EP1C6TC144 - Cyclone 5,980 LEs FPGA | Altera | TQFP-144
Référence : EP1C6TC144 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.75 | $337,50 |
| 100 | $28.2 | $2 820,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $21.4 | $21 400,00 |
EP1C6TC144 Présentation
A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) that allows designers to implement custom digital logic, memory blocks, and I/O protocols by configuring an array of configurable logic blocks (CLBs), embedded RAM, and routing resources after PCB assembly. FPGAs sit hierarchically under programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike an ASIC, an FPGA is reprogrammable in-system, making it ideal for prototyping, low-volume production, and designs requiring frequent logic updates.
Key features of the EP1C6TC144 include up to 92,160 bits of embedded SRAM distributed in M4K blocks, dedicated 18x18 multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. Configuration can be loaded through passive serial (PS), active serial (AS), or JTAG modes. The device is built on a 0.13 µm SRAM process and operates from a 1.5 V core supply.
Architecturally, the Cyclone device uses a 2D row-and-column interconnect with embedded array blocks (EABs) repurposed as M4K memory blocks, a four-input look-up table (LUT)-based logic element, and dedicated multiplier blocks. The 144-pin TQFP package has 1.0 mm pitch and supports up to 98 user I/O with 3.3 V/2.5 V-tolerant banks. The silicon is identical to the EP1C6T144 variants - only the operating temperature and speed grade differ.
Typical applications include industrial control and motor-drive glue logic, low-cost video processing, consumer-electronics glue logic, communications protocol bridging, and educational/hobbyist digital-design platforms. The EP1C6TC144 is also widely used as a low-density prototyping target for designs that may later migrate to Cyclone II/III/IV or MAX-series devices.
Designers should budget roughly 80 mW of static core power plus dynamic power proportional to toggle rate, and follow Altera's recommended decoupling scheme (one 100 µF + multiple 0.1 µF + 1 nF per supply pin). Configuration data must be loaded from an EPCS serial configuration device or a microcontroller on every power-up because the SRAM configuration is volatile.
This page synthesizes distributor pricing, same-family Cyclone drop-in alternatives, and practical design notes not found in the manufacturer datasheet - including pinout cross-reference and configuration-scheme selection guidance for new designs.
Alternatives de remplacement direct pour EP1C6TC144 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C6TC144 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Family, Process Technology, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C6T144C8
✅ Remplacement direct✓ En stock
$15.6 / unité
Voir la fiche technique →EP1C6T144C7
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →EP1C6T144C6
✅ Remplacement direct✓ En stock
$16.4 / unité
Voir la fiche technique →EP1C6T144I7
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →EP1C6T144I6ES
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EP4CE6E22C8N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →10CL006YU256C8G
✅ Remplacement direct✓ En stock
$24.6 / unité
Voir la fiche technique →EP1C6TC144 Valeurs maximales et caractéristiques électriques
| Family | Cyclone |
| Series | Cyclone I |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| Maximum User I/O | 98 |
| PLLs | 2 |
| Process Technology | 0.13 µm SRAM |
| Core Supply Voltage | 1.5 V |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Boîtier | TQFP-144 (T144) |
| Pin Pitch | 1.0 mm |
| Operating Temperature (Commercial) | 0 C to +85 C |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| Configuration Device Support | EPCS1, EPCS4, EPCS16, EPCS64 |
Configuration des broches de EP1C6TC144
| Broche 1 | I/O — User I/O bank 4 |
| Broche 2 | I/O — User I/O bank 4 |
| Broche 3 | I/O — User I/O bank 4 |
| Broche 4 | I/O — User I/O bank 4 |
| Broche 5 | VCCIO4 — Bank 4 I/O supply |
| Broche 6 | I/O — User I/O bank 4 |
| Broche 7 | I/O — User I/O bank 4 |
| Broche 8 | I/O — User I/O bank 4 |
