10CL016YM164C8G - Cyclone 10 LP FPGA, 15K LE, 164-MBGA | Intel
Référence : 10CL016YM164C8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $21.95 | $2 195,00 |
| 500 | $19.2 | $9 600,00 |
| 1 000 | $17.1 | $17 100,00 |
10CL016YM164C8G Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that sits between fixed-function ASICs and software-defined CPUs: it implements arbitrary digital logic through a fabric of look up tables (LUTs), flip-flops, routing switches, and hard IP blocks (memory, PLLs, DSP, transceivers), all configured by an SRAM bitstream at power-up. Within Intel's portfolio, the Cyclone 10 LP family occupies the low-power, low-cost tier beneath Cyclone 10 GX and the high-performance Stratix families, aimed at volume production in industrial, automotive infotainment, video, and IoT edge designs.
The 10CL016YM164C8G is the 164-MBGA option of the 10CL016 device, distinguished by its small 8x8 mm package footprint relative to the larger F484 BGA and E144 EQFP variants. It exposes 87 general-purpose user I/Os (versus up to 340 in the F484 package), 504 kbit of M9K embedded memory blocks, two general-purpose PLLs, and four internal configuration clock sources. Configuration is supported through JTAG, serial (AS) flash, and passive (PS) modes. The C8 speed grade and 0 °C to +85 °C commercial temperature suffix make it the mainstream commercial-grade variant for non-automotive designs.
The part is supported by the Quartus Prime Lite/Standard/Pro design suite, with pre-built IP cores for DDR3, Ethernet, Nios II soft processors, and common video/industrial interfaces. Typical application areas include industrial motor control, machine vision pre-processing, video bridging, low-cost software-defined radio front-ends, sensor aggregation gateways, and consumer electronics requiring flexible glue logic. Designers selecting the M164 package should verify that 87 I/Os are sufficient for their interface requirements, as the F484 variant offers substantially more user I/Os at the cost of board area.
Power-rail design should follow the Intel Cyclone 10 LP pin connection guidelines: VCCINT (1.2 V core) requires bulk decoupling of at least 22 µF plus 0.1 µF per supply pin group, VCCIO banks must each be tied to 1.2/1.5/1.8/2.5/3.3 V per bank, and VCCA_PLL (2.5 V) plus GNDA_PLL must be star-grounded for the PLL pair. The MBGA package is 8x8 mm with 0.5 mm pitch and is not hand-solderable; reflow profile is per JEDEC J-STD-020 MSL-3 (peak 260 °C).
This page synthesizes distributor stock and pricing, full pinout, drop-in alternative FPGAs from the same Cyclone 10 LP family, and practical design notes not consolidated in the manufacturer datasheet, supporting faster component selection and BOM risk assessment.
Alternatives de remplacement direct pour 10CL016YM164C8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL016YM164C8G (même facteur de forme et même empreinte) — différant par Package, MSL Level, Core Voltage, Embedded Memory, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL016YM164C6G
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →10CL016YM164A7G
✅ Remplacement direct✓ En stock
$16.75 / unité
Voir la fiche technique →10CL016YM164A7G
✅ Remplacement direct✓ En stock
$16.75 / unité
Voir la fiche technique →10CL016YM164C8G Valeurs maximales et caractéristiques électriques
| Series | Cyclone 10 LP |
| Device Family | 10CL016 |
| Logic Elements (LE) | 15,408 |
| Adaptive Logic Modules (ALM) | 9,638 |
| Embedded Memory (bits) | 516,096 (504 kbit M9K blocks) |
| Embedded Multipliers (18x18) | 56 |
| User I/Os | 87 |
| PLLs | 2 (general-purpose) |
| Configuration Schemes | JTAG, AS (serial), PS (passive) |
| Température de fonctionnement | 0 °C to +85 °C (commercial) |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| PLL Analog Voltage (VCCA_PLL) | 2.5 V |
| Boîtier | 164-MBGA (M164), 8 x 8 mm, 0.5 mm pitch |
| Type de montage | Surface Mount |
| Niveau MSL | MSL-3 per JEDEC J-STD-020 |
| Statut RoHS | Compliant |
| Speed Grade | C8 (commercial, 8 speed grade) |
| Process Node | 60 nm low-power |
| Design Software | Intel Quartus Prime Lite/Standard/Pro |
