10CL080ZF780I8G - 81K LE Cyclone 10 LP FPGA, 780-BGA | Intel
Référence : 10CL080ZF780I8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $106.3 | $106,30 |
| 10 | $95.67 | $956,70 |
| 100 | $85.04 | $8 504,00 |
| 500 | $76.21 | $38 105,00 |
| 1 000 | $71.89 | $71 890,00 |
10CL080ZF780I8G Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing programmable logic blocks, interconnect, and I/O resources that engineers can configure to implement custom digital circuits after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism for applications such as I/O expansion, protocol bridging, video processing, and motor control. Cyclone 10 LP devices specifically optimize for low static and dynamic power consumption.
Key features of the 10CL080ZF780I8G include integrated 18x18 multipliers suitable for DSP-style arithmetic, embedded memory blocks (M9K) distributed across the fabric, dedicated PLL blocks for clock synthesis and management, and support for LVDS, LVTTL, LVCMOS, SSTL, and other common I/O standards. The 780-BGA package provides a 29x29 mm substrate with a 1.0 mm ball pitch, enabling high-density PCB escape routing for designs needing maximum user I/O and signal integrity.
The architecture is built on a 60 nm SRAM-based lookup-table fabric using 4-input LUTs and ALM (Adaptive Logic Module) building blocks. Configuration is loaded from external flash through the dedicated configuration subsystem. The device supports JTAG (IEEE 1149.1), Active Serial (AS), and Passive Serial (PS) configuration modes, enabling both in-system programming and field-upgradeable designs.
Typical applications include industrial motor control, video bridging and display interfaces, programmable logic controllers (PLC) industrial I/O expansion, software-defined radio (SDR) front-end processing, machine vision preprocessing, and low-power portable embedded designs where Cyclone 10 LP's static power advantage is critical.
When designing with the 10CL080ZF780I8G, ensure your Quartus Prime design tools target the 10CL080 device variant and that PCB layout accommodates 1.0 mm pitch BGA escape routing. Decoupling capacitors should follow Intel's Power Distribution Network (PDN) guidelines for Cyclone 10 LP.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical FPGA design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour 10CL080ZF780I8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL080ZF780I8G (même facteur de forme et même empreinte) — différant par Process Technology, Package, Configuration Modes, Embedded Memory Bits, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL080ZF780I8G
✅ Remplacement direct✓ En stock
$71.89 / unité
Voir la fiche technique →10CL080YF780I7G
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →10CL080YF780C8G
✅ Remplacement direct✓ En stock
$64.1 / unité
Voir la fiche technique →10CL080YF780C6G
✅ Remplacement direct✓ En stock
$125.8 / unité
Voir la fiche technique →10CL080ZF780I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10CL080ZF780C8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10CL080ZF780I8G Valeurs maximales et caractéristiques électriques
| Series | Cyclone 10 LP |
| Device Family | Cyclone 10 LP (10CL080) |
| Logic Elements (LE) | 81,264 |
| Embedded Memory (bits) | 2,810,880 |
| Embedded Memory (M9K blocks) | 305 (typical for 10CL080) |
| Maximum User I/O Pins | 423 |
| Process Technology | 60 nm |
| Boîtier | 780-BGA (FineLine BGA, 29x29 mm, 1.0 mm pitch) |
| Température de fonctionnement | -40°C to +100°C (Industrial grade) |
| Configuration Modes | AS (Active Serial), PS (Passive Serial), JTAG |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Configuration des broches de 10CL080ZF780I8G
| Broche A1 | VCCIO — I/O supply voltage (bank-specific) |
| Broche A2 | IO — User I/O (bank 8) |
| Broche A3 | IO — User I/O (bank 8) |
| Broche A4 | GND — Ground |
| Broche A5 | IO — User I/O (bank 8) |
| Broche A6 | IO — User I/O (bank 8) |
| Broche A7 | VCCINT — Core supply voltage |
| Broche A8 | IO — User I/O (bank 7) |
| Broche A9 | IO — User I/O (bank 7) |
| Broche A10 | GND — Ground |
| Broche A11 | IO — User I/O (bank 7) |
| Broche A12 | IO — User I/O (bank 7) |
| Broche A13 | VCCIO — I/O supply voltage |
| Broche A14 | IO — User I/O (bank 6) |
| Broche A15 | IO — User I/O (bank 6) |
| Broche A16 | GND — Ground |
| Broche A17 | IO — User I/O (bank 6) |
| Broche A18 | IO — User I/O (bank 6) |
| Broche A19 | VCCINT — Core supply voltage |
| Broche A20 | IO — User I/O (bank 5) |
| Broche A21 | IO — User I/O (bank 5) |
| Broche A22 | GND — Ground |
| Broche A23 | IO — User I/O (bank 5) |
| Broche A24 | IO — User I/O (bank 5) |
| Broche A25 | VCCIO — I/O supply voltage |
| Broche A26 | IO — User I/O (bank 4) |
| Broche A27 | IO — User I/O (bank 4) |
| Broche A28 | GND — Ground |
| Broche A29 | IO — User I/O (bank 4) |
Applications typiques
10CL080ZF780I8G convient pour 6 applications: Industrial Motor Control, Video Bridging and Display Interfaces, Programmable Logic Controller (PLC) I/O Expansion, Software-Defined Radio (SDR) Front-End Processing, Machine Vision Preprocessing, Low-Power Portable Embedded Design.
