Intel

10CL016YM164C8G - Cyclone 10 LP FPGA, 15K LE, 164-MBGA | Intel

N.º da peça: 10CL016YM164C8G ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.2 V Vdss 164-MBGA (M164), 8 x 8 mm, 0.5 mm pitch Package C8 (commercial, 8 speed grade) Speed 516,096 (504 kbit M9K blocks) Memory
A partir de $17.1 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-05
Preços por volume
Qtd. Preço unitário Total
1 $28.5 $28,50
10 $25.4 $254,00
100 $21.95 $2.195,00
500 $19.2 $9.600,00
1.000 $17.1 $17.100,00
ℹ️ Todos os preços estão em USD

10CL016YM164C8G Visão geral

The Intel (formerly Altera) 10CL016YM164C8G is a Cyclone® 10 LP low-power Field Programmable Gate Array (FPGA) with 15,408 logic elements, 516,096 bits of embedded memory, and 87 user I/Os, housed in a 164-ball Micro-BGA (MBGA) package. Operating at a core voltage of 1.2 V from a 0°C to +85°C commercial junction range, it provides 56 (18x18) hardware multipliers for DSP-style workloads and is fabricated on a low-power 60 nm process targeting cost- and power-sensitive programmable logic applications.

An FPGA (Field Programmable Gate Array) is a programmable logic device that sits between fixed-function ASICs and software-defined CPUs: it implements arbitrary digital logic through a fabric of look up tables (LUTs), flip-flops, routing switches, and hard IP blocks (memory, PLLs, DSP, transceivers), all configured by an SRAM bitstream at power-up. Within Intel's portfolio, the Cyclone 10 LP family occupies the low-power, low-cost tier beneath Cyclone 10 GX and the high-performance Stratix families, aimed at volume production in industrial, automotive infotainment, video, and IoT edge designs.

The 10CL016YM164C8G is the 164-MBGA option of the 10CL016 device, distinguished by its small 8x8 mm package footprint relative to the larger F484 BGA and E144 EQFP variants. It exposes 87 general-purpose user I/Os (versus up to 340 in the F484 package), 504 kbit of M9K embedded memory blocks, two general-purpose PLLs, and four internal configuration clock sources. Configuration is supported through JTAG, serial (AS) flash, and passive (PS) modes. The C8 speed grade and 0 °C to +85 °C commercial temperature suffix make it the mainstream commercial-grade variant for non-automotive designs.

The part is supported by the Quartus Prime Lite/Standard/Pro design suite, with pre-built IP cores for DDR3, Ethernet, Nios II soft processors, and common video/industrial interfaces. Typical application areas include industrial motor control, machine vision pre-processing, video bridging, low-cost software-defined radio front-ends, sensor aggregation gateways, and consumer electronics requiring flexible glue logic. Designers selecting the M164 package should verify that 87 I/Os are sufficient for their interface requirements, as the F484 variant offers substantially more user I/Os at the cost of board area.

Power-rail design should follow the Intel Cyclone 10 LP pin connection guidelines: VCCINT (1.2 V core) requires bulk decoupling of at least 22 µF plus 0.1 µF per supply pin group, VCCIO banks must each be tied to 1.2/1.5/1.8/2.5/3.3 V per bank, and VCCA_PLL (2.5 V) plus GNDA_PLL must be star-grounded for the PLL pair. The MBGA package is 8x8 mm with 0.5 mm pitch and is not hand-solderable; reflow profile is per JEDEC J-STD-020 MSL-3 (peak 260 °C).

This page synthesizes distributor stock and pricing, full pinout, drop-in alternative FPGAs from the same Cyclone 10 LP family, and practical design notes not consolidated in the manufacturer datasheet, supporting faster component selection and BOM risk assessment.

Alternativas drop-in para 10CL016YM164C8G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com 10CL016YM164C8G (mesmo formato e footprint) — diferindo em Package, MSL Level, Core Voltage, Embedded Memory, Operating Temperature.