Configuration des broches de 10CL016YM164C8G
| Broche A1 | IO — User I/O (bank 1A) |
| Broche A2 | IO — User I/O (bank 1A) |
| Broche A3 | VCCIO1A — I/O bank 1A supply |
| Broche A4 | IO — User I/O (bank 1A) |
| Broche A5 | IO — User I/O (bank 1A) |
| Broche A6 | GND — Ground |
| Broche A7 | IO — User I/O (bank 2A) |
| Broche A8 | VCCIO2A — I/O bank 2A supply |
| Broche A9 | IO — User I/O (bank 2A) |
| Broche A10 | IO — User I/O (bank 2A) |
| Broche A11 | VCCINT — Core 1.2 V supply |
| Broche B1 | GND — Ground |
| Broche B2 | IO — User I/O (bank 1A) |
| Broche B3 | IO — User I/O (bank 1A) |
| Broche B4 | VCCIO1B — I/O bank 1B supply |
| Broche B5 | IO — User I/O (bank 1B) |
| Broche B6 | VCCIO1B — I/O bank 1B supply |
| Broche B7 | IO — User I/O (bank 2A) |
| Broche B8 | IO — User I/O (bank 2A) |
| Broche B9 | VCCIO2B — I/O bank 2B supply |
| Broche B10 | IO — User I/O (bank 2B) |
| Broche B11 | GND — Ground |
| Broche C1 | IO — User I/O (bank 1A) |
| Broche C2 | VCCINT — Core 1.2 V supply |
| Broche C3 | IO — User I/O (bank 1A) |
| Broche C4 | IO — User I/O (bank 1A) |
| Broche C5 | IO — User I/O (bank 1B) |
| Broche C6 | IO — User I/O (bank 1B) |
| Broche C7 | IO — User I/O (bank 2B) |
| Broche C8 | IO — User I/O (bank 2B) |
| Broche C9 | IO — User I/O (bank 2B) |
| Broche C10 | VCCINT — Core 1.2 V supply |
| Broche C11 | IO — User I/O (bank 2B) |
| Broche D1 | IO — User I/O (bank 3A) |
| Broche D2 | IO — User I/O (bank 3A) |
| Broche D3 | GND — Ground |
| Broche D4 | TMS — JTAG test mode select |
| Broche D5 | TCK — JTAG test clock |
| Broche D6 | nCONFIG — Configuration control (active-low) |
| Broche D7 | MSEL0 — Configuration mode select 0 |
| Broche D8 | MSEL1 — Configuration mode select 1 |
| Broche D9 | GND — Ground |
| Broche D10 | IO — User I/O (bank 4A) |
| Broche D11 | IO — User I/O (bank 4A) |
| Broche E1 | VCCIO3A — I/O bank 3A supply |
| Broche E2 | IO — User I/O (bank 3A) |
| Broche E3 | IO — User I/O (bank 3A) |
| Broche E4 | TDI — JTAG test data in |
| Broche E5 | nSTATUS — Configuration status (active-low) |
| Broche E6 | MSEL2 — Configuration mode select 2 |
| Broche E7 | DCLK — Configuration clock (AS/PS modes) |
| Broche E8 | TDO — JTAG test data out |
| Broche E9 | IO — User I/O (bank 4A) |
| Broche E10 | IO — User I/O (bank 4A) |
| Broche E11 | VCCIO4A — I/O bank 4A supply |
| Broche F1 | IO — User I/O (bank 3A) |
| Broche F2 | VCCINT — Core 1.2 V supply |
| Broche F3 | IO — User I/O (bank 3A) |
| Broche F4 | nCE — Chip enable (active-low) |
| Broche F5 | CONFIG_DONE — Configuration complete status |
| Broche F6 | DATA0 — Configuration data 0 |
| Broche F7 | CRC_ERROR — Configuration CRC error indicator |
| Broche F8 | IO — User I/O (bank 4B) |
| Broche F9 | IO — User I/O (bank 4B) |
| Broche F10 | VCCINT — Core 1.2 V supply |
| Broche F11 | IO — User I/O (bank 4B) |
| Broche G1 | GND — Ground |
| Broche G2 | IO — User I/O (bank 3B) |
| Broche G3 | VCCIO3B — I/O bank 3B supply |
| Broche G4 | PLL1_CLKOUTp — PLL1 clock output positive |
| Broche G5 | VCCA_PLL1 — PLL1 analog 2.5 V supply |
| Broche G6 | GNDA_PLL1 — PLL1 analog ground |
| Broche G7 | PLL2_CLKOUTp — PLL2 clock output positive |
| Broche G8 | VCCIO4B — I/O bank 4B supply |
| Broche G9 | IO — User I/O (bank 4B) |
| Broche G10 | IO — User I/O (bank 4B) |
| Broche G11 | GND — Ground |
| Broche H1 | IO — User I/O (bank 3B) |
| Broche H2 | IO — User I/O (bank 3B) |
| Broche H3 | IO — User I/O (bank 3B) |
| Broche H4 | VCCA_PLL2 — PLL2 analog 2.5 V supply |
| Broche H5 | GNDA_PLL2 — PLL2 analog ground |
| Broche H6 | PLL1_CLKp — PLL1 clock input positive |
| Broche H7 | PLL2_CLKp — PLL2 clock input positive |
| Broche H8 | IO — User I/O (bank 4B) |
| Broche H9 | IO — User I/O (bank 4B) |
| Broche H10 | IO — User I/O (bank 4B) |
| Broche H11 | VCCIO4B — I/O bank 4B supply |
Applications typiques
10CL016YM164C8G convient pour 6 applications: Industrial Motor Control and Drive Interface, Machine Vision and Image Pre-Processing, Video Bridging and Display Conversion, Software-Defined Radio (SDR) Front-End Glue Logic, Sensor Aggregation and Industrial IoT Gateway, Consumer Electronics Glue Logic and Display Controllers.
