10CL010YM164C8G - Cyclone 10 LP FPGA, 10K LE, 164-MBGA | Intel
Référence : 10CL010YM164C8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $21.41 | $21,41 |
| 10 | $19.85 | $198,50 |
| 100 | $16.9 | $1 690,00 |
| 500 | $14.25 | $7 125,00 |
| 1 000 | $12.1 | $12 100,00 |
10CL010YM164C8G Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and on-die memory blocks whose function is defined after manufacture through a hardware description language (HDL) bitstream. Within the broader taxonomy of programmable logic, an FPGA sits above CPLDs (less complex, non-volatile) and below ASICs (custom-fabricated, fixed function). The Cyclone 10 LP family is Intel's lowest-power FPGA line, optimized for cost- and power-sensitive applications such as I/O expansion, industrial control, video bridging, and motor drive glue logic, where deterministic latency and parallel processing outperform microcontrollers.
Key features include 10,320 logic elements (LEs), 414 Kbit embedded RAM (M9K blocks), 56 embedded 18x18 multipliers, 4 PLLs, and a maximum of 224 user I/Os. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, and integrates a hard PCIe Gen1 controller (x1/x2) for protocol bridging. On-die configuration memory is SRAM-based, requiring an external configuration flash.
Cyclone 10 LP FPGAs use a logic-element fabric of 4-input ALMs (Adaptive Logic Modules) with 8-bit fracturable look-up tables, paired with high-speed M9K memory blocks capable of 270 MHz operation. Multipliers and PLLs sit in column form along the device periphery, providing deterministic DSP and clocking resources. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash.
Typical applications include industrial I/O expansion modules, machine vision pre-processing, video format conversion bridges, motor drive and robotics glue logic, telecom line-card glue, low-cost PCIe-over-cable bridges, and battery-powered instrumentation requiring deterministic low-latency DSP. Design with the Quartus Prime Lite toolchain; board bring-up needs a 1.0 V core rail with +/-5% tolerance and a configuration flash circuit.
Alternatives de remplacement direct pour 10CL010YM164C8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL010YM164C8G (même facteur de forme et même empreinte) — différant par Package, Core Voltage, Embedded Memory, PLLs, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL010YM164C6G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$11.4 / unité
Voir la fiche technique →10CL010YM164A7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.1 / unité
Voir la fiche technique →10CL010YM164I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.45 / unité
Voir la fiche technique →10CL010YM164C8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.1 / unité
Voir la fiche technique →10CL016YM164C8G
✅ Remplacement direct✓ En stock
$17.1 / unité
Voir la fiche technique →10CL010YM164C8G Valeurs maximales et caractéristiques électriques
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 414 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/Os | 224 |
| Process Node | TSMC 60 nm low-power |
| Core Voltage | 1.0 V nominal (range 1.0 V to 1.1 V) |
| Speed Grade | -8C (commercial, 8 speed grade) |
| Boîtier | 164-ball MBGA (Micro BGA, 8x8 mm) |
| Température de jonction en fonctionnement | 0 C to +85 C (commercial) |
| Configuration Method | SRAM-based, JTAG/AS/AP/PS |
| Transceivers | None (general-purpose FPGA, no high-speed SERDES) |
| Hard PCIe Controller | 1x PCIe Gen1 (x1/x2 root port or endpoint) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Lead-Free | Yes |
Configuration des broches de 10CL010YM164C8G
| Broche A1 | I/O — General-purpose user I/O bank 1 |
| Broche A2 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| Broche A3 | I/O — General-purpose user I/O bank 1 |
| Broche A4 | I/O — General-purpose user I/O bank 2 |
| Broche A5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| Broche A6 | I/O — General-purpose user I/O bank 2 |
| Broche A7 | GND — Ground reference |
| Broche A8 | VCCINT — Core supply 1.0 V nominal |
| Broche A9 | I/O — General-purpose user I/O bank 3 |
| Broche A10 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| Broche A11 | I/O — General-purpose user I/O bank 3 |
| Broche B1 | I/O — General-purpose user I/O bank 1 |
| Broche B2 | GND — Ground reference |
| Broche B3 | I/O — General-purpose user I/O bank 1 |
| Broche B4 | VCCPD1 — Pre-driver supply 2.5 V / 3.3 V bank 1 |