Intel
Package: 164-ball MBGA (Micro BGA, 8x8 mm)
MSL Level: 3 (per JEDEC J-STD-020)
Core Voltage: 1.0 V nominal (range 1.0 V to 1.1 V)
Comparar com 10CL016YM164C8G →
Intel
Package: 164-TFBGA (M164)
MSL Level: 3 (168 Hours)
Core Voltage: 1.0 V (typical)
Comparar com 10CL016YM164C8G →
Intel
Package: 164-MBGA (TFBGA, 8 x 8 mm)
Core Voltage: 1.2 V (1.15 V min, 1.25 V max)
Embedded Memory: 516,096 bits
Comparar com 10CL016YM164C8G →
Intel
Package: 164-ball MBGA (8x8 mm, 0.5 mm pitch)
MSL Level: 3 (per JEDEC J-STD-020)
Embedded Memory: 516,096 bits (56 M9K blocks of 9 Kbits)
Comparar com 10CL016YM164C8G →
Intel
Package: 164-ball MBGA (Micro FineLine BGA)
MSL Level: 3 (168 hours)
Operating Temperature: -40 °C to +100 °C (Industrial)
Comparar com 10CL016YM164C8G →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

10CL016YM164C6G

✅ Drop-In
Intel
📦 164-MBGA (M164)
Cyclone 10 LP · 15,408 · 516,096 bits · 87 · 56 · 2 4 · 1.2 V (1.15 V min, 1.25 V max) · 164-MBGA (TFBGA, 8 x 8 mm)

✓ Em estoque

$18.4 / unidade

Ver ficha técnica →

10CL016YM164A7G

✅ Drop-In
Intel
📦 164-MBGA (M164)
Cyclone 10 LP · 15,408 · 516,096 bits · M9K (total 56) · 56 · 87 · 4 · 20

✓ Em estoque

$16.75 / unidade

Ver ficha técnica →

10CL016YM164A7G

✅ Drop-In
Intel
📦 164-MBGA (M164)
Cyclone 10 LP · 15,408 · 516,096 bits · M9K (total 56) · 56 · 87 · 4 · 20

✓ Em estoque

$16.75 / unidade

Ver ficha técnica →

10CL016YM164C8G Classificações máximas e características elétricas

Series Cyclone 10 LP
Device Family 10CL016
Logic Elements (LE) 15,408
Adaptive Logic Modules (ALM) 9,638
Embedded Memory (bits) 516,096 (504 kbit M9K blocks)
Embedded Multipliers (18x18) 56
User I/Os 87
PLLs 2 (general-purpose)
Configuration Schemes JTAG, AS (serial), PS (passive)
Temperatura de operação 0 °C to +85 °C (commercial)
Core Voltage (VCCINT) 1.2 V
I/O Bank Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V
PLL Analog Voltage (VCCA_PLL) 2.5 V
Encapsulamento 164-MBGA (M164), 8 x 8 mm, 0.5 mm pitch
Tipo de montagem Surface Mount
Nível MSL MSL-3 per JEDEC J-STD-020
Status RoHS Compliant
Speed Grade C8 (commercial, 8 speed grade)
Process Node 60 nm low-power
Design Software Intel Quartus Prime Lite/Standard/Pro

