10CL006YU256C8G - Cyclone 10 LP FPGA 6K LE, 256-UBGA | Intel
Référence : 10CL006YU256C8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $39.5 | $39,50 |
| 10 | $36.8 | $368,00 |
| 100 | $32.4 | $3 240,00 |
| 500 | $28.1 | $14 050,00 |
| 1 000 | $24.6 | $24 600,00 |
10CL006YU256C8G Présentation
A Cyclone 10 LP FPGA is a reprogrammable digital logic device from Intel's Cyclone family, positioned within the broader hierarchy of programmable logic devices (PLD) -> FPGA -> low-power FPGA -> power-optimized FPGA. The Cyclone 10 LP family is the static-power-optimized successor to the Cyclone IV and Cyclone V families, designed for applications where low quiescent power and low total cost of ownership outweigh the need for high-speed transceivers or large amounts of on-chip memory.
Key features of the 10CL006YU256C8G include 6,272 logic elements (LEs), 276,480 bits (approximately 27 Kbits) of embedded SRAM, 15 embedded 18 x 18 multipliers, two general-purpose PLLs, and a hard Nios II processor support path via the Quartus Prime design software. The 176 user I/O are organized into eight I/O banks that support single-ended standards (LVCMOS, LVTTL) and differential standards (LVDS, SSTL, HSTL) up to 3.3 V. Each I/O pin has an optional weak pull-up, optional bus-hold, and a programmable slew rate, enabling direct interfacing with common parallel buses, SDRAM, and popular sensor or display interfaces.
The architectural emphasis of the Cyclone 10 LP family is reduced static power. Internal logic is implemented in 60 nm CMOS with carefully optimized clock networks and signal gating; this yields a substantially lower quiescent current than the Cyclone IV GX family at equivalent logic densities. The device supports configuration via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, and configuration bitstreams can be stored in low-cost EPCS or EPCQ serial flash devices.
Typical applications include industrial motor control and human-machine interface (HMI) boards, video bridging and image-sensor aggregation in low-cost surveillance equipment, low-density protocol-bridging logic in telecom line cards, and any embedded board that requires programmable glue logic between a microprocessor and peripherals. The 256-ball UBGA package supports reflow-compatible SMT assembly and is pin-compatible with other 10CL006 U256 variants, allowing designers to drop in a higher-speed-grade part without board rework.
When designing with this device, use Intel Quartus Prime Lite Edition for synthesis, place-and-route, and bitstream generation. Pay careful attention to the device's I/O bank VCCIO supply requirements and ensure all banks powered at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V meet the bank's reference voltage; mismatched bank voltages are a leading source of configuration failures and I/O damage in 256-UBGA Cyclone 10 LP designs.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour 10CL006YU256C8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL006YU256C8G (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Configuration Modes, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL006YU256C6G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3 / unité
Voir la fiche technique →10CL006YU256A7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$28.92 / unité
Voir la fiche technique →10CL006YU256I8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10CL010YU256C8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.95 / unité
Voir la fiche technique →10CL016YU256C8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.87 / unité
Voir la fiche technique →10CL025YU256C8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$32.54 / unité
Voir la fiche technique →10CL006YU256C8G Valeurs maximales et caractéristiques électriques
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 |
| Embedded Memory Bits | 276,480 |
| Maximum User I/O | 176 |
| Embedded 18x18 Multipliers | 15 |
| General-Purpose PLLs | 2 |
| Global Clock Networks | 20 |
| Boîtier | 256-ball UBGA (U256), 17 mm x 17 mm |
| Process Technology | 60 nm low-power CMOS |
| Speed Grade | C8 |
| Configuration Modes | AS, PS, FPP, JTAG |
| Température de fonctionnement | 0 C to +85 C (commercial) |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du 10CL006YU256C8G 256-ball ubga (u256), 17 mm x 17 mm
Configuration des broches du 10CL006YU256C8G (boîtier 256-ball ubga (u256), 17 mm x 17 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10CL006YU256C8G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10CL006YU256C8G convient pour 6 applications: Industrial Motor Control and HMI Boards, Video Bridging and Sensor Aggregation, Low-Density Telecom Protocol Bridging, Embedded Programmable Glue Logic, Automotive Infotainment and Body Electronics, IoT Edge Sensor Aggregation Gateway.