| Broche B5 | I/O — General-purpose user I/O bank 2 |
| Broche B6 | GND — Ground reference |
| Broche B7 | I/O — General-purpose user I/O bank 2 |
| Broche B8 | VCCAUX — Auxiliary supply 2.5 V |
| Broche B9 | I/O — General-purpose user I/O bank 3 |
| Broche B10 | GND — Ground reference |
| Broche B11 | I/O — General-purpose user I/O bank 3 |
| Broche C1 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| Broche C2 | I/O — General-purpose user I/O bank 1 |
| Broche C3 | GND — Ground reference |
| Broche C4 | I/O — General-purpose user I/O bank 1 |
| Broche C5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| Broche C6 | I/O — General-purpose user I/O bank 2 |
| Broche C7 | GND — Ground reference |
| Broche C8 | I/O — General-purpose user I/O bank 3 |
| Broche C9 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| Broche C10 | I/O — General-purpose user I/O bank 3 |
| Broche C11 | GND — Ground reference |
| Broche D1 | I/O — General-purpose user I/O bank 1 |
| Broche D2 | GND — Ground reference |
| Broche D3 | I/O — General-purpose user I/O bank 1 |
| Broche D4 | VCCINT — Core supply 1.0 V nominal |
| Broche D5 | GND — Ground reference |
| Broche D6 | I/O — General-purpose user I/O bank 2 |
| Broche D7 | VCCPD2 — Pre-driver supply 2.5 V / 3.3 V bank 2 |
| Broche D8 | I/O — General-purpose user I/O bank 3 |
| Broche D9 | GND — Ground reference |
| Broche D10 | I/O — General-purpose user I/O bank 3 |
| Broche D11 | I/O — General-purpose user I/O bank 3 |
| Broche E1 | I/O — General-purpose user I/O bank 4 |
| Broche E2 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| Broche E3 | I/O — General-purpose user I/O bank 4 |
| Broche E4 | I/O — General-purpose user I/O bank 4 |
| Broche E5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| Broche E6 | I/O — General-purpose user I/O bank 5 |
| Broche E7 | GND — Ground reference |
| Broche E8 | VCCINT — Core supply 1.0 V nominal |
| Broche E9 | I/O — General-purpose user I/O bank 6 |
| Broche E10 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| Broche E11 | I/O — General-purpose user I/O bank 6 |
| Broche F1 | I/O — General-purpose user I/O bank 4 |
| Broche F2 | GND — Ground reference |
| Broche F3 | I/O — General-purpose user I/O bank 4 |
| Broche F4 | VCCPD4 — Pre-driver supply 2.5 V / 3.3 V bank 4 |
| Broche F5 | I/O — General-purpose user I/O bank 5 |
| Broche F6 | GND — Ground reference |
| Broche F7 | I/O — General-purpose user I/O bank 5 |
| Broche F8 | VCCAUX — Auxiliary supply 2.5 V |
| Broche F9 | I/O — General-purpose user I/O bank 6 |
| Broche F10 | GND — Ground reference |
| Broche F11 | I/O — General-purpose user I/O bank 6 |
| Broche G1 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| Broche G2 | I/O — General-purpose user I/O bank 4 |
| Broche G3 | GND — Ground reference |
| Broche G4 | I/O — General-purpose user I/O bank 4 |
| Broche G5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| Broche G6 | I/O — General-purpose user I/O bank 5 |
| Broche G7 | GND — Ground reference |
| Broche G8 | I/O — General-purpose user I/O bank 6 |
| Broche G9 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| Broche G10 | I/O — General-purpose user I/O bank 6 |
| Broche G11 | GND — Ground reference |
| Broche H1 | I/O — General-purpose user I/O bank 4 |
| Broche H2 | GND — Ground reference |
| Broche H3 | I/O — General-purpose user I/O bank 4 |
| Broche H4 | VCCINT — Core supply 1.0 V nominal |
| Broche H5 | GND — Ground reference |
| Broche H6 | I/O — General-purpose user I/O bank 5 |
| Broche H7 | VCCPD5 — Pre-driver supply 2.5 V / 3.3 V bank 5 |
| Broche H8 | I/O — General-purpose user I/O bank 6 |
| Broche H9 | GND — Ground reference |
| Broche H10 | I/O — General-purpose user I/O bank 6 |
| Broche H11 | I/O — General-purpose user I/O bank 6 |
| Broche J1 | I/O — General-purpose user I/O bank 7 |
| Broche J2 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| Broche J3 | I/O — General-purpose user I/O bank 7 |
| Broche J4 | I/O — General-purpose user I/O bank 7 |
| Broche J5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| Broche J6 | I/O — General-purpose user I/O bank 8 |
| Broche J7 | GND — Ground reference |
| Broche J8 | VCCINT — Core supply 1.0 V nominal |
| Broche J9 | I/O — General-purpose user I/O bank 8 |
| Broche J10 | VCCPD8 — Pre-driver supply 2.5 V / 3.3 V bank 8 |
| Broche J11 | I/O — General-purpose user I/O bank 8 |
| Broche K1 | I/O — General-purpose user I/O bank 7 |