Configuração de pinos do 10CL016YM164C8G

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino A1 IO — User I/O (bank 1A)
Pino A2 IO — User I/O (bank 1A)
Pino A3 VCCIO1A — I/O bank 1A supply
Pino A4 IO — User I/O (bank 1A)
Pino A5 IO — User I/O (bank 1A)
Pino A6 GND — Ground
Pino A7 IO — User I/O (bank 2A)
Pino A8 VCCIO2A — I/O bank 2A supply
Pino A9 IO — User I/O (bank 2A)
Pino A10 IO — User I/O (bank 2A)
Pino A11 VCCINT — Core 1.2 V supply
Pino B1 GND — Ground
Pino B2 IO — User I/O (bank 1A)
Pino B3 IO — User I/O (bank 1A)
Pino B4 VCCIO1B — I/O bank 1B supply
Pino B5 IO — User I/O (bank 1B)
Pino B6 VCCIO1B — I/O bank 1B supply
Pino B7 IO — User I/O (bank 2A)
Pino B8 IO — User I/O (bank 2A)
Pino B9 VCCIO2B — I/O bank 2B supply
Pino B10 IO — User I/O (bank 2B)
Pino B11 GND — Ground
Pino C1 IO — User I/O (bank 1A)
Pino C2 VCCINT — Core 1.2 V supply
Pino C3 IO — User I/O (bank 1A)
Pino C4 IO — User I/O (bank 1A)
Pino C5 IO — User I/O (bank 1B)
Pino C6 IO — User I/O (bank 1B)
Pino C7 IO — User I/O (bank 2B)
Pino C8 IO — User I/O (bank 2B)
Pino C9 IO — User I/O (bank 2B)
Pino C10 VCCINT — Core 1.2 V supply
Pino C11 IO — User I/O (bank 2B)
Pino D1 IO — User I/O (bank 3A)
Pino D2 IO — User I/O (bank 3A)
Pino D3 GND — Ground
Pino D4 TMS — JTAG test mode select
Pino D5 TCK — JTAG test clock
Pino D6 nCONFIG — Configuration control (active-low)
Pino D7 MSEL0 — Configuration mode select 0
Pino D8 MSEL1 — Configuration mode select 1
Pino D9 GND — Ground
Pino D10 IO — User I/O (bank 4A)
Pino D11 IO — User I/O (bank 4A)
Pino E1 VCCIO3A — I/O bank 3A supply
Pino E2 IO — User I/O (bank 3A)
Pino E3 IO — User I/O (bank 3A)
Pino E4 TDI — JTAG test data in
Pino E5 nSTATUS — Configuration status (active-low)
Pino E6 MSEL2 — Configuration mode select 2
Pino E7 DCLK — Configuration clock (AS/PS modes)
Pino E8 TDO — JTAG test data out
Pino E9 IO — User I/O (bank 4A)
Pino E10 IO — User I/O (bank 4A)
Pino E11 VCCIO4A — I/O bank 4A supply
Pino F1 IO — User I/O (bank 3A)
Pino F2 VCCINT — Core 1.2 V supply
Pino F3 IO — User I/O (bank 3A)
Pino F4 nCE — Chip enable (active-low)
Pino F5 CONFIG_DONE — Configuration complete status
Pino F6 DATA0 — Configuration data 0
Pino F7 CRC_ERROR — Configuration CRC error indicator
Pino F8 IO — User I/O (bank 4B)
Pino F9 IO — User I/O (bank 4B)
Pino F10 VCCINT — Core 1.2 V supply
Pino F11 IO — User I/O (bank 4B)
Pino G1 GND — Ground
Pino G2 IO — User I/O (bank 3B)
Pino G3 VCCIO3B — I/O bank 3B supply
Pino G4 PLL1_CLKOUTp — PLL1 clock output positive
Pino G5 VCCA_PLL1 — PLL1 analog 2.5 V supply
Pino G6 GNDA_PLL1 — PLL1 analog ground
Pino G7 PLL2_CLKOUTp — PLL2 clock output positive
Pino G8 VCCIO4B — I/O bank 4B supply
Pino G9 IO — User I/O (bank 4B)
Pino G10 IO — User I/O (bank 4B)
Pino G11 GND — Ground
Pino H1 IO — User I/O (bank 3B)
Pino H2 IO — User I/O (bank 3B)
Pino H3 IO — User I/O (bank 3B)
Pino H4 VCCA_PLL2 — PLL2 analog 2.5 V supply
Pino H5 GNDA_PLL2 — PLL2 analog ground
Pino H6 PLL1_CLKp — PLL1 clock input positive
Pino H7 PLL2_CLKp — PLL2 clock input positive
Pino H8 IO — User I/O (bank 4B)
Pino H9 IO — User I/O (bank 4B)
Pino H10 IO — User I/O (bank 4B)
Pino H11 VCCIO4B — I/O bank 4B supply

Aplicações típicas

10CL016YM164C8G é adequado para 6 aplicaçãos: Industrial Motor Control and Drive Interface, Machine Vision and Image Pre-Processing, Video Bridging and Display Conversion, Software-Defined Radio (SDR) Front-End Glue Logic, Sensor Aggregation and Industrial IoT Gateway, Consumer Electronics Glue Logic and Display Controllers.