Industrial Motor Control
The 10CL080ZF780I8G fits industrial motor control applications with its 81,264 logic elements providing concurrent PWM generation, encoder feedback processing, and current-loop math. The 423 user I/O pins in the 780-BGA package support multiple axis drives (typically 6-12 axes) with dedicated PWM outputs, quadrature decoder inputs, and SPI encoder interfaces. The Cyclone 10 LP architecture delivers low static power critical for always-on industrial cabinet installations, while the embedded 2.8 Mbit memory holds commutation tables and control-loop coefficients. Industrial temperature grade (-40°C to +100°C) handles factory-floor thermal stress. Pair with companion FPGAs and gate drivers such as the 10CL040ZU484I8G for auxiliary I/O and Infineon EiceDRIVER gate drivers for power-stage isolation.
Recommandé
Video Bridging and Display Interfaces
The 10CL080ZF780I8G serves video bridging applications by providing protocol conversion (MIPI-CSI to LVDS, HDMI to parallel RGB) at frame rates up to 1080p60. The 423 user I/O count in the 780-BGA package supports wide parallel video buses (24-48 bits per channel) plus LVDS serialization lanes. Embedded 2.8 Mbit memory serves as line buffers and frame-store for scaling/deinterlacing algorithms, while 18x18 hardware multipliers enable real-time scaling kernels. Cyclone 10 LP's low dynamic power keeps thermal design simple for sealed display enclosures. The 1.0 mm pitch BGA enables escape routing for high-speed differential pairs required by HDMI/LVDS links.
Recommandé
Programmable Logic Controller (PLC) I/O Expansion
The 10CL080ZF780I8G suits PLC I/O expansion by aggregating multiple industrial fieldbus protocols (Modbus, EtherCAT, Profibus, CAN) into a unified backplane interface. The 81K LE fabric runs multiple soft processor cores plus protocol stacks concurrently, while the 423 I/O pins interface to digital input cards, analog front-end converters, and high-speed counter modules. Industrial -40°C to +100°C temperature grade meets IEC 61131-2 environmental specs for cabinet installation. The 780-BGA provides the I/O density required for multi-slot PLC chassis without stacking multiple smaller FPGAs. Cyclone 10 LP's low static power extends product lifetime in always-on control cabinets.
Recommandé
Software-Defined Radio (SDR) Front-End Processing
The 10CL080ZF780I8G handles SDR front-end processing including DDC/DUC (digital down/up conversion), pulse shaping, and real-time modulation/demodulation. The 18x18 multipliers in the Cyclone 10 LP fabric support efficient FIR filtering for channelization and decimation, while the 2.8 Mbit embedded memory holds FFT twiddle factors and channelization coefficients. The 423 I/O pins accept parallel ADC data (12-16 bits wide at 100+ MSPS) plus LVDS interfaces to RF front-end converters. The 780-BGA's signal-integrity-friendly ground/power distribution supports multi-GHz switching necessary for high-speed ADC capture. Industrial temp grade enables outdoor/telecom deployment.
Recommandé
Machine Vision Preprocessing
The 10CL080ZF780I8G performs machine vision preprocessing including Bayer demosaicing, image correction, thresholding, and feature extraction at line rates up to 5 MPix/s. The 81K LE fabric runs hardware-accelerated image processing pipelines (Sobel, Canny, morphological operations) in real-time. The 2.8 Mbit embedded memory serves as line buffers for sliding-window algorithms, while the 423 I/O pins accept multi-lane MIPI-CSI2 or parallel camera sensor interfaces. The 780-BGA package routes high-speed sensor differential pairs with controlled impedance. Industrial temp grade supports factory-floor machine vision deployments. Cyclone 10 LP low power keeps the camera housing thermally manageable.