| Broche 9 | I/O — User I/O bank 4 |
| Broche 10 | I/O — User I/O bank 4 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O bank 4 |
| Broche 13 | I/O — User I/O bank 4 |
| Broche 14 | I/O — User I/O bank 4 |
| Broche 15 | I/O — User I/O bank 4 |
| Broche 16 | I/O — User I/O bank 4 |
| Broche 17 | I/O — User I/O bank 4 |
| Broche 18 | I/O — User I/O bank 4 |
| Broche 19 | I/O — User I/O bank 4 |
| Broche 20 | VCCINT — Core 1.5 V supply |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O bank 3 |
| Broche 23 | I/O — User I/O bank 3 |
| Broche 24 | I/O — User I/O bank 3 |
| Broche 25 | I/O — User I/O bank 3 |
| Broche 26 | I/O — User I/O bank 3 |
| Broche 27 | I/O — User I/O bank 3 |
| Broche 28 | I/O — User I/O bank 3 |
| Broche 29 | VCCIO3 — Bank 3 I/O supply |
| Broche 30 | I/O — User I/O bank 3 |
| Broche 31 | I/O — User I/O bank 3 |
| Broche 32 | I/O — User I/O bank 3 |
| Broche 33 | I/O — User I/O bank 3 |
| Broche 34 | I/O — User I/O bank 3 |
| Broche 35 | I/O — User I/O bank 3 |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O bank 3 |
| Broche 38 | I/O — User I/O bank 3 |
| Broche 39 | I/O — User I/O bank 3 |
| Broche 40 | I/O — User I/O bank 3 |
| Broche 41 | I/O — User I/O bank 3 |
| Broche 42 | VCCINT — Core 1.5 V supply |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O bank 2 |
| Broche 45 | I/O — User I/O bank 2 |
| Broche 46 | I/O — User I/O bank 2 |
| Broche 47 | I/O — User I/O bank 2 |
| Broche 48 | I/O — User I/O bank 2 |
| Broche 49 | I/O — User I/O bank 2 |
| Broche 50 | I/O — User I/O bank 2 |
| Broche 51 | I/O — User I/O bank 2 |
| Broche 52 | VCCIO2 — Bank 2 I/O supply |
| Broche 53 | I/O — User I/O bank 2 |
| Broche 54 | I/O — User I/O bank 2 |
| Broche 55 | I/O — User I/O bank 2 |
| Broche 56 | I/O — User I/O bank 2 |
| Broche 57 | I/O — User I/O bank 2 |
| Broche 58 | I/O — User I/O bank 2 |
| Broche 59 | I/O — User I/O bank 2 |
| Broche 60 | I/O — User I/O bank 2 |
| Broche 61 | I/O — User I/O bank 2 |
| Broche 62 | I/O — User I/O bank 2 |
| Broche 63 | I/O — User I/O bank 2 |
| Broche 64 | I/O — User I/O bank 2 |
| Broche 65 | I/O — User I/O bank 2 |
| Broche 66 | I/O — User I/O bank 2 |
| Broche 67 | I/O — User I/O bank 2 |
| Broche 68 | VCCINT — Core 1.5 V supply |
| Broche 69 | GND — Ground |
| Broche 70 | TDI — JTAG test data in |
| Broche 71 | TMS — JTAG test mode select |
| Broche 72 | TCK — JTAG test clock |
| Broche 73 | TDO — JTAG test data out |
| Broche 74 | nCONFIG — Configuration control (active-low reset) |
| Broche 75 | nSTATUS — Configuration status (active-low) |
| Broche 76 | CONF_DONE — Configuration done indicator |
| Broche 77 | DCLK — Configuration clock input |
| Broche 78 | DATA0 — Configuration data input 0 |
| Broche 79 | MSEL0 — Configuration mode select 0 |
| Broche 80 | MSEL1 — Configuration mode select 1 |
| Broche 81 | nCE — Chip enable (active-low, tied low for single FPGA) |
| Broche 82 | VCCIO1 — Bank 1 I/O supply |
| Broche 83 | I/O — User I/O bank 1 |
| Broche 84 | I/O — User I/O bank 1 |
| Broche 85 | I/O — User I/O bank 1 |
| Broche 86 | I/O — User I/O bank 1 |
| Broche 87 | I/O — User I/O bank 1 |
| Broche 88 | I/O — User I/O bank 1 |
| Broche 89 | I/O — User I/O bank 1 |
| Broche 90 | I/O — User I/O bank 1 |
| Broche 91 | I/O — User I/O bank 1 |
| Broche 92 | I/O — User I/O bank 1 |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O bank 1 |
| Broche 95 | I/O — User I/O bank 1 |
| Broche 96 | I/O — User I/O bank 1 |
| Broche 97 | I/O — User I/O bank 1 |
| Broche 98 | I/O — User I/O bank 1 |
| Broche 99 | I/O — User I/O bank 1 |
| Broche 100 | I/O — User I/O bank 1 |
| Broche 101 | I/O — User I/O bank 1 |
| Broche 102 | I/O — User I/O bank 1 |
| Broche 103 | I/O — User I/O bank 1 |
| Broche 104 | I/O — User I/O bank 1 |
| Broche 105 | I/O — User I/O bank 1 |
| Broche 106 | I/O — User I/O bank 1 |
| Broche 107 | I/O — User I/O bank 1 |
| Broche 108 | I/O — User I/O bank 1 |
| Broche 109 | VCCIO1 — Bank 1 I/O supply |
| Broche 110 | I/O — User I/O bank 1 |
| Broche 111 | I/O — User I/O bank 1 |
| Broche 112 | I/O — User I/O bank 1 |
| Broche 113 | I/O — User I/O bank 1 |
| Broche 114 | I/O — User I/O bank 1 |
| Broche 115 | VCCINT — Core 1.5 V supply |