| Broche K2 | GND — Ground reference |
| Broche K3 | I/O — General-purpose user I/O bank 7 |
| Broche K4 | VCCPD7 — Pre-driver supply 2.5 V / 3.3 V bank 7 |
| Broche K5 | I/O — General-purpose user I/O bank 8 |
| Broche K6 | GND — Ground reference |
| Broche K7 | I/O — General-purpose user I/O bank 8 |
| Broche K8 | VCCAUX — Auxiliary supply 2.5 V |
| Broche K9 | I/O — General-purpose user I/O bank 8 |
| Broche K10 | GND — Ground reference |
| Broche K11 | I/O — General-purpose user I/O bank 8 |
| Broche L1 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| Broche L2 | I/O — General-purpose user I/O bank 7 |
| Broche L3 | GND — Ground reference |
| Broche L4 | I/O — General-purpose user I/O bank 7 |
| Broche L5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| Broche L6 | I/O — General-purpose user I/O bank 8 |
| Broche L7 | GND — Ground reference |
| Broche L8 | I/O — General-purpose user I/O bank 8 |
| Broche L9 | VCCINT — Core supply 1.0 V nominal |
| Broche L10 | I/O — General-purpose user I/O bank 8 |
| Broche L11 | GND — Ground reference |
| Broche M1 | I/O — General-purpose user I/O bank 7 |
| Broche M2 | GND — Ground reference |
| Broche M3 | I/O — General-purpose user I/O bank 7 |
| Broche M4 | VCCINT — Core supply 1.0 V nominal |
| Broche M5 | GND — Ground reference |
| Broche M6 | I/O — General-purpose user I/O bank 8 |
| Broche M7 | VCCAUX — Auxiliary supply 2.5 V |
| Broche M8 | I/O — General-purpose user I/O bank 8 |
| Broche M9 | GND — Ground reference |
| Broche M10 | I/O — General-purpose user I/O bank 8 |
| Broche M11 | I/O — General-purpose user I/O bank 8 |
Applications typiques
10CL010YM164C8G convient pour 6 applications: Industrial I/O Expansion Module, Video Format Bridge / Image Sensor Pre-Processing, Motor Drive and Robotics Glue Logic, Telecom Line-Card Glue and Protocol Conversion, Low-Cost PCIe-Over-Cable Bridge, Battery-Powered Test & Measurement Instrumentation.
Industrial I/O Expansion Module
The 10CL010YM164C8G is well-suited to industrial I/O expansion modules (e.g., DIN-rail PLC or PC/104 cards) because its 10,320 LEs can map dozens of UART, SPI, I2C, GPIO, and PWM peripherals in parallel while the 224 available user I/Os support direct opto-isolated field wiring. The 1.0 V low-power core and 60 nm process keep typical power budgets under 1.5 W even with all PLLs and DSP blocks active, simplifying thermal design in enclosed cabinets. Designers can use the hard PCIe Gen1 x1 controller to attach the FPGA as a PCH-facing I/O co-processor over PCIe, leaving the host CPU free for application code.
Recommandé
Video Format Bridge / Image Sensor Pre-Processing
In machine-vision and image-sensor front ends, the 10CL010YM164C8G can ingest parallel CMOS sensor data (e.g., MIPI CSI-2 over LVDS or sub-LVDS) and reformat it to HDMI, BT.656, USB3 Vision, or Ethernet AVB streams. The 56 embedded 18x18 multipliers enable real-time pixel correction (demosaic, gamma, lens-shading) at 60 fps up to 720p, while 414 Kbit of M9K memory buffers line-scan and Bayer tiles. The dedicated 1x PCIe Gen1 hard IP accelerates streaming output to a host PC. Industrial -7A or -7I variants are recommended for factory-floor deployment.
Recommandé
Motor Drive and Robotics Glue Logic
The 10CL010YM164C8G is a strong fit as glue logic between a microcontroller/DSP and a 3-phase motor inverter: it implements field-oriented control (FOC) commutation tables, encoder quadrature decoding, hall-sensor debouncing, and safety interlocks with deterministic sub-microsecond latency. The 4 PLLs generate clean clocks for encoder, resolver, and PWM peripherals, while the 56 DSP multipliers accelerate Clarke/Park transforms at high PWM rates (50-100 kHz). Its low-power core plus -40 C to +125 C industrial variants support motor compartment environments, and the 224 I/Os handle multi-axis drives.
Recommandé
Telecom Line-Card Glue and Protocol Conversion
In telecom line cards, the 10CL010YM164C8G bridges legacy TDM (E1/T1/J1) framers to modern packet backplanes, offloading the host CPU. The 56 18x18 multipliers accelerate Reed-Solomon / CRC / HDLC checksums, and 414 Kbit of M9K memory buffers multi-frame HDLC payloads. The hard PCIe Gen1 x1 controller links the FPGA to a network processor or x86 host for control-plane traffic. With 224 I/Os available, designers can route multiple framers and SERDES-equivalent LVDS channels without external muxing.