Industrial Motor Control and HMI Boards
The 10CL006YU256C8G's 6,272 logic elements and 15 embedded 18x18 multipliers make it a strong fit for industrial motor control and HMI boards. The FPGA can host a Nios II soft-core running the user-interface stack while dedicated hardware accelerators implement field-oriented control (FOC) loops at the multi-MHz PWM switching rates typical of 3-phase inverters. With 176 user I/O, the device directly interfaces to quadrature encoders, Hall sensors, BLDC/PMSM gate drivers, and the parallel RGB or LVDS link to a TFT HMI display without external bus expanders. The 256-UBGA package's 17 mm x 17 mm footprint and 1.0 mm pitch support reflow-compatible SMT assembly on standard 4-layer industrial FR-4 boards. Compared with a discrete MCU + CPLD design, integrating motor control and HMI in one Cyclone 10 LP device reduces BOM cost, simplifies PCB layout, and lets designers re-spin functionality in firmware via bitstream updates.
Recommandé
Video Bridging and Sensor Aggregation
The 10CL006YU256C8G is well suited for low-cost video bridging and image-sensor aggregation in surveillance and machine-vision equipment. Its 176 user I/O can absorb two parallel CMOS sensor interfaces (8-12 bit each) and reformat them to a single MIPI-CSI2 or LVDS output stream via soft IP cores in Quartus Prime. The 276,480 bits of embedded SRAM act as a line buffer for resolution scaling and color-space conversion, and the 15 embedded 18x18 multipliers handle real-time scaling kernels. Operating from a 1.2 V core with selectable 1.8 V or 2.5 V VCCIO banks, the device directly interfaces to common CMOS image sensors (OV7670, MT9V032, AR0134) without level shifters. For a 4-channel SD-card surveillance DVR, a single 10CL006YU256C8G can aggregate four D1 streams into one compressed H.264 output, eliminating a discrete bridge ASIC.
Recommandé
Low-Density Telecom Protocol Bridging
The 10CL006YU256C8G serves as a low-density telecom protocol bridge between line-card ASICs, FPGAs, and backplane SERDES links. Its 2 general-purpose PLLs derive independent clocks for E1/T1, I2S, and SPI-based serial backhaul interfaces, while 20 global clock networks keep skew tight across the 176 user I/O driving the bus. With embedded multipliers and SRAM blocks, the device can host custom HDLC, GFP, or 64B/66B encoding without external logic. The 256-UBGA package fits beneath a heatsink in dense line-card designs, and the C8 commercial speed grade is sufficient for indoor Central Office environments (0 C to +85 C). For protocol-bridging tasks that previously required a $50 mid-range FPGA, the 10CL006YU256C8G delivers equivalent functionality at roughly half the unit cost, while remaining bitstream-compatible with Quartus Prime IP libraries.
Recommandé
Embedded Programmable Glue Logic
The 10CL006YU256C8G is ideal as programmable glue logic between a microprocessor (NXP i.MX, Intel Atom, or AMD Ryzen Embedded) and a heterogeneous mix of peripherals. Its 176 user I/O deliver more GPIO and bus pins than any single MCU, while 6,272 logic elements are sufficient for custom I2C/SPI/I2S bridges, address decoders, watchdog timers, and bus arbiters. The 256-UBGA 1.0 mm pitch is reflow-compatible with standard SMT lines, and the C8 commercial speed grade meets the timing needs of most glue-logic paths. Compared with multiple discrete 74AVC/74LVC bus switches, a single 10CL006YU256C8G collapses 5-10 logic ICs into one device, simplifying schematic review and PCB routing. The Quartus Prime Lite Edition toolchain enables bitstream updates over JTAG or EPCQ flash in the field.
Recommandé
Automotive Infotainment and Body Electronics
The 10CL006YU256C8G commercial part can be deployed in non-safety automotive infotainment and body-electronics modules such as head-unit display controllers, HVAC control panels, and rear-seat entertainment hubs. Its 176 user I/O drive multiple RGB or LVDS displays, capacitive touch controllers, and CAN/LIN transceivers in parallel. The 6,272 logic elements host a Nios II soft-core for user-interface management while dedicated hardware blocks perform display refresh and backlight PWM dimming. For applications that require the wider -40 C to +125 C automotive temperature range, the pin-compatible 10CL006YU256A7G variant (automotive speed grade 7) drops into the same U256 footprint. Designers should verify AEC-Q100 qualification status with Intel before deploying in safety-critical ECUs.
