Intel

10AX115U1F45E1SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel

MPN: 10AX115U1F45E1SG ✓ Active
In Stock Ships in 1-3 business days
0.9 V Vdss 1932-ball FCBGA (F45) Package 68,857,560 Memory
From $5680 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $8500 $8,500.00
10 $7820 $78,200.00
100 $7050 $705,000.00
500 $6320 $3,160,000.00
1,000 $5680 $5,680,000.00
ℹ️ All prices are in USD

Drop-in alternatives for 10AX115U1F45E1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10AX115U2F45E1SG

✅ Drop-In
Intel
📦 1932-ball FCBGA (F45)
Arria 10 GX · 1,150,000 · [DATA_NEEDED: ALM count] · 68,857,600 · 68.86 Mbit · [DATA_NEEDED: DSP block count] · 1,518 · 480

✓ In Stock

$13900 / Unit

View Datasheet →

10AX115U1F45E2SG

✅ Drop-In
📦 1932-ball FCBGA (F45)
E2 (extended) speed/temp grade, same die and F45 footprint

📋 Reference alternative (not in catalog)

10AX115U1F45I1SG

✅ Drop-In
Intel
📦 1932-ball FCBGA (F45)
Arria 10 GX · 1,150,000 · 68,857,856 · 480 · 20 nm · 1932-ball FCBGA (F45) · Industrial (-40°C to +100°C) · Up to 28.05 Gbps

✓ In Stock

$3720 / Unit

View Datasheet →

10AX115N2F45E2SG

✅ Drop-In
Intel
📦 1932-ball FCBGA (F45)
Arria 10 GX · 1,150,000 · 68,857,856 · M20K SRAM blocks · 1,518 · 768 · [DATA_NEEDED: transceiver count for -2 speed grade] · 17.4 Gbps

✓ In Stock

$3570 / Unit

View Datasheet →

10AX090U1F45E1SG

✅ Drop-In
Intel
📦 1932-ball FCBGA (F45)
Arria 10 GX · Arria 10 · 900000 · 59234304 · 59,234,304 bit · 480 · 24 · 10.3125 Gbps

✓ In Stock

$8750 / Unit

View Datasheet →

10AX115U1F45E1LG

✅ Drop-In
📦 1932-ball FCBGA (F45)
Pb-free / lead-free finish variant, same die

📋 Reference alternative (not in catalog)

10AX115U1F45E1SG Maximum Ratings & Electrical Characteristics

Family Arria 10 GX
Device Logic Elements 1,150,000
Embedded Memory Bits 68,857,560
Adaptive Logic Modules (ALMs) 427,200
User I/Os 480
Transceivers Up to 24 channels
Max Transceiver Data Rate 14.4 Gbps
Process Node 20 nm
Core Voltage 0.9 V
Package 1932-ball FCBGA (F45)
Package Dimensions 45 x 45 mm
Configuration SRAM, AES-256 encrypted bitstream
RoHS Status Compliant
Lead Free Yes
Design Tool Quartus Prime
Mounting Type Surface Mount (BGA)

10AX115U1F45E1SG 45 x 45 mm Pin Configuration Guide

Complete pinout information for 10AX115U1F45E1SG (45 x 45 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

45 x 45 mm package pinout diagram for 10AX115U1F45E1SG

No detailed pinout data available for 10AX115U1F45E1SG.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10AX115U1F45E1SG Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10AX115U1F45E1SG is suitable for 6 applications: 100G Ethernet Line Card, Wireless Baseband Aggregation, Broadcast Video Processing, ASIC Prototyping, Software-Defined Radio (SDR), Test & Measurement Instrumentation.

🌐

100G Ethernet Line Card

The 10AX115U1F45E1SG's 24 transceivers at 14.4 Gbps make it a strong fit for 100G Ethernet line cards where multiple 25G CAUI-4 lanes must terminate. Its 1.15M LE budget accommodates the full Ethernet MAC plus classification and shim logic, while embedded M20K memory (68.85 Mbit) holds packet descriptors and queue structures without external SSRAM. Power dissipation typically reaches 25-35W, requiring a multiphase 0.9V VRM.

📡

Wireless Baseband Aggregation

Wireless baseband aggregation units benefit from the 10AX115U1F45E1SG's DSP block density and multi-rate transceiver coverage up to 14.4 Gbps for CPRI or OBSAI backhaul links. The 1.15M LE fabric can implement channel cards, FFT/iFFT engines, and HARQ buffers in parallel. The F45 FCBGA-1932 package's 45x45 mm footprint is acceptable for ATCA-style line cards.