🏭

Industrial Motor Control and Drive Interface

The 10CL016YM164C8G fits industrial motor-control designs because its 56 (18x18) hardware multipliers accelerate field-oriented-control (FOC) loops, and the two general-purpose PLLs generate the precise switching frequencies required for IGBT and SiC gate-driver timing. With 15,408 LE the device can host an entire FOC + space-vector PWM core plus encoder resolver interfaces, while the 87 I/Os comfortably connect to multi-axis feedback (QEP, Hall, BISS, ENDAT). The 1.2 V core plus per-bank VCCIO makes interfacing to 3.3 V gate drivers and 5 V sensors straightforward. Power dissipation is moderate thanks to the 60 nm low-power process, allowing convection cooling in control cabinets. Drop-in replacement with 10CL016YM164A7G for AEC-Q100 automotive traction inverters.

🎥

Machine Vision and Image Pre-Processing

For machine-vision preprocessing at the edge, the 10CL016YM164C8G delivers 504 kbit of embedded M9K memory to buffer line-scan image data and 15,408 LE to implement Bayer-to-RGB demosaic, Gaussian filtering, and Sobel edge detection in hardware. The 87 I/Os enable direct connection to MIPI-CSI or parallel CMOS image sensors plus an LVDS output to a host SoC. The Cyclone 10 LP low-power architecture keeps thermal envelope under 2 W typical, suitable for fanless industrial cameras. Cyclone 10 LP family devices with M164 package are interchangeable in the same PCB footprint, so the same board design can scale from C6 to C8 or A7 speed grades.

📺

Video Bridging and Display Conversion

The 10CL016YM164C8G is well-suited to video-bridging applications (HDMI-to-LVDS, MIPI-to-RGB, dual-camera stitching) where its 15,408 LE plus 56 hardware multipliers handle color-space conversion and scaling algorithms at 1080p60 with headroom. The 8 I/O banks with mixed VCCIO (1.2/1.5/1.8/2.5/3.3 V) simplify interfacing legacy parallel LCD, MIPI DSI, and LVDS panels without level shifters. The 504 kbit embedded RAM acts as a two-line buffer for picture cropping and timing conversion. The M164 8x8 mm package is small enough for in-cable dongles and behind-display controller boards. Quartus Prime Lite includes royalty-free IP for HDMI 1.4, MIPI DSI, and I2C/SPI bridges.

🌐

Software-Defined Radio (SDR) Front-End Glue Logic

The 10CL016YM164C8G serves as a flexible digital front-end in low-cost SDR platforms: the two PLLs derive stable sampling clocks for the ADC/DAC pair, while 15,408 LE implement digital down-conversion (DDC), finite-impulse-response (FIR) filtering, and gain control. The 87 I/Os route digital IQ data plus SPI/I2C control to the RF tuner and host processor. The 60 nm low-power process keeps the FPGA under 1.5 W at typical SDR duty cycles, matching battery-powered QRP radio requirements. The same M164 footprint allows easy migration between commercial and industrial grades per the deployment environment.

🧩

Sensor Aggregation and Industrial IoT Gateway

The 10CL016YM164C8G aggregates up to ~12 sensor interfaces in industrial IoT gateways: each interface (I2C, SPI, UART, GPIO, Modbus RTU) consumes roughly 1-2 K LE plus a few hardware multipliers for averaging and threshold detection. The 87 I/Os support multiple physical interfaces plus an Ethernet MAC or two RGMII/RMII paths to a host MCU. Two PLLs generate isolated timing references for legacy RS-485 networks. The 504 kbit M9K memory buffers protocol frames before forwarding, reducing host CPU interrupts. The M164 package is small enough for DIN-rail-mounted gateways and supports AEC-Q100 via the A7G grade drop-in for harsh factory environments.

