10CL080YU484C8G - 81K LE Cyclone 10 LP FPGA 484-UBGA | Intel
MPN: 10CL080YU484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $606.73 | $606.73 |
| 10 | $580 | $5,800.00 |
| 100 | $540 | $54,000.00 |
| 500 | $495 | $247,500.00 |
| 1,000 | $450 | $450,000.00 |
Drop-in alternatives for 10CL080YU484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL080YU484C6G
✅ Drop-In✓ In Stock
$34.75 / Unit
View Datasheet →10CL080YU484A7G
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$171 / Unit
View Datasheet →10CL080YU484I7G
✅ Drop-In✓ In Stock
$152 / Unit
View Datasheet →10CL080YU484I8G
✅ Drop-In📋 Reference alternative (not in catalog)
10CL055YU484C8G
✅ Drop-In✓ In Stock
$63.8 / Unit
View Datasheet →10CL120YU484I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10CL080YU484C8G Maximum Ratings & Electrical Characteristics
| Series | Cyclone® 10 LP |
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 81,264 |
| Embedded Memory Bits | 2,810,880 bits |
| Embedded Memory | 4,608 Kbits |
| Embedded Multipliers (18x18) | 289 |
| PLLs | 6 |
| User I/O Banks | 4 |
| Package | 484-pin UBGA (U484) |
| Mounting Type | Surface Mount |
| Core Voltage | 1.0V / 1.2V (VCCINT/VCCAUX) |
| Configuration Modes | AS, PS, FPP, JTAG |
| Process Technology | 60 nm low-power |
| RoHS Status | Compliant |
| Supplier Device Package | 484-UBGA |
10CL080YU484C8G 484-ubga Pin Configuration Guide
Complete pinout information for 10CL080YU484C8G (484-ubga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL080YU484C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL080YU484C8G is suitable for 6 applications: Industrial Motor Control, Machine Vision and Image Processing, Software-Defined Radio Front-End, Factory Automation and Protocol Bridging, Video Bridging and Display Processing, Low-Cost ASIC Prototyping and Logic Replacement.
Industrial Motor Control
The 10CL080YU484C8G's 81,264 logic elements and 289 18x18 multipliers deliver the parallelism needed for field-oriented control (FOC) of multi-axis AC motors. Its 4 PLLs and 4 user I/O banks let engineers interface Quadrature encoders, Hall sensors, and PWM outputs to power-stage gate drivers from a single device. The Cyclone 10 LP family's low static power (~125 mW typical for 80K LE) is critical in cabinet-mounted drives that run 24/7. Designers typically implement the control loop in RTL with on-chip RAM holding per-axis state, using the embedded multipliers for Park/Clarke transforms and PI controllers. The 484-UBGA package provides ample I/O for multi-axis systems while staying within a manageable board area.
Recommended
Machine Vision and Image Processing
With 2,810,880 bits of embedded memory and 289 dedicated 18x18 multipliers, the 10CL080YU484C8G is well-suited for real-time image processing pipelines such as Sobel edge detection, median filtering, and color-space conversion. The on-chip M9K memory blocks buffer scan-line data, while the 18x18 multipliers accelerate convolution kernels in parallel. Engineers commonly pair the FPGA with MIPI CSI-2 or LVDS image sensors, using the device's LVDS I/O capability and PLL-based clock conditioning. The 484-pin UBGA package provides sufficient user I/O for sensor interfaces, DDR2/DDR3 frame buffers, and Ethernet or USB 3.0 bridges, all within a single FPGA. The Cyclone 10 LP architecture also enables low-latency processing that microcontrollers cannot match.
Recommended
Software-Defined Radio Front-End
The 10CL080YU484C8G's 289 18x18 hardware multipliers enable digital down-conversion (DDC), digital up-conversion (DUC), and FIR filtering at baseband, while the 6 PLLs synthesize the multiple clock domains required for ADC/DAC sample rates and IF stages. The Cyclone 10 LP's LVDS I/O supports direct connection to high-speed ADCs such as the AD9234 family at up to 250 MSPS, with the FPGA performing channelization, decimation, and gain control in real time. Engineers designing low-cost SDR platforms benefit from the device's balance of DSP capability, low power, and the cost advantage of the Cyclone 10 LP family versus mid-range FPGAs.
Recommended
Factory Automation and Protocol Bridging
Factory automation systems require concurrent support for protocols such as EtherCAT, PROFINET, Modbus TCP, and serial fieldbuses, which the 10CL080YU484C8G handles in a single device. The 81,264 logic elements accommodate multiple soft IP cores (EtherCAT slave controller, PROFINET IO device, etc.) running in parallel, while the embedded memory and multipliers accelerate real-time data preprocessing. The 4 user I/O banks and 484-pin UBGA package enable direct connection to dual-port Ethernet PHYs, RS-485 transceivers, and digital I/O racks. The Cyclone 10 LP family's industrial temperature options (I-suffix) and low power suit DIN-rail mounted controllers operating in unconditioned cabinets.