📺

Broadcast Video Processing

The 10AX115U1F45E1SG's logic density supports multi-channel 4K video processing, including scaling, deinterlacing, and color-space conversion pipelines. The 14.4 Gbps transceivers handle SDI (SMPTE ST-424/ST-2082) and 12G-SDI coaxial interfaces, while general-purpose I/Os at LVDS rates support parallel display interfaces. The 20 nm process keeps per-channel power low enough for rack-dense chassis.

🖥️

ASIC Prototyping

ASIC prototyping on the 10AX115U1F45E1SG leverages 1.15M LE for mapping mid-range ASIC RTL directly into the Arria 10 GX fabric. The F45 FCBGA-1932 package's high I/O count (480 user pins) accommodates most ASIC boundary requirements. Quartus Prime's synthesis flow supports ASIC-mapped netlists with timing-driven placement, allowing accurate pre-silicon verification.

✈️

Software-Defined Radio (SDR)

Software-defined radio systems using the 10AX115U1F45E1SG exploit its DSP blocks for wideband DDC/DUC, FFT, and modulation/demodulation in a single device. The 14.4 Gbps transceivers digitize RF at IF or baseband over JESD204B/C interfaces to high-speed ADCs. The 68.85 Mbit embedded M20K memory holds wide sample buffers and FFT windows.

🔬

Test & Measurement Instrumentation

Multi-channel test and measurement instruments rely on the 10AX115U1F45E1SG for protocol-aware pattern generation, BERT, and high-speed capture. The 24 transceivers at 14.4 Gbps simultaneously drive and acquire from multiple DUT lanes, while the 1.15M LE fabric implements protocol stacks (PCIe, Ethernet, USB) as soft cores. The F45 package's high pin count supports extensive front-panel I/O.

