm footprint is acceptable for ATCA-style line cards.
Recommandé
Broadcast Video Processing
The 10AX115U1F45E1SG's logic density supports multi-channel 4K video processing, including scaling, deinterlacing, and color-space conversion pipelines. The 14.4 Gbps transceivers handle SDI (SMPTE ST-424/ST-2082) and 12G-SDI coaxial interfaces, while general-purpose I/Os at LVDS rates support parallel display interfaces. The 20 nm process keeps per-channel power low enough for rack-dense chassis.
Recommandé
ASIC Prototyping
ASIC prototyping on the 10AX115U1F45E1SG leverages 1.15M LE for mapping mid-range ASIC RTL directly into the Arria 10 GX fabric. The F45 FCBGA-1932 package's high I/O count (480 user pins) accommodates most ASIC boundary requirements. Quartus Prime's synthesis flow supports ASIC-mapped netlists with timing-driven placement, allowing accurate pre-silicon verification.
Recommandé
Software-Defined Radio (SDR)
Software-defined radio systems using the 10AX115U1F45E1SG exploit its DSP blocks for wideband DDC/DUC, FFT, and modulation/demodulation in a single device. The 14.4 Gbps transceivers digitize RF at IF or baseband over JESD204B/C interfaces to high-speed ADCs. The 68.85 Mbit embedded M20K memory holds wide sample buffers and FFT windows.
Recommandé
Test & Measurement Instrumentation
Multi-channel test and measurement instruments rely on the 10AX115U1F45E1SG for protocol-aware pattern generation, BERT, and high-speed capture. The 24 transceivers at 14.4 Gbps simultaneously drive and acquire from multiple DUT lanes, while the 1.15M LE fabric implements protocol stacks (PCIe, Ethernet, USB) as soft cores. The F45 package's high pin count supports extensive front-panel I/O.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX115U1F45E1SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX115U2F45E1SG | 10AX115U1F45E2SG | 10AX115U1F45I1SG | 10AX115N2F45E2SG | 10AX090U1F45E1SG | 10AX115U1F45E1LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 | 1,150,000 |
| Transceivers | Up to 24 channels | Up to 24 channels | Up to 24 channels | Up to 24 channels | 0 (N grade, no transceivers) | Up to 24 channels | Up to 24 channels |
| Speed Grade | U1 (commercial) | U2 (~15% higher Fmax) | E2 (extended) | I1 (industrial) | N2 + E2 | U1 | U1 |
| Embedded Memory (M20K) | 68.85 Mbit | 68.85 Mbit | 68.85 Mbit | 68.85 Mbit | 68.85 Mbit | 53.2 Mbit | 68.85 Mbit |
| User I/Os | 480 | 480 | 480 | 480 | 480 | 480 | 480 |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
Principaux différenciateurs
- Highest-density Arria 10 GX with 24 transceivers in F45 package (vs 10AX090U1F45E1SG)
- Pin-compatible speed grade flexibility (vs 10AX115U2F45E1SG)
- Logic parity vs N grade at lower cost when transceivers unused (vs 10AX115N2F45E2SG)
Notes de conception
The 1932-ball FCBGA (F45) requires an 8-10 layer PCB stackup for fanout. Use 1.0 mm ball pitch microvia-in-pad construction; outer microvias must land directly on the BGA pad to support 14.4 Gbps transceiver routing. Maintain 100 ohm differential impedance for transceiver channels and stitch ground vias every 2-3 mm around the BGA perimeter. Reference the Arria 10 device handbook for via pattern recommendations.
Estimated: at full utilization with 24 active transceivers, the 10AX115U1F45E1SG core draws ~25-35W from a 0.9 V supply. Use a multiphase VRM (4-6 phases) with output inductors sized for 25A peak; place bulk decoupling within 25 mm of the BGA. Aux rails (1.8V, 2.5V, 3.0V) each require their own decoupling network. Refer to Intel's PowerPlay early-power estimator for design-specific budgeting.
The F45 FCBGA package has a theta_JA around 8-10 C/W with a properly designed heatsink. At 30W typical dissipation, attach a 30x30 mm aluminum heatsink with thermal interface material (TIM) and 200 CFM forced airflow, or design a custom cold plate for chassis conduction cooling. Without active cooling, the junction can exceed 100 C and trigger thermal shutdown under load.
Do not confuse the 'U' grade (with transceivers) with 'S' or 'N' grade (no transceivers) when substituting - the pin assignment differs at transceiver ball locations. Also verify Quartus Prime version compatibility: Arria 10 support requires Quartus 14.0 or later, with current 24.1 release recommended. Use configuration bitstream AES encryption when shipping production units to protect IP.
Informations de conformité
RoHS compliant per DigiKey product page. Lead-free finish (LG suffix) and standard SnPb ball variants available. AEC-Q100 not applicable - FPGAs are not automotive-qualified unless explicitly Q1-marked.