Industrial Motor Control and Drive Interface
The 10CL016YM164C8G fits industrial motor-control designs because its 56 (18x18) hardware multipliers accelerate field-oriented-control (FOC) loops, and the two general-purpose PLLs generate the precise switching frequencies required for IGBT and SiC gate-driver timing. With 15,408 LE the device can host an entire FOC + space-vector PWM core plus encoder resolver interfaces, while the 87 I/Os comfortably connect to multi-axis feedback (QEP, Hall, BISS, ENDAT). The 1.2 V core plus per-bank VCCIO makes interfacing to 3.3 V gate drivers and 5 V sensors straightforward. Power dissipation is moderate thanks to the 60 nm low-power process, allowing convection cooling in control cabinets. Drop-in replacement with 10CL016YM164A7G for AEC-Q100 automotive traction inverters.
Recommandé
Machine Vision and Image Pre-Processing
For machine-vision preprocessing at the edge, the 10CL016YM164C8G delivers 504 kbit of embedded M9K memory to buffer line-scan image data and 15,408 LE to implement Bayer-to-RGB demosaic, Gaussian filtering, and Sobel edge detection in hardware. The 87 I/Os enable direct connection to MIPI-CSI or parallel CMOS image sensors plus an LVDS output to a host SoC. The Cyclone 10 LP low-power architecture keeps thermal envelope under 2 W typical, suitable for fanless industrial cameras. Cyclone 10 LP family devices with M164 package are interchangeable in the same PCB footprint, so the same board design can scale from C6 to C8 or A7 speed grades.
Recommandé
Video Bridging and Display Conversion
The 10CL016YM164C8G is well-suited to video-bridging applications (HDMI-to-LVDS, MIPI-to-RGB, dual-camera stitching) where its 15,408 LE plus 56 hardware multipliers handle color-space conversion and scaling algorithms at 1080p60 with headroom. The 8 I/O banks with mixed VCCIO (1.2/1.5/1.8/2.5/3.3 V) simplify interfacing legacy parallel LCD, MIPI DSI, and LVDS panels without level shifters. The 504 kbit embedded RAM acts as a two-line buffer for picture cropping and timing conversion. The M164 8x8 mm package is small enough for in-cable dongles and behind-display controller boards. Quartus Prime Lite includes royalty-free IP for HDMI 1.4, MIPI DSI, and I2C/SPI bridges.
Recommandé
Software-Defined Radio (SDR) Front-End Glue Logic
The 10CL016YM164C8G serves as a flexible digital front-end in low-cost SDR platforms: the two PLLs derive stable sampling clocks for the ADC/DAC pair, while 15,408 LE implement digital down-conversion (DDC), finite-impulse-response (FIR) filtering, and gain control. The 87 I/Os route digital IQ data plus SPI/I2C control to the RF tuner and host processor. The 60 nm low-power process keeps the FPGA under 1.5 W at typical SDR duty cycles, matching battery-powered QRP radio requirements. The same M164 footprint allows easy migration between commercial and industrial grades per the deployment environment.
Recommandé
Sensor Aggregation and Industrial IoT Gateway
The 10CL016YM164C8G aggregates up to ~12 sensor interfaces in industrial IoT gateways: each interface (I2C, SPI, UART, GPIO, Modbus RTU) consumes roughly 1-2 K LE plus a few hardware multipliers for averaging and threshold detection. The 87 I/Os support multiple physical interfaces plus an Ethernet MAC or two RGMII/RMII paths to a host MCU. Two PLLs generate isolated timing references for legacy RS-485 networks. The 504 kbit M9K memory buffers protocol frames before forwarding, reducing host CPU interrupts. The M164 package is small enough for DIN-rail-mounted gateways and supports AEC-Q100 via the A7G grade drop-in for harsh factory environments.
