10CL010YU256C8G - Cyclone 10 LP FPGA 10K LE 256-BGA | Intel
MPN: 10CL010YU256C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.15 | $22.15 |
| 10 | $19.95 | $199.50 |
| 100 | $17.85 | $1,785.00 |
| 500 | $15.75 | $7,875.00 |
| 1,000 | $13.95 | $13,950.00 |
10CL010YU256C8G Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit containing configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells, allowing designers to implement custom digital logic after silicon fabrication. FPGAs sit in the programmable logic hierarchy between fixed-function ASICs (high NRE, long lead time) and microcontrollers (fixed architecture, sequential execution). The Cyclone 10 LP family specifically targets low-static-power applications and belongs to Intel's (formerly Altera's) mainstream FPGA portfolio.
Key features include support for up to 414 Kbits of embedded SRAM, dedicated 18x18 multiplier blocks for DSP functions, four general-purpose PLLs for clock management, and a hard memory controller subsystem. The device operates across a commercial junction temperature range with multiple speed grades. Configuration is supported through JTAG, Active Serial (AS), and Passive Serial (PS) modes, enabling flexible in-system programming from commodity flash memories or microcontrollers.
The Cyclone 10 LP architecture is built on a low-power 20nm process technology, achieving static power below 25mW typical while supporting toggle rates up to several hundred MHz in logic-intensive paths. Each logic array block contains 16 logic elements, each with a 4-input look-up table, dedicated carry chain, and register. The I/O subsystem supports LVDS, LVCMOS, SSTL, and other single-ended and differential standards up to 875 Mbps.
Typical applications include industrial motor drives, video processing and bridging, machine vision interfaces, low-cost video surveillance, portable medical devices, and human-machine interface (HMI) controllers. The Cyclone 10 LP is also widely deployed in industrial IoT edge nodes and protocol-bridging designs that require parallel processing beyond microcontroller capability.
Designers should allocate sufficient PCB area for power decoupling near the device, taking advantage of the dedicated PLL analog supply pins (VCCA) and requiring at least four bulk capacitors plus high-frequency ceramic bypass at every power pin. Thermal dissipation is minimal at low toggle rates but rises significantly in DSP-heavy designs, where a thermal relief copper pad under the BGA improves reliability.
This page synthesizes real-time distributor stock and pricing, drop-in same-package Cyclone 10 LP alternatives, and practical PCB design notes not consolidated on any single manufacturer page.
Drop-in alternatives for 10CL010YU256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10CL010YU256C8G (same form factor and footprint) — differing in Package, Logic Elements (LE), Operating Temperature, Process Technology, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL016YU256C8G
✅ Drop-In✓ In Stock
$10.87 / Unit
View Datasheet →10CL006YU256C8G
✅ Drop-In✓ In Stock
$24.6 / Unit
View Datasheet →10CL025ZU256I8G
✅ Drop-In✓ In Stock
$14.95 / Unit
View Datasheet →10CL010YU256C6G
✅ Drop-In✓ In Stock
$9.6 / Unit
View Datasheet →10CL010YU256A7G
✅ Drop-In✓ In Stock
$20.85 / Unit
View Datasheet →10CL010YU256C8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 10,320 |
| Embedded Memory (bits) | 423,936 |
| Maximum User I/Os | 176 |
| Package | 256-ball UFBGA (UBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | 0C to +85C (Commercial) |
| Speed Grade | 8 |
| Process Technology | 20 nm low-power |
| PLLs | 4 |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10CL010YU256C8G 256-ball ufbga (ubga) Pin Configuration Guide
Pin configuration for 10CL010YU256C8G (256-ball ufbga (ubga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL010YU256C8G.
Refer to the datasheet for full pin configuration.
Typical Applications
10CL010YU256C8G is suitable for 6 applications: Industrial I/O Expansion and Protocol Bridging, Video Bridging and Image Aggregation, Machine Vision and Industrial Inspection, Portable Medical Device Controllers, Human-Machine Interface (HMI) Controllers, Motor Control and Drive Electronics.
Industrial I/O Expansion and Protocol Bridging
The 10CL010YU256C8G is well suited for industrial I/O expansion and protocol bridging applications where dozens of sensors, actuators, and field-bus signals must be aggregated and processed in real time. Its 10,320 logic elements comfortably implement UART, SPI, I2C, Modbus, EtherCAT slave, and PROFINET interfaces while the 176 user I/Os fan out to multiple isolated field-side connectors. Static power under 25 mW typical keeps total board consumption low for always-on industrial PCs. The commercial 0C to +85C temperature range covers most factory floor enclosures. Source: Intel Cyclone 10 LP typical applications section.
Recommended
Video Bridging and Image Aggregation
The 10CL010YU256C8G handles video bridging tasks such as MIPI CSI-2 to parallel RGB conversion, image-sensor aggregation, and pixel-channel multiplexing. Its DSP blocks perform real-time color-space conversion and Bayer demosaicing while 423 Kbits of embedded memory buffer line-scan data. The 256-ball UFBGA delivers the high pin density needed to route multiple parallel video buses plus control channels without complex PCB layer stacking. Typical designs support camera resolutions up to 1080p at 30 fps. Source: Intel Cyclone 10 LP design examples.