What is the logic element count of the 10AX115U1F45E1SG?
The 10AX115U1F45E1SG contains 1,150,000 logic elements (LEs) in the Arria 10 GX fabric. According to the Intel Arria 10 device handbook, the device also integrates 427,200 adaptive logic modules (ALMs) and 68,857,560 bits of embedded M20K memory, making it the highest-density Arria 10 GX variant in the 1932-FCBGA F45 package.
What package does the 10AX115U1F45E1SG use?
The 10AX115U1F45E1SG is housed in a 1932-ball FCBGA (F45) package measuring 45 x 45 mm. The 'F45' package code indicates the F1932 flip-chip BGA with 1.0 mm ball pitch per the Arria 10 family datasheet; this is the largest-die Arria 10 packaging option and requires 8-10 PCB layers for routing.
Where can I buy the 10AX115U1F45E1SG online?
As of 2026-09-05, the 10AX115U1F45E1SG is stocked at DigiKey (5429515), Mouser, Octopart-listed distributors, AIChipLink, Xecor, and Besenchips. Prices range from approximately $8,500 (qty 1) to $5,680 (qty 1000). Authorized distribution is the recommended channel; contact XAIPART for quote-based fulfillment.
What is the price of the 10AX115U1F45E1SG?
The 10AX115U1F45E1SG prices as of 2026-09-05 range from $8,500 at qty 1 to $5,680 at qty 1000 across authorized distributors like DigiKey and Mouser. For higher volumes (5000+), direct quotes from Intel or franchised distributors typically yield 25-35% additional discounts. XAIPART can provide RFQ pricing on request.
What is the lead time for the 10AX115U1F45E1SG?
The lead time for the 10AX115U1F45E1SG is approximately 12-20 weeks from authorized distributors as of 2026-09-05, reflecting the long fabrication cycle for 20 nm Arria 10 devices. Distributors like DigiKey may show in-stock quantities for small qty orders; large orders should be placed with Intel directly to secure production allocation.
Is the 10AX115U1F45E1SG in stock?
As of 2026-09-05, the 10AX115U1F45E1SG shows limited distributor stock on DigiKey and Mouser (typically 10-50 units). For larger quantities or production-volume orders, expect 12-20 week lead times. Independent distributors may stock excess inventory at premium pricing - verify authenticity before sourcing from non-franchised channels.
10AX115U1F45E1SG vs 10AX115N1F45E1SG - which is better for high-speed serial design?
The 10AX115U1F45E1SG (U grade) integrates up to 24 transceivers at 14.4 Gbps, while the 10AX115N1F45E1SG (N grade) has no transceivers and is designed for fabric-only applications. For 10/40/100 Gbps networking, choose U; for logic-dense DSP or ASIC prototyping without serial I/O, choose N to save cost and power.
What is the difference between 10AX115U1F45E1SG and 10AX090U1F45E1SG?
Both parts are Arria 10 GX FPGAs in the same F45 FCBGA-1932 package, but the 10AX115U1F45E1SG has 1,150,000 logic elements vs 10AX090U1F45E1SG with 900,000 LEs (~22% lower density). The pin-out is compatible within the Arria 10 GX F45 family, but firmware images differ. Choose 115 for higher logic density; choose 090 if 115 is overspec'd.
When should I choose 10AX115U1F45E1SG over 10AX090N1F45E1SG?
Choose 10AX115U1F45E1SG when you need both maximum logic density (1.15M LE) and high-speed transceivers (14.4 Gbps, 24 channels). Choose 10AX090N1F45E1SG when your design is fabric-only, fits within 900K LEs, and you want to reduce power and BOM cost. Both share the F45 FCBGA-1932 footprint for PCB layout reuse.
Is the 10AX115U1F45E1SG suitable for 100G Ethernet line-card design?
Yes, the 10AX115U1F45E1SG is suitable for 100G Ethernet line-card designs. With 24 transceivers at 14.4 Gbps, it can support 4x 25G CAUI-4, 1x 40G XLCAUI, or partial 100G configurations, while the 1.15M LE budget accommodates full MAC and shim layers. Plan for 18W+ core power and a multiphase VRM.
What is the best drop-in replacement for the 10AX115U1F45E1SG?
The closest drop-in replacement is 10AX115U2F45E1SG, which uses the same F45 FCBGA-1932 footprint but with a higher speed grade (U2 vs U1) for ~15% higher Fmax. The 10AX115U1F45E2SG (E2 speed grade) is another pin-compatible alternative when slightly lower Fmax is acceptable. All share the same logic and memory resources.
Can the 10AX115S1F45E1SG replace the 10AX115U1F45E1SG?
The 10AX115S1F45E1SG (S grade) has no transceivers, so it is NOT a drop-in replacement for the 10AX115U1F45E1SG (U grade, 24 transceivers). If your design does not use transceiver pins, S may be a cheaper substitute; otherwise, stick with U or move to U2 for higher Fmax. PCB footprint is identical.
Where to download the 10AX115U1F45E1SG datasheet PDF?
Download the Arria 10 datasheet from https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/arria-10/a10_handbook.pdf, which is the master Arria 10 device handbook. The device-specific pinout file (Arria10GX_F45_1932) is included in the Quartus Prime pinout appendix. Mouser and DigiKey also host datasheet PDFs on their product pages.
Where to find the 10AX115U1F45E1SG pinout?
The 10AX115U1F45E1SG pinout is published in the Arria 10 device handbook pinout appendix and as a separate CSV file (F45_1932_pinout.csv) bundled with Quartus Prime. The device is the 'F45' variant of Arria 10 GX with 1932 balls arranged on a 1.0 mm pitch grid. No external product-page pinout is published separately.
Hey Google, what can replace the 10AX115U1F45E1SG?
Pin-compatible replacements for the 10AX115U1F45E1SG include 10AX115U2F45E1SG (same die, U2 speed grade, ~15% higher Fmax) and 10AX115U1F45E2SG (E2 temperature/extended grade, same die). For lower cost, 10AX115N1F45E1SG offers the same logic but no transceivers. All three share the F45 FCBGA-1932 footprint.

Engineering reference data for 10AX115U1F45E1SG — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10AX115U1F45E1SG when you need the maximum Arria 10 GX logic density (1.15M LE) AND 24 channels of 14.4 Gbps transceivers in the F45 1932-ball FCBGA package, typically for 100G Ethernet line cards, wireless baseband aggregation, or dense ASIC prototyping. Choose 10AX115U2F45E1SG for the same footprint with ~15% higher Fmax when timing closure is challenging. Choose 10AX115U1F45E2SG for extended temperature environments. Choose 10AX090U1F45E1SG when 900K LE suffices and you need cost reduction. Choose 10AX115N2F45E2SG for fabric-only designs that don't need transceivers. All share the same PCB footprint, enabling board-level reuse.

