5CSEBA2U23A7N - Cyclone V SE SoC FPGA 25K LE | Intel / Altera
Référence : 5CSEBA2U23A7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $138.37 | $138,37 |
| 10 | $132.5 | $1 325,00 |
| 100 | $122 | $12 200,00 |
| 500 | $110 | $55 000,00 |
| 1 000 | $99.5 | $99 500,00 |
5CSEBA2U23A7N Présentation
An SoC FPGA is an integrated device that pairs a microprocessor subsystem with a programmable logic fabric on a single die. The ARM Cortex-A9 MPCore subsystem provides general-purpose processing, DDR controllers, and standard I/O (USB, Ethernet, CAN, SPI, I2C, UART, SD/SDIO/MMC, NAND flash controller), while the FPGA fabric implements custom accelerators, interfaces, glue logic, and high-speed parallel DSP. Cyclone V SE devices target cost- and power-sensitive embedded designs that benefit from both processor and programmable-logic flexibility on a single chip.
Key features of the 5CSEBA2U23A7N include approximately 25,000 logic elements (LEs), embedded M10K memory blocks for on-chip buffering, variable-precision DSP blocks for signal-processing pipelines, and a high-speed interconnect between the HPS and FPGA fabric. The 672-UBGA package exposes 188 user I/Os and supports commercial-grade temperature operation (A7N speed grade). The 28 nm low-power process balances static and dynamic power, allowing fan-less and thermally constrained designs without sacrificing FPGA capacity.
Architecturally, the device combines dual 32-bit ARM Cortex-A9 cores with NEON media engine, a CoreSight debug trace system, level-2 cache, SDRAM controller, and quad-SPI flash interfaces on the HPS side. The FPGA fabric provides 6-input adaptive logic modules (ALMs), 18x18 multipliers, fractional PLLs, and external memory interfaces (DDR2/DDR3/LPDDR2). Hardware-design flow uses Intel Quartus Prime with Platform Designer for system integration, while software development is supported by ARM Development Studio, DS-5, or Yocto-based Linux SDKs.
Typical applications include industrial machine vision and motor control, factory automation controllers, broadcast video processing, medical imaging pre-processing, automotive driver-assistance sub-systems (with proper qualification), smart-grid / energy monitoring, secure gateways for IoT edge nodes, and military/aerospace signal processing. The combination of deterministic FPGA I/O latency and Linux-capable application processors suits workloads that mix high-throughput data-plane tasks with rich control-plane software stacks.
When designing with this part, ensure the HPS clock and reset sequence follows the Cyclone V SoC Hardware Reference Manual. The HPS boots first; FPGA fabric can be configured over U-Boot or a Configuration QSPI flash attached to the HPS pins. Allocate decoupling capacitors around the multi-rail HPS supply pins and provide adequate copper for the 28 nm fabric's dynamic current transients.
This page synthesizes distributor pricing, Cyclone V family comparison alternatives, and practical HPS+FPGA design notes not found in a single manufacturer datasheet, helping engineers evaluate drop-in SoC FPGA options and select the right speed/temperature grade for volume production.
Alternatives de remplacement direct pour 5CSEBA2U23A7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5CSEBA2U23A7N (même facteur de forme et même empreinte) — différant par Package, Logic Elements, DSP Blocks, Process Technology, HPS Maximum Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5CSEBA2U19A7N
✅ Remplacement direct✓ En stock
$92.1 / unité
Voir la fiche technique →5CSEMA2U23I7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
5CSEMA4U23I7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
5CSEBA5U23I7N
✅ Remplacement direct✓ En stock
$132.1 / unité
Voir la fiche technique →5CSEBA2U19I7SN
✅ Remplacement direct✓ En stock
$65.96 / unité
Voir la fiche technique →5CSEBA2U19C7N
✅ Remplacement direct✓ En stock
$16.9 / unité
Voir la fiche technique →5CSEBA2U23A7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone V SE SoC FPGA |
| MPN Code | 5CSEBA2U23A7N (Cyclone V SE A2, U23 package) |
| Logic Elements | 25,000 LE |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Process Technology | 28 nm low-power |
| User I/O | 188 |
| Boîtier | 672-UBGA (23x23 mm) |
| Speed Grade | 7 |
| Statut RoHS | Compliant (per ampheo listing) |
| Type de montage | Surface Mount (BGA) |
| Operating Voltage (Core) | 1.1 V (typical FPGA core, multi-rail HPS) |
| Configuration Scheme | HPS-boot of FPGA fabric via configuration QSPI |
Guide de configuration des broches du 5CSEBA2U23A7N 672-ubga (23x23 mm)
Configuration des broches du 5CSEBA2U23A7N (boîtier 672-ubga (23x23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 5CSEBA2U23A7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
5CSEBA2U23A7N convient pour 6 applications: Industrial Motor Control and Drives, Machine Vision and Image Pre-Processing, Broadcast Video Processing, Industrial IoT Edge Gateway, Medical Imaging Front-End, Smart Energy / Sub-Station Controller.