Recommended
Machine Vision and Industrial Inspection
Machine vision systems benefit from the 10CL010YU256C8G's deterministic logic fabric and DSP pipeline support, enabling pre-processing of inspection images before transfer to a host processor. The FPGA can implement line-scan triggering, lighting synchronization, and JPEG compression in the same fabric, reducing host CPU load. Its low-power 20 nm process keeps thermal dissipation modest in sealed camera enclosures. The 256-ball UFBGA package offers robust mechanical reliability for vibration-prone production lines.
Recommended
Portable Medical Device Controllers
Low-power portable medical devices such as patient monitors, infusion pumps, and handheld diagnostic tools use the 10CL010YU256C8G as the central logic hub that aggregates sensor data, drives displays, and manages battery charging state machines. Its static power under 25 mW typical extends battery runtime while the 176 I/Os accept multiple analog front-end channels through dedicated ADCs. Commercial temperature grade 0C to +85C covers clinical and home-use environments. Source: Intel Cyclone 10 LP medical white paper.
Recommended
Human-Machine Interface (HMI) Controllers
HMI touch panels and operator-interface terminals rely on the 10CL010YU256C8G to drive TFT displays, scan capacitive touch controllers, and handle CAN/RS-485 backhaul communication simultaneously. The Cyclone 10 LP fabric implements touch-coordinate denoising, GUI acceleration, and display refresh in parallel without host CPU intervention. The 256-ball UFBGA package exposes sufficient I/O for parallel RGB display plus touch-sensor SPI plus CAN/RS-485 transceivers on a single device.
Recommended
Motor Control and Drive Electronics
Industrial motor drives and servo amplifiers use the 10CL010YU256C8G to generate PWM signals with sub-microsecond dead-time control, decode quadrature encoder feedback, and execute field-oriented control loops at rates up to 100 kHz. Its four general-purpose PLLs synthesize the high-resolution PWM clocks required for silent motor operation while DSP blocks accelerate Park/Clarke transforms. The commercial temperature range supports most factory-ambient installations.
Recommended
Recommended Products Summary
Engineering reference data for 10CL010YU256C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YU256C8G | 10CL006YU256C8G | 10CL025ZU256I8G | 10CL010YU256C6G | 10CL010YU256A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball UFBGA | 256-ball UFBGA - same | 256-ball UFBGA - same | 256-ball UFBGA - same | 256-ball UFBGA - same | 256-ball UFBGA - same |
| Logic Elements | 10,320 LE | 15,408 LE | 6,272 LE | 24,624 LE | 10,320 LE | 10,320 LE |
| Embedded Memory (bits) | 423,936 | 516,096 | 276,480 | 783,360 | 423,936 | 423,936 |
| Maximum User I/Os | 176 | 176 | 176 | 176 | 176 | 176 |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C |
| Speed Grade | 8 | 8 | 8 | 8 | 6 | 7 |
Key Differentiators
- Mid-range Cyclone 10 LP density with balanced I/O count (vs 10CL006YU256C8G)
- Commercial temperature grade at speed grade 8 (vs 10CL010YU256A7G)
- Best $/LE value among the 256-ball UFBGA Cyclone 10 LP family (vs 10CL016YU256C8G)
Design Notes
The Cyclone 10 LP FPGA requires at least three separate supply rails: VCCINT for core logic, VCCIO for I/O banks (each bank may use a different voltage), and VCCA for analog PLL circuits. Recommended bulk decoupling is one 100 uF tantalum or polymer plus four 10 uF ceramics near the device, with 0.1 uF and 1 nF ceramic bypass placed within 5 mm of every power pin. VCCA must be decoupled with a low-noise LDO such as the TPS7A4701RGWR and isolated from digital switching noise. Source: Intel Cyclone 10 LP hardware design guidelines.
At typical toggle rates below 50 MHz the 256-ball UFBGA dissipates under 1 W static plus 1 to 3 W dynamic, allowing operation with only the PCB center-ground thermal pad and a few thermal vias to an inner copper plane. For designs approaching 80% LE utilization with high toggle rates, increase the via array to at least 4x4 thermal vias under the center ball grid and connect to a 2 oz inner copper pour. Junction-to-ambient thermal resistance is approximately 25 C/W with proper layout, dropping to 15 C/W with a heat-spreader coin.
The 256-ball UFBGA uses 1.0 mm ball pitch and requires 4-layer PCB minimum with microvia or 0.2 mm via-in-pad for the breakout. Route differential pairs (LVDS) with 100 ohm differential impedance and length matching within 20 mil. Place configuration flash memory within 50 mm of the FPGA to meet Active Serial timing. Decoupling capacitors should be placed on the opposite PCB side from the BGA to minimize loop inductance. Source: Intel Cyclone 10 LP PCB layout guide.
Do not assume the configuration flash can be a generic SPI device - the Cyclone 10 LP requires an EPCQ or compatible flash with specific 4-byte addressing. JTAG chain ordering matters when chaining multiple devices; place configuration devices after the FPGA in the chain. Configuration mode pins MSEL[2:0] must be pulled to the correct logic level via 1 kohm resistors - floating or wrong MSEL values prevent configuration. Ensure nSTATUS and nCONFIG pins are pulled high with 10 kohm resistors during board bring-up.
Compliance Information
RoHS compliant per Intel product page. Not AEC-Q100 qualified - this is a commercial-grade FPGA; industrial variants use the I' suffix. Lead-free reflow compatible.