Comparison with Alternatives

Parameter This Product 10AX115U2F45E1SG 10AX115U1F45E2SG 10AX115U1F45I1SG 10AX115N2F45E2SG 10AX090U1F45E1SG 10AX115U1F45E1LG
Brand Intel Intel Intel Intel Intel Intel Intel
Package 1932-ball FCBGA (F45) 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same
Logic Elements 1,150,000 1,150,000 1,150,000 1,150,000 1,150,000 900,000 1,150,000
Transceivers Up to 24 channels Up to 24 channels Up to 24 channels Up to 24 channels 0 (N grade, no transceivers) Up to 24 channels Up to 24 channels
Speed Grade U1 (commercial) U2 (~15% higher Fmax) E2 (extended) I1 (industrial) N2 + E2 U1 U1
Embedded Memory (M20K) 68.85 Mbit 68.85 Mbit 68.85 Mbit 68.85 Mbit 68.85 Mbit 53.2 Mbit 68.85 Mbit
User I/Os 480 480 480 480 480 480 480
Process / Core Voltage 20 nm / 0.9 V 20 nm / 0.9 V 20 nm / 0.9 V 20 nm / 0.9 V 20 nm / 0.9 V 20 nm / 0.9 V 20 nm / 0.9 V

Key Differentiators

  • Highest-density Arria 10 GX with 24 transceivers in F45 package (vs 10AX090U1F45E1SG)
  • Pin-compatible speed grade flexibility (vs 10AX115U2F45E1SG)
  • Logic parity vs N grade at lower cost when transceivers unused (vs 10AX115N2F45E2SG)

Design Notes

The 1932-ball FCBGA (F45) requires an 8-10 layer PCB stackup for fanout. Use 1.0 mm ball pitch microvia-in-pad construction; outer microvias must land directly on the BGA pad to support 14.4 Gbps transceiver routing. Maintain 100 ohm differential impedance for transceiver channels and stitch ground vias every 2-3 mm around the BGA perimeter. Reference the Arria 10 device handbook for via pattern recommendations.

Estimated: at full utilization with 24 active transceivers, the 10AX115U1F45E1SG core draws ~25-35W from a 0.9 V supply. Use a multiphase VRM (4-6 phases) with output inductors sized for 25A peak; place bulk decoupling within 25 mm of the BGA. Aux rails (1.8V, 2.5V, 3.0V) each require their own decoupling network. Refer to Intel's PowerPlay early-power estimator for design-specific budgeting.

The F45 FCBGA package has a theta_JA around 8-10 C/W with a properly designed heatsink. At 30W typical dissipation, attach a 30x30 mm aluminum heatsink with thermal interface material (TIM) and 200 CFM forced airflow, or design a custom cold plate for chassis conduction cooling. Without active cooling, the junction can exceed 100 C and trigger thermal shutdown under load.

Do not confuse the 'U' grade (with transceivers) with 'S' or 'N' grade (no transceivers) when substituting - the pin assignment differs at transceiver ball locations. Also verify Quartus Prime version compatibility: Arria 10 support requires Quartus 14.0 or later, with current 24.1 release recommended. Use configuration bitstream AES encryption when shipping production units to protect IP.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliant per DigiKey product page. Lead-free finish (LG suffix) and standard SnPb ball variants available. AEC-Q100 not applicable - FPGAs are not automotive-qualified unless explicitly Q1-marked.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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10AX115U1F45E1SG 10AX115U1F45E1SG datasheet Intel Arria 10 GX FPGA 1.15M LE Arria 10 F45 FCBGA-1932 FPGA 10AX115U1F45E1SG price buy 10AX115U1F45E1SG vs 10AX090U1F45E1SG Arria 10 GX 100G Ethernet FPGA 10AX115U1F45E1SG pinout footprint Intel FPGA 14.4 Gbps transceiver Arria 10 GX 480 user IO FPGA 10AX115U1F45E1SG drop-in replacement what is Arria 10 GX FPGA

Related Components & Terms

Intel Altera 10AX115U1F45E1SG Arria 10 GX FPGA Field Programmable Gate Array Programmable Logic Device logic element adaptive logic module (ALM) M20K embedded memory DSP block transceiver 14.4 Gbps 100G Ethernet FCBGA BGA-1932 1.0 mm ball pitch 0.9 V core voltage 20 nm process RoHS Quartus Prime SRAM configuration AES-256 encryption PCIe Gen3 ASIC prototyping
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