Recommandé
Consumer Electronics Glue Logic and Display Controllers
In consumer products (smart appliances, AV receivers, e-bike dashboards, low-end arcade boards), the 10CL016YM164C8G provides the I/O flexibility and timing generation that fixed-function microcontrollers lack: bridging I2S audio to S/PDIF, generating custom PWM for LED drivers, time-multiplexing button matrices, and routing IR remote signals. The 15,408 LE plus 504 kbit of embedded RAM are sufficient for medium-complexity state machines and waveform generation, while the 8x8 mm M164 package fits behind compact displays. The C8 commercial speed grade covers 1080p timing at 148.5 MHz pixel clock with margin. AEC-Q100 migration via A7G is straightforward for shared hardware platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL016YM164C8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL016YM164C6G | 10CL016YM164A7G | 10CL016YM164I7G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 164-MBGA (M164) 8x8 mm | 164-MBGA (M164) 8x8 mm - same | 164-MBGA (M164) 8x8 mm - same | 164-MBGA (M164) 8x8 mm - same |
| Logic Elements | 15,408 | 15,408 - same | 15,408 - same | 15,408 - same |
| Embedded Memory (bits) | 516,096 (504 kbit) | 516,096 - same | 516,096 - same | 516,096 - same |
| User I/Os | 87 | 87 - same | 87 - same | 87 - same |
| Speed Grade | C8 | C6 (faster Fmax) | A7 (automotive, faster) | I7 (industrial, faster) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +125 C (automotive, AEC-Q100) | -40 C to +100 C (industrial) |
| AEC-Q100 Qualified | No | No | Yes | No (industrial grade) |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V - same | 1.2 V - same | 1.2 V - same |
Principaux différenciateurs
- Smallest Cyclone 10 LP 016 package option (vs 10CL016YF484C8G)
- Same-family drop-in variants cover commercial/industrial/automotive grades (vs 10CL016YM164C8G only)
- Lowest-cost Cyclone 10 LP speed grade in this OPN (vs 10CL016YM164C6G)
Notes de conception
Estimated: at 25% toggle rate on 87 I/Os loaded with 8 mA each and full logic utilization, VCCINT current on 10CL016YM164C8G is approximately 350-500 mA from 1.2 V plus 100-200 mA from VCCIO banks. Bulk decoupling should be 22 uF tantalum + 0.1 uF ceramic per supply pin group, plus 1 uF ceramic on every fourth pin; follow the Intel Cyclone 10 LP pin connection guidelines. VCCA_PLL (2.5 V) and GNDA_PLL must be star-grounded to a quiet analog ground plane to meet PLL jitter specifications.
The 164-MBGA package uses a 0.5 mm pitch and is not hand-solderable; use a 4-layer PCB with at least 1 oz copper, micro-via-in-pad or via-in-pad recommended for the BGA fanout. Reflow profile must conform to JEDEC J-STD-020 MSL-3 with peak 260 C, and the package must be baked at 125 C for 24 hours before assembly if the humidity indicator card has exceeded 10% RH equivalent. Ball land pattern is 0.45 mm diameter with NSMD (non-solder-mask-defined) pads for best reliability.
Common pitfalls include: (1) floating MSEL pins must be tied high or low per the desired configuration mode (AS/PS/JTAG) - leaving them floating causes configuration failures; (2) nCONFIG and nSTATUS must be pulled up to 1.8 V (or VCCIO) and not driven by external logic during configuration; (3) VCCIO banks not in use must still be powered to 1.8 V or 2.5 V (not left floating) to avoid leakage on the input buffers; (4) the JTAG chain must include proper TCK termination; (5) avoid sharing VCCIO between banks driving different logic levels - each bank must have its own decoupled rail.
Route differential pairs (LVDS, DDR memory clocks) with 100 ohm differential impedance and match lengths within 150 mil. The two PLLs should be fed from dedicated clock inputs with short, isolated traces; do not route noisy signals under the PLL supply ferrite beads. M9K memory blocks benefit from localized register duplication in HDL; using the LogicLock region feature in Quartus Prime to lock memory placement can reduce routing congestion at the center of the BGA. Leave at least 200 mil clearance between the BGA and any board edge for rework access.
Informations de conformité
RoHS/REACH compliant per Intel product page. Not AEC-Q100 - choose 10CL016YM164A7G for AEC-Q100 automotive use. Halogen-free per Intel Cyclone 10 LP family declaration.