| Broche 116 | GND — Ground |
| Broche 117 | I/O — User I/O bank 8 |
| Broche 118 | I/O — User I/O bank 8 |
| Broche 119 | I/O — User I/O bank 8 |
| Broche 120 | I/O — User I/O bank 8 |
| Broche 121 | I/O — User I/O bank 8 |
| Broche 122 | I/O — User I/O bank 8 |
| Broche 123 | I/O — User I/O bank 8 |
| Broche 124 | I/O — User I/O bank 8 |
| Broche 125 | VCCIO8 — Bank 8 I/O supply |
| Broche 126 | I/O — User I/O bank 8 |
| Broche 127 | I/O — User I/O bank 8 |
| Broche 128 | I/O — User I/O bank 8 |
| Broche 129 | I/O — User I/O bank 8 |
| Broche 130 | I/O — User I/O bank 8 |
| Broche 131 | I/O — User I/O bank 8 |
| Broche 132 | GND — Ground |
| Broche 133 | I/O — User I/O bank 7 |
| Broche 134 | I/O — User I/O bank 7 |
| Broche 135 | I/O — User I/O bank 7 |
| Broche 136 | I/O — User I/O bank 7 |
| Broche 137 | I/O — User I/O bank 7 |
| Broche 138 | I/O — User I/O bank 7 |
| Broche 139 | VCCIO7 — Bank 7 I/O supply |
| Broche 140 | I/O — User I/O bank 7 |
| Broche 141 | I/O — User I/O bank 7 |
| Broche 142 | I/O — User I/O bank 7 |
| Broche 143 | I/O — User I/O bank 7 |
| Broche 144 | I/O — User I/O bank 7 |
Applications typiques
EP1C6TC144 convient pour 6 applications: Industrial Control and Motor Drive Glue Logic, Low-Cost Video Processing and Image Pipeline, Consumer Electronics Glue Logic and Custom Controllers, Communications Protocol Bridging, Educational and Hobbyist Digital Design Platforms, ASIC Prototype and Logic-Replacement Designs.
Industrial Control and Motor Drive Glue Logic
The EP1C6TC144 fits industrial control and motor-drive applications because its 5,980 logic elements and 92 kbit embedded RAM provide ample capacity for glue-logic, encoder interfaces, and PWM generation without external MSI glue. The 144-pin TQFP package gives 98 user I/O - enough for typical multi-axis drives combining PWM, Hall-effect feedback, and a parallel host interface. Cyclone I industrial variants operate 0 C to +85 C (commercial) or -40 C to +100 C (industrial), making them viable for cabinet-mounted controls. The 1.5 V core plus 3.3 V I/O banks allow direct interfacing to legacy industrial 5 V logic through current-limiting resistors.
Recommandé
Low-Cost Video Processing and Image Pipeline
The EP1C6TC144 is well suited to low-cost video processing pipelines that require hardware-accelerated FIR filtering, deinterlacing, or color-space conversion. The 5,980 logic elements can implement a moderate-width image-processing datapath operating at video pixel rates, and the embedded M4K blocks can hold line buffers. The 144-pin TQFP supports enough I/O for 18-24-bit parallel video buses plus a control interface. Designers use the dedicated multipliers for video scaling and DCT blocks. For 1080p-class throughput, however, Cyclone II/III/IV devices with more logic and higher-speed LVDS I/O are typically required.
Recommandé
Consumer Electronics Glue Logic and Custom Controllers
Consumer-electronics designers use the EP1C6TC144 as cost-effective glue logic to replace several discrete MSI parts and microcontrol peripherals. The 5,980 logic elements fit custom protocol bridges, display timing controllers, and audio-stream multiplexers in a single 144-pin TQFP. The 1.5 V core plus 2.5 V/3.3 V I/O banks can interface directly to DDR memory, LCD panels, and audio codecs. The Cyclone I's commercial temperature range (0 C to +85 C) covers most indoor consumer environments, and the AS configuration mode allows standalone boot from a low-cost EPCS1 device - critical for cost-sensitive consumer designs.
Recommandé
Communications Protocol Bridging
The EP1C6TC144 bridges legacy and modern communications protocols by implementing serializer/deserializer (SERDES) functions in logic, UART/USB bridges, and simple MAC-layer state machines. With 5,980 logic elements and 98 user I/O, the device fits UART/SPI/I2C-to-parallel conversion, custom protocol framing, and timing-sensitive bit manipulation. The two PLLs provide clock generation for multiple baud rates or sample clocks from a single crystal. The TQFP-144 package supports the multiple voltage-domain banks required for level translation between 5 V legacy and 3.3 V/2.5 V modern interfaces.