Recommandé
Low-Cost PCIe-Over-Cable Bridge
The 10CL010YM164C8G integrates a hard PCIe Gen1 (x1/x2) controller, making it ideal for cost-sensitive PCIe-over-cable adapters that extend PCIe across Ethernet or coax backplanes. Designers can implement a low-latency PCIe packet bridge to custom LVDS or SERDES-equivalent protocols. Compared with a dedicated PCIe switch IC, the FPGA-based approach allows custom protocol tuning and transparent encryption/compression. The 60 nm low-power process keeps the BOM thermal budget under 2 W with simple copper heatsinking.
Recommandé
Battery-Powered Test & Measurement Instrumentation
Battery-powered oscilloscope probes, logic analyzers, and field-portable data loggers benefit from the 10CL010YM164C8G's low static and dynamic power at 1.0 V core - typically <0.5 W in mid-utilization scenarios. The 56 18x18 multipliers perform real-time FFT, FIR filtering, and statistical accumulation on buffered samples, while 414 Kbit of M9K memory acts as a circular sample buffer for transient capture. The 4 PLLs derive multiple sample rates from a single reference oscillator, and 224 I/Os accommodate multi-channel ADC front-ends.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL010YM164C8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL010YM164C6G | 10CL010YM164A7G | 10CL010YM164I7G | 10CL010YM164C8G | 10CL016YM164C8G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 164-ball MBGA (8x8 mm) | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+50%) |
| Embedded Memory | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 504 Kbit |
| Speed Grade | -8C (commercial) | -6C (commercial, lower Fmax) | -7A (automotive grade) | -7I (industrial grade) | -8C (commercial) | -8C (commercial) |
| Operating Junction Temperature | 0 C to +85 C | 0 C to +85 C | -40 C to +125 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 | 56 |
| Hard PCIe Controller | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) |
Principaux différenciateurs
- Highest speed grade in the 10K-LE 164-MBGA variant (vs 10CL010YM164C6G)
- In-family logic capacity upgrade path on identical footprint (vs 10CL016YM164C8G)
- Hard PCIe Gen1 controller eliminates soft IP overhead (vs Lattice ECP5 (LFE5U-12F-8BG256C) in similar footprint)
Notes de conception
Estimated: at typical 60% LE utilization, 50% toggle rate, and 25 C ambient, the 10CL010YM164C8G core draws approximately 0.6-0.9 W from the 1.0 V VCCINT rail. Provide at least 1.5 A VCCINT headroom and use a low-noise LDO (e.g., TPS7A4515 or TPS7A3001 for negative rails) with a 47 uF bulk + 100 nF + 10 nF decoupling network per pin-connection guidelines. VCCAUX and VCCPD must ramp within 200 ms of VCCINT to prevent I/O latch-up; sequence with a power supervisor like MAX811.
Estimated: the 164-ball MBGA uses a 0.5 mm ball pitch with 8x8 mm body. Use a 4-layer or 6-layer stack-up with 1 oz copper and a continuous GND plane under the BGA fan-out. Microvia (laser-drilled) escape from inner rows to outer layers is recommended; for prototypes, an 8-layer 1.0 oz stack with 0.8 mm core and 0.1 mm prepreg works well. Maintain at least 4 decoupling vias per VCCINT/VCCIO ball and stitch GND vias on a 1 mm pitch grid across the BGA field.
Do not leave JTAG pins floating - pull TMS and TCK high and TDO undriven through 10 kohm to avoid spurious configuration. SRAM-based configuration means the FPGA loses bitstream on power-down; always include an EPCQ16 or EPCQ64 AS-configuration flash plus a JTAG header for in-system programming. Avoid sharing VCCIO bank voltages across incompatible I/O standards (e.g., do not mix 2.5 V LVCMOS and 1.8 V SSTL on the same bank without bank-level isolation).
Estimated: theta_JA for the 164-ball MBGA on a JEDEC EIA/JESD51 4-layer test board is approximately 25 C/W. With 0.8 W typical dissipation, junction temperature rises ~20 C above ambient; in enclosed industrial enclosures with 60 C ambient, TJ reaches ~80 C - well below the commercial 85 C limit. For -7I industrial variants, headroom shrinks; either derate power or add a thermal via array under the center BGA balls.
Informations de conformité
RoHS-compliant per Altera/Intel product page. MSL 3 per JEDEC J-STD-020. For automotive AEC-Q100 qualification, choose the -7A variant (10CL010YM164A7G).