Recommandé
IoT Edge Sensor Aggregation Gateway
The 10CL006YU256C8G is an excellent fit for IoT edge gateways that aggregate multiple low-speed sensor buses (I2C, SPI, UART, 1-Wire, GPIO) into a single Ethernet or Wi-Fi uplink. Its 6,272 logic elements can host 8-12 soft I2C or SPI controllers in parallel, while 176 user I/O accommodate dozens of sensor inputs on a star topology. The 15 embedded 18x18 multipliers can implement low-rate DSP such as moving-average filtering or threshold detection before forwarding. The 1.2 V VCCINT core keeps quiescent power low, important for battery-backed or solar-powered remote deployments. With Quartus Prime, designers can update the gateway's sensor-protocol stack in the field via the same EPCQ flash used for configuration, enabling remote feature rollouts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL006YU256C8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL006YU256C6G | 10CL006YU256A7G | 10CL006YU256I8G | 10CL010YU256C8G | 10CL016YU256C8G | 10CL025YU256C8G |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball UBGA (U256), 17x17 mm | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same |
| Logic Elements | 6,272 | 6,272 (identical) | 6,272 (identical) | 6,272 (identical) | 10,320 (+65%) | 15,408 (+146%) | 24,576 (+292%) |
| Embedded Memory (bits) | 276,480 | 276,480 (identical) | 276,480 (identical) | 276,480 (identical) | 423,936 (+53%) | 516,096 (+87%) | 608,256 (+120%) |
| User I/O (max) | 176 | 176 (identical) | 176 (identical) | 176 (identical) | 176 (identical) | 176 (identical) | 176 (identical) |
| Speed Grade | C8 (commercial) | C6 (slower, lower-margin) | A7 (automotive, -40C to +125C) | I8 (industrial, -40C to +100C) | C8 (commercial) | C8 (commercial) | C8 (commercial) |
| Embedded 18x18 Multipliers | 15 | 15 (identical) | 15 (identical) | 15 (identical) | 24 (+60%) | 56 (+273%) | 66 (+340%) |
| Configuration Flash Companion | EPCS4/EPCQ16 | EPCS4/EPCQ16 (same) | EPCS4/EPCQ16 (same) | EPCS4/EPCQ16 (same) | EPCS4/EPCQ16 (same) | EPCS16/EPCQ32 (larger bitstream) | EPCS16/EPCQ32 (larger bitstream) |
Principaux différenciateurs
- Pin-compatible with 6K to 25K LE Cyclone 10 LP family in same U256 footprint (vs 10CL025YU256C8G)
- Industrial and automotive speed-grade options in same U256 footprint (vs 10CL006YE144C8G (144-pin EQFP))
- Lowest static power in the Cyclone 10 LP family at this LE count (vs Cyclone IV E EP4CE6E22 (60 nm, older generation))
Notes de conception
Estimated: the 10CL006YU256C8G draws roughly 200-400 mA from a 1.2 V VCCINT supply in a typical design at 25 C ambient. Use a low-noise LDO (e.g. TPS7A4701) or a high-efficiency DC-DC converter with output filtering to feed the core. All eight I/O banks require their own VCCIO rails; banks powered at different voltages (1.8 V vs 3.3 V) must be supplied from independent regulators or a properly sequenced power tree. Failure to keep VCCINT monotonic during power-up is a leading cause of configuration failures on Cyclone 10 LP devices.
The 256-ball UBGA package uses a 1.0 mm ball pitch. Per IPC-7351 and the Altera package user guide, the PCB land pattern should be non-solder-mask-defined (NSMD) with a 0.55 mm pad diameter and 0.65 mm solder-mask opening to ensure reliable joint formation. Use microvia-in-pad or 0.2 mm laser-drilled vias for escape routing; standard 0.3 mm mechanical drill vias typically cannot escape the dense inner balls without layer-count penalty. Apply a uniform 17 mm x 17 mm thermal copper pour under the package, stitched with 0.3 mm thermal vias on a 1.0 mm grid, to keep junction temperature below 85 C at typical load.
Do not apply non-zero signals to any I/O pin before VCCINT and VCCIO have reached their nominal values - this can trigger I/O latch-up and permanently damage the device. Ensure CONFIG_DONE goes high within the expected ms-level window after configuration; if it stays low, check that the configuration clock (DCLK) is stable and that nCONFIG and nSTATUS are correctly pulled up to VCCIO. Also avoid routing high-speed LVDS pairs over splits in the underlying power plane, which can introduce common-mode noise and degrade eye margin. Use Quartus Prime's Pin Planner to verify all bank VCCIO assignments before generating the bitstream.
Informations de conformité
RoHS and REACH compliant per Altera/Intel product page declaration. Standard C8 variant is not AEC-Q100 qualified - select 10CL006YU256A7G for automotive applications. Halogen-free and lead-free per Intel PSG material declaration.