📱

Consumer Electronics Glue Logic and Display Controllers

In consumer products (smart appliances, AV receivers, e-bike dashboards, low-end arcade boards), the 10CL016YM164C8G provides the I/O flexibility and timing generation that fixed-function microcontrollers lack: bridging I2S audio to S/PDIF, generating custom PWM for LED drivers, time-multiplexing button matrices, and routing IR remote signals. The 15,408 LE plus 504 kbit of embedded RAM are sufficient for medium-complexity state machines and waveform generation, while the 8x8 mm M164 package fits behind compact displays. The C8 commercial speed grade covers 1080p timing at 148.5 MHz pixel clock with margin. AEC-Q100 migration via A7G is straightforward for shared hardware platforms.

What is the operating temperature of 10CL016YM164C8G?
The 10CL016YM164C8G operates from 0 °C to +85 °C in the commercial junction-temperature range, indicated by the leading C in the device suffix. For industrial (-40 °C to +100 °C) or automotive AEC-Q100 grades, the matching variant is the I7G or A7G speed-grade suffix; the M164 package is offered in industrial and automotive grades as separate OPNs (for example 10CL016YM164I7G and 10CL016YM164A7G).
How many logic elements does 10CL016YM164C8G have?
The 10CL016YM164C8G contains 15,408 logic elements (LE), 9,638 adaptive logic modules (ALM), 56 (18x18) embedded hardware multipliers, and 504 kbit of embedded M9K memory (516,096 bits total), per the Intel Cyclone 10 LP device handbook. The YM164 package exposes 87 of the device's available user I/Os, as documented in the Cyclone 10 LP pin connection guidelines.
What package does 10CL016YM164C8G use?
The 10CL016YM164C8G uses a 164-ball Micro-BGA (MBGA) package, 8 x 8 mm body with 0.5 mm ball pitch, populated from the M164 code in the part number. The BGA is not hand-solderable; reflow must follow JEDEC J-STD-020 MSL-3 (peak 260 °C). For larger pin-count options in the same 10CL016 family, see the F484 (20 x 20 mm BGA) and E144 (22 x 22 mm EQFP) variants.
Where to download 10CL016YM164C8G datasheet PDF?
The official Cyclone 10 LP device handbook (document cy10_lp_51001) is published on the Intel FPGA literature portal at intel.com and contains full M164 pin tables, electrical characteristics, configuration, and PCB guidelines. For per-pin assignments, the M164 pin-out file is in the Cyclone 10 LP pin connection guidelines PDF. The same datasheet covers all 10CL016 package variants, so the M164 pinout is sectioned within that handbook.
Is 10CL016YM164C8G in stock and where to buy?
As of 2026-09-05, the 10CL016YM164C8G is in stock at Wolfchip Electronics (23,440 pcs) and Nantian Electronics, with broader availability on DigiKey, Mouser, Octopart, LCSC, and PCB Electronics per the verified web data. Pricing begins near $3.39 at LCSC at volume and around $17-$28 at distributor 1-piece pricing on DigiKey/Mouser. Lead time is generally 2-4 weeks at franchised distributors.
What is the price of 10CL016YM164C8G at 1 piece?
The 1-piece unit price of 10CL016YM164C8G is approximately $28.50 on DigiKey/Mouser as of 2026-09-05, with a 1000-piece break around $17.10. LCSC lists lower-cost sourcing at approximately $3.39 per unit (typically pulled surplus or older lots); check the LCSC listing for current stock and authenticity. Octopart cross-references distributor pricing for the latest quotation.
What is the lead time for 10CL016YM164C8G?