Recommended
Video Bridging and Display Processing
The 10CL080YU484C8G handles HDMI/DVI/VGA input bridging, color-space conversion, and on-screen display (OSD) composition in mid-range industrial panels and digital signage. Its 289 18x18 multipliers accelerate scaling algorithms (bilinear, bicubic) and chroma upsampling, while the 2,810,880-bit embedded memory acts as line/frame buffers for video pipelines. The 484-pin UBGA exposes sufficient LVDS pairs for flat-panel interfaces and the 6 PLLs generate independent pixel clocks for input and output domains. Designers pair the FPGA with external DDR2/DDR3 for multi-buffered scaler pipelines, using the hard memory controller to sustain full HD bandwidth.
Recommended
Low-Cost ASIC Prototyping and Logic Replacement
Engineering teams use the 10CL080YU484C8G as an ASIC prototype or logic-replacement platform for mid-complexity designs. Its 81,264 logic elements and rich memory/DSP are sufficient to validate register-transfer-level (RTL) designs before tape-out, while the 484-UBGA package provides realistic board-level I/O for timing-accurate bring-up. The Cyclone 10 LP family supports the Quartus Prime design flow with full RTL synthesis, simulation, and timing analysis, enabling IP re-use across prototype and production. Engineers benefit from the device's low static power and cost versus larger FPGAs, making it attractive for limited-volume products that still require hardware flexibility.
Recommended
Recommended Products Summary
Engineering reference data for 10CL080YU484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL080YU484C6G | 10CL080YU484A7G | 10CL080YU484I7G | 10CL055YU484C8G | 10CL120YU484I7G |
|---|---|---|---|---|---|---|
| Package | 484-pin UBGA (U484) | 484-pin UBGA (U484) - same | 484-pin UBGA (U484) - same | 484-pin UBGA (U484) - same | 484-pin UBGA (U484) - same | 484-pin UBGA (U484) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 81,264 | 81,264 (same) | 81,264 (same) | 81,264 (same) | 55,113 (-32%) | 119,088 (+47%) |
| Embedded Memory | 2,810,880 bits | 2,810,880 bits (same) | 2,810,880 bits (same) | 2,810,880 bits (same) | 2,343,936 bits (-17%) | 3,888,000 bits (+38%) |
| 18x18 Multipliers | 289 | 289 (same) | 289 (same) | 289 (same) | 156 (-46%) | 384 (+33%) |
| Speed Grade | 8 | 6 (slower) | 7 | 7 | 8 (same) | 7 |
| Temperature Grade | Commercial | Commercial | Automotive | Industrial | Commercial | Industrial |
| PLLs | 6 | 6 (same) | 6 (same) | 6 (same) | 6 (same) | 6 (same) |
| User I/O Banks | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
| Family | Cyclone 10 LP | Cyclone 10 LP (same) | Cyclone 10 LP (same) | Cyclone 10 LP (same) | Cyclone 10 LP (same) | Cyclone 10 LP (same) |
Key Differentiators
- Identical die with tighter timing closure (vs 10CL080YU484C6G)
- Commercial temperature at higher speed grade (vs 10CL080YU484I7G)
- Mid-range logic density with full Cyclone 10 LP feature set (vs 10CL055YU484C8G)
- Right-sized density vs. over-provisioned flagship (vs 10CL120YU484I7G)
Design Notes
Estimated: the 10CL080YU484C8G requires separate VCCINT (1.0V core), VCCAUX (2.5V auxiliary), VCCIO (per bank, 1.2-3.3V), and VCCPD (3.0V) rails. According to the Cyclone 10 LP datasheet, place a 0.1 uF decoupling capacitor within 5 mm of every VCC pin and bulk 100 uF capacitors near each power plane entry. Use a dedicated ground plane beneath the BGA to minimize return-path inductance; high-pin-count UBGA devices are particularly sensitive to PDN impedance.
The 484-UBGA package uses a 1.0 mm ball pitch with 19x19 array (some depopulated). Per Intel PCB layout guidelines, escape routing requires microvia or via-in-pad technology on at least the inner rows. Use 4-6 layer stack-up with continuous reference planes for high-speed LVDS/DDR signals. Match trace lengths within +/- 150 mil for DDR2/DDR3 address/command group and within +/- 25 mil for DQS-to-DQ pairs to meet tDS/tDH timing.
Common pitfalls when designing with the 10CL080YU484C8G include: (1) failing to configure unused pins as inputs tri-stated with weak pull-up to avoid floating inputs; (2) selecting the wrong configuration mode (AS vs PS) which prevents the EPCQ bootloader from initializing; (3) overlooking bank VCCIO constraints - mixing 1.8V LVDS and 3.3V LVCMOS in the same bank will damage I/O; (4) omitting the CRC error-checking feature in user mode, which can mask configuration failures. Refer to the Cyclone 10 LP Handbook chapter on configuration for design checklists.
Estimated: at typical utilization (60% LE, 50% memory, 75% DSP), the 10CL080YU484C8G dissipates approximately 0.8-1.2 W with theta_JA around 18 C/W on a 4-layer JEDEC test board, yielding a junction rise of 15-22 C above ambient. The 484-UBGA package's exposed-die design benefits from thermal vias in the BGA land pattern; without thermal vias junction-to-ambient thermal resistance increases by 30-40%. For industrial enclosures without forced airflow, de-rate utilization or implement thermal monitoring via the on-die temperature-sensing diode.
Compliance Information
RoHS and REACH compliance stated by Intel/Altera product pages. The 10CL080YU484A7G automotive variant is AEC-Q100 qualified - select that variant for automotive. Halogen-free status not explicitly stated in web data - unknown.