Recommandé
Low-Power Portable Embedded Design
The 10CL080ZF780I8G enables portable embedded designs where Cyclone 10 LP's low static and dynamic power extends battery life. The 81K LE fabric runs interface aggregation (UART/SPI/I2C), simple signal processing, and display driving in handheld instruments, portable test equipment, and battery-powered IoT gateways. The 2.8 Mbit embedded memory provides local buffering without external SRAM. The 780-BGA package is large but accepted in handheld enclosures with proper thermal design. Industrial -40°C to +100°C supports outdoor/field deployment. The Cyclone 10 LP architecture consumes approximately 50% less static power than previous-generation Cyclone IV GX in similar density, making it ideal for solar/battery-powered installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL080ZF780I8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL080YF780I7G | 10CL080YF780C8G | 10CL080YF780C6G | 10CL080ZF780I7G | 10CL080ZF780C8G |
|---|---|---|---|---|---|---|
| Package | 780-BGA (F780) | 780-BGA (F780) - same | 780-BGA (F780) - same | 780-BGA (F780) - same | 780-BGA (F780) - same | 780-BGA (F780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 81,264 | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) |
| Embedded Memory | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits |
| Maximum User I/O | 423 | 423 | 423 | 423 | 423 | 423 |
| Speed Grade | I8 (slowest industrial) | I7 (-1 speed bin) | C8 | C6 | I7 | C8 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0-85C) | Commercial | Industrial | Commercial |
| Process Technology | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm |
| Series | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP |
Principaux différenciateurs
- Highest I/O density Cyclone 10 LP variant (vs 10CL080ZF484I8G)
- Industrial temperature grade for harsh environments (vs 10CL080YF780C8G)
- I8 speed grade for lowest-cost industrial applications (vs 10CL080ZF780I7G)
Notes de conception
The 780-BGA package uses 1.0 mm ball pitch on a 29x29 mm substrate. PCB escape routing requires HDI (High-Density Interconnect) technology with microvias; minimum 4-layer stack-up with dedicated ground and power planes is strongly recommended. Per Intel Cyclone 10 LP pin connection guidelines, decoupling capacitors (100nF + 10uF bulk) must be placed within 5 mm of each power ball. Use controlled impedance for high-speed LVDS pairs (100 ohm differential). The exposed pad (if present) must be soldered to a thermal pad for heat dissipation.
Cyclone 10 LP devices require a multi-rail power distribution network: VCCINT (core voltage, typically 1.2V), VCCAUX (PLL/auxiliary), and multiple VCCIO rails for I/O banks supporting different I/O voltages (1.2V-3.3V). According to the Cyclone 10 LP datasheet, power-on sequencing is critical: VCCINT must ramp before or simultaneously with VCCIO; VCCAUX must follow. Use a power management IC with programmable sequencing (e.g., Intel's Enpirion family) rather than discrete regulators for production designs. Decoupling per PDN guidelines is essential for jitter performance.
Common pitfalls when designing with the 10CL080ZF780I8G: (1) Exceeding I/O bank VCCIO constraints - each bank has a fixed VCCIO and I/O standards must match. (2) Forgetting to strap MSEL pins for the correct configuration mode (AS vs PS vs JTAG). (3) Insufficient decoupling near PLL analog supply pins causing jitter. (4) Using C-grade parts in industrial temperature environments - always verify the suffix (I8/I7 = industrial, C8/C6 = commercial). (5) Designing I/O assignments without checking Quartus Prime bank compatibility. Always run the Quartus Prime Fitter and I/O Assignment Analysis before tape-out.
Estimated: At 100% logic utilization with 200 MHz clock on a typical Cyclone 10 LP design, the 10CL080 device dissipates approximately 1.5-2.5W of power in the 780-BGA package. With theta_JA around 15-20 C/W for the 780-BGA on a standard 4-layer PCB (per typical BGA thermal specs), junction temperature rise is approximately 30-50C above ambient. For industrial -40C to +100C ambient deployments, design thermal management to keep Tj under 100C. Use thermal vias under the package's center ground pad and adequate copper pour on top/bottom layers.
Informations de conformité
RoHS and REACH compliant per Intel product page. Industrial temperature grade -40C to +100C. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC).