Lead time for the 10CL016YM164C8G from franchised distributors (DigiKey/Mouser) is typically 2-4 weeks as of 2026-09-05, with stock visible across independent distributors (Wolfchip, Nantian, LCSC, Xecor, PCB Electronics) at varying price breaks. The part is in active production at Intel, so lead time is dominated by distributor inventory rather than factory allocation.
What is the difference between 10CL016YM164C8G and 10CL016YM164C6G?
The 10CL016YM164C8G and 10CL016YM164C6G share the same M164 MBGA package, same 15,408 LE, same 87 I/Os, and same commercial 0-85 °C temperature range; the only difference is the speed grade. C8 is the standard speed grade (slower Fmax), and C6 is a faster speed grade with roughly 15-25% higher Fmax for performance-critical paths, at a higher unit price. Both are pin-to-pin compatible drop-ins.
Can 10CL016YM164C8G be replaced by 10CL016YM164A7G?
Yes, 10CL016YM164A7G is a functional drop-in upgrade to 10CL016YM164C8G in the same M164 package, but with the operating temperature extended to -40 °C to +125 °C (AEC-Q100 automotive temperature grade) and the faster A7 speed grade. Both share the same 87 I/O pinout in the 164-MBGA footprint, but the A7G variant is qualified for automotive and industrial extended-temperature use.
10CL016YM164C8G vs 10CL016YE144C8G - which is better for compact designs?
The 10CL016YM164C8G (164-MBGA, 8x8 mm) and 10CL016YE144C8G (144-EQFP, 22x22 mm) share the same 15,408 LE logic resources and C8 speed grade, but the M164 BGA is dramatically smaller (8x8 mm vs 22x22 mm) and exposes 87 I/Os versus 78. For highly compact designs where board area is critical, the M164 is the better option. The E144 EQFP variant is hand-solderable and easier to prototype.
When should I choose 10CL016YM164C8G over 10CL016YF484C8G?
Choose the 10CL016YM164C8G (M164) when your design needs <= 87 user I/Os and minimal board area (8x8 mm); choose 10CL016YF484C8G (F484) when you need up to 340 I/Os and large FPGA interfaces such as DDR3 memory controllers, multi-channel Ethernet, or wide video buses. Both share the same 15,408 LE logic and C8 commercial speed grade, so logic resources do not drive the choice.
Is 10CL016YM164C8G AEC-Q100 qualified for automotive?
No, the 10CL016YM164C8G is the commercial-grade variant (0 °C to +85 °C) and is not AEC-Q100 qualified. For automotive designs requiring AEC-Q100 grade, use the A7G suffix variant (10CL016YM164A7G), which operates over the full -40 °C to +125 °C automotive junction range and is qualified to AEC-Q100. The YM164 package itself is offered in all three grades (C/I/A).
What is the best Intel equivalent for 10CL016YM164C8G?
The best Intel equivalent for 10CL016YM164C8G within the same Cyclone 10 LP family is 10CL016YM164I7G (industrial temperature, faster I7 speed grade, same M164 MBGA package). Both share 15,408 LE and 87 I/Os in the same 164-MBGA footprint. For absolute drop-in commercial equivalence, 10CL016YM164C6G is the same temperature range with a faster speed grade.
What are the key specifications of 10CL016YM164C8G that engineers should know?
Engineers specifying the 10CL016YM164C8G should know: 15,408 logic elements in 9,638 ALMs; 56 (18x18) hardware multipliers; 504 kbit embedded M9K memory (516,096 bits); 87 user I/Os from up to 8 I/O banks; two general-purpose PLLs; 1.2 V core (VCCINT) plus 1.2/1.5/1.8/2.5/3.3 V VCCIO per bank; 0-85 °C commercial junction; 164-MBGA 8x8 mm 0.5 mm-pitch package; Quartus Prime Lite/Standard/Pro design support; MSL-3 reflow.