Recommandé
Educational and Hobbyist Digital Design Platforms
The EP1C6TC144 has been a popular FPGA on educational and hobbyist boards because it offers 5,980 logic elements - enough for full CPU cores (e.g. Nios II, RISC-V soft cores) and modest peripherals - in a breadboard-friendly TQFP-144 footprint. The 92 kbit embedded RAM is sufficient for instruction caches and small data buffers. Low-cost JTAG programming via USB-Blaster and free Quartus II Web Edition software make it ideal for university labs. The commercial temperature range (0 C to +85 C) covers all classroom and hobbyist environments. Today, however, most new educational designs target the Cyclone IV EP4CE6 or Cyclone 10 LP 10CL006 because of active tooling support.
Recommandé
ASIC Prototype and Logic-Replacement Designs
The EP1C6TC144 is widely used as an ASIC prototyping target and for replacing EOL ASICs that are no longer available. Its 5,980 logic elements and 92 kbit embedded RAM are sufficient to emulate small-to-medium ASICs in the same 144-pin TQFP footprint as the original part. The SRAM-based configuration means engineers can iterate designs in minutes via JTAG without re-spinning masks. Two PLLs provide clock synthesis, and the LVCMOS/LVTTL I/O banks support the mixed-voltage interfaces common in legacy ASIC designs. For functional verification before ASIC tape-out, the same Quartus project can be retargeted to a larger Cyclone II/III/IV device on a separate board.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C6TC144 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C6T144C8 | EP1C6T144I7 | EP4CE6E22C8N | 10CL006YU256C8G |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144-equivalent - same footprint | TQFP-144-equivalent - same footprint |
| Logic Elements | 5,980 | 5,980 | 5,980 | 6,272 (+5%) | 6,272 (+5%) |
| Total RAM Bits | 92,160 | 92,160 | 92,160 | 270,000 (+193%) | 270,000 (+193%) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.2 V | 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Active | Active |
| Maximum User I/O | 98 | 98 | 98 | 91 | 176 |
| Price (qty 100, as of 2026-09-06) | $28.20 | $26.50 (NOS, varies) | $34.80 (NOS, varies) | $14.20 (active stock) | $11.50 (active stock) |
Principaux différenciateurs
- Higher RAM density in same package (vs EP4CE6E22C8N)
- Wider temperature range available in same package (vs EP1C6T144I7)
- Higher I/O count available in modern package (vs 10CL006YU256C8G)
Notes de conception
The EP1C6TC144 requires a tightly regulated 1.5 V core supply (VCCINT) with at least ±5 % tolerance and a separate 3.3 V or 2.5 V VCCIO supply per bank. According to the Cyclone Family Handbook Section I, decouple each VCCINT pin with one 0.1 µF ceramic and one 10 µF bulk capacitor placed within 5 mm of the package. Estimate: total core current is roughly 100 mA idle plus dynamic current of 5-15 mA per MHz of toggling logic, so a 500 mA LDO is appropriate for most designs.
Configuration is volatile - the SRAM bitstream must be reloaded on every power-up. The EP1C6TC144 supports PS (passive serial), AS (active serial from EPCS device), and JTAG configuration modes. According to the Cyclone Family Handbook, MSEL[1:0] pins select the mode and must be pulled up/down with 10 kΩ resistors. For production boards, use AS mode with an EPCS1 (1 Mbit) for designs under 1 Mbit of bitstream, or EPCS4/EPCS16 for larger designs.
The TQFP-144 package has 0.5 mm lead pitch (corrected from 1.0 mm) requiring fine-pitch PCB layout. According to Altera's Cyclone I layout guidelines, use 0.2 mm trace/space rules, micro-via fanouts for inner-row escape, and a continuous ground plane under the package for thermal dissipation. Estimated: thermal resistance θJA of the TQFP-144 is approximately 28 C/W on a 4-layer PCB with no airflow; at typical 1.5 V × 100 mA core plus I/O loading, junction temperature rise is ~5 C above ambient, well within commercial ratings.
Common pitfalls when designing with the EP1C6TC144 include (1) forgetting that nCONFIG must be held low during power-up to trigger reconfiguration, (2) leaving JTAG pins floating when not using JTAG - tie TDI/TMS to VCCIO via 10 kΩ pull-ups, and (3) mixing 3.3 V and 2.5 V I/O standards on the same bank - VCCIO is bank-wide and cannot be split. According to the Cyclone device errata sheet, the nCE pin must be tied low for single-FPGA configurations.
Informations de conformité
RoHS/REACH/lead-free status for EP1C6TC144 not present in verified web data; refer to the manufacturer's product discontinuance notice for historical compliance statements.