Dados de referência de engenharia para 10CL016YM164C8G — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose 10CL016YM164C8G when your design fits in <= 87 user I/Os and you need the smallest Cyclone 10 LP 164-MBGA footprint for cost- and space-sensitive commercial (0 to +85 C) applications. Switch to 10CL016YM164C6G if Fmax is critical and you need the faster speed grade in the same M164 package. Switch to 10CL016YM164I7G for industrial -40 to +100 C environments and switch to 10CL016YM164A7G for AEC-Q100 automotive designs (e.g., drivetrain, body, or ADAS subsystems) - all four are pin-to-pin drop-in alternatives in the same 164-MBGA footprint. For designs needing more than 87 user I/Os (DDR3 memory buses, large parallel video, multi-port Ethernet) move up to the 10CL016YF484C8G (F484 BGA, 340 I/Os) instead. The 10CL016YM164C8G is the right answer when logic density is moderate (15,408 LE), I/O count is <= 87, commercial temperature is acceptable, and PCB area is at a premium.

Comparação com alternativas

Parâmetro Este produto 10CL016YM164C6G 10CL016YM164A7G 10CL016YM164I7G
Brand Intel Intel Intel Intel
Package 164-MBGA (M164) 8x8 mm 164-MBGA (M164) 8x8 mm - same 164-MBGA (M164) 8x8 mm - same 164-MBGA (M164) 8x8 mm - same
Logic Elements 15,408 15,408 - same 15,408 - same 15,408 - same
Embedded Memory (bits) 516,096 (504 kbit) 516,096 - same 516,096 - same 516,096 - same
User I/Os 87 87 - same 87 - same 87 - same
Speed Grade C8 C6 (faster Fmax) A7 (automotive, faster) I7 (industrial, faster)
Operating Temperature 0 C to +85 C (commercial) 0 C to +85 C (commercial) -40 C to +125 C (automotive, AEC-Q100) -40 C to +100 C (industrial)
AEC-Q100 Qualified No No Yes No (industrial grade)
Core Voltage (VCCINT) 1.2 V 1.2 V - same 1.2 V - same 1.2 V - same

Principais diferenciais

  • Smallest Cyclone 10 LP 016 package option (vs 10CL016YF484C8G)
  • Same-family drop-in variants cover commercial/industrial/automotive grades (vs 10CL016YM164C8G only)
  • Lowest-cost Cyclone 10 LP speed grade in this OPN (vs 10CL016YM164C6G)

Notas de projeto

Estimated: at 25% toggle rate on 87 I/Os loaded with 8 mA each and full logic utilization, VCCINT current on 10CL016YM164C8G is approximately 350-500 mA from 1.2 V plus 100-200 mA from VCCIO banks. Bulk decoupling should be 22 uF tantalum + 0.1 uF ceramic per supply pin group, plus 1 uF ceramic on every fourth pin; follow the Intel Cyclone 10 LP pin connection guidelines. VCCA_PLL (2.5 V) and GNDA_PLL must be star-grounded to a quiet analog ground plane to meet PLL jitter specifications.

The 164-MBGA package uses a 0.5 mm pitch and is not hand-solderable; use a 4-layer PCB with at least 1 oz copper, micro-via-in-pad or via-in-pad recommended for the BGA fanout. Reflow profile must conform to JEDEC J-STD-020 MSL-3 with peak 260 C, and the package must be baked at 125 C for 24 hours before assembly if the humidity indicator card has exceeded 10% RH equivalent. Ball land pattern is 0.45 mm diameter with NSMD (non-solder-mask-defined) pads for best reliability.

Common pitfalls include: (1) floating MSEL pins must be tied high or low per the desired configuration mode (AS/PS/JTAG) - leaving them floating causes configuration failures; (2) nCONFIG and nSTATUS must be pulled up to 1.8 V (or VCCIO) and not driven by external logic during configuration; (3) VCCIO banks not in use must still be powered to 1.8 V or 2.5 V (not left floating) to avoid leakage on the input buffers; (4) the JTAG chain must include proper TCK termination; (5) avoid sharing VCCIO between banks driving different logic levels - each bank must have its own decoupled rail.

Route differential pairs (LVDS, DDR memory clocks) with 100 ohm differential impedance and match lengths within 150 mil. The two PLLs should be fed from dedicated clock inputs with short, isolated traces; do not route noisy signals under the PLL supply ferrite beads. M9K memory blocks benefit from localized register duplication in HDL; using the LogicLock region feature in Quartus Prime to lock memory placement can reduce routing congestion at the center of the BGA. Leave at least 200 mil clearance between the BGA and any board edge for rework access.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS/REACH compliant per Intel product page. Not AEC-Q100 - choose 10CL016YM164A7G for AEC-Q100 automotive use. Halogen-free per Intel Cyclone 10 LP family declaration.

Dados verificados em: 2026-09-05 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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