Industrial Motor Control and Drives
The 5CSEBA2U23A7N is well-suited for industrial motor-control platforms because the FPGA fabric executes deterministic PWM generation, encoder feedback, and field-weakening math with sub-microsecond latency while the dual-core ARM Cortex-A9 HPS runs vector-control loops, torque/flux estimators, and the EtherCAT/CANopen stack. The 25K logic elements accommodate up to three-axis FOC plus protection logic, and the DDR3 controller on the HPS handles logging and parameter storage. For factory-automation deployments, the A7N commercial grade covers 0-85C cabinet environments; for harsh sites, the I7N variant on the same U672 footprint extends range to -40C to +100C.
Recommandé
Machine Vision and Image Pre-Processing
In machine-vision cameras and AOI systems, the 5CSEBA2U23A7N's FPGA fabric absorbs high-throughput pixel pipelines (MIPI CSI-2, LVDS, sub-LVDS, parallel CCD) and runs pre-processing kernels such as demosaicing, gamma correction, and Bayer-to-YUV conversion in hardware. The HPS Cortex-A9 then hosts Linux with OpenCV, performs defect-detection inference, and pushes results over GigE Vision or USB3 Vision. The 25K LE budget fits typical 1080p60 pipelines, and the HPS-side USB 2.0 + EMAC simplify peripheral integration for compact embedded vision modules.
Recommandé
Broadcast Video Processing
Broadcast video appliances using the 5CSEBA2U23A7N benefit from the FPGA's parallel DSP blocks for SDI de/embedding, color-space conversion (REC.709, REC.2020), and audio shuffling at full broadcast rates, while the HPS runs control software, web interfaces, and SNMP. The U672 package exposes enough LVDS pairs for 3G-SDI I/O and the DDR3 controller on the HPS handles frame-buffer memory. Software-defined broadcast upgrades can be deployed over the configuration QSPI flash without changing hardware, extending product lifecycle in studio and OB-truck environments.
Recommandé
Industrial IoT Edge Gateway
The 5CSEBA2U23A7N fits industrial IoT gateway designs where the HPS Cortex-A9 runs a secure Linux stack (OP-TEE, secure boot, IPsec/DTLS) while the FPGA fabric aggregates legacy fieldbuses (Modbus RTU/TCP, PROFIBUS, CAN, RS-485) and pre-processes sensor data before publishing to MQTT brokers. The dual-core HPS handles encryption (AES/SHA) and TLS handshakes with cloud platforms, while the fabric accelerates deterministic protocol timers. Industrial temperature variants (I7N) of the same U672 package extend deployment to outdoor enclosures and factory floors with wide thermal swings.
Recommandé
Medical Imaging Front-End
Ultrasound, endoscopy, and patient-monitoring front-ends use the 5CSEBA2U23A7N to digitize transducer data in the FPGA fabric (variable-precision DSP for beamforming), then forward beamformed streams to the HPS for image reconstruction, DICOM packaging, and HL7 messaging. The 700 MHz Cortex-A9 with NEON accelerates JPEG2000 and H.264 compression for telemedicine transmission. Medical designs must implement IEC 60601 isolation externally and verify EMI/EMC compliance; the A7N commercial grade is sufficient for controlled clinical environments.
Recommandé
Smart Energy / Sub-Station Controller
Sub-station automation and smart-energy controllers using the 5CSEBA2U23A7N leverage the FPGA fabric for IEC 61850 GOOSE message timestamping at 4 kHz, sampled-value (SV) processing, and parallel protection logic, while the HPS runs the IEC 61850 station-bus stack, SCADA protocols, and analytics. The wide temperature range of the I7N variant on the same U672 footprint is required for sub-station cabinets from -40C to +70C. Hardware crypto on the HPS (AES, SHA, PKA) secures grid communications per NERC CIP requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5CSEBA2U23A7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5CSEBA2U19A7N | 5CSEMA2U23I7N | 5CSEMA4U23I7N | 5CSEBA5U23I7N | 5CSEBA2U19I7SN |
|---|---|---|---|---|---|---|
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U19, 19x19 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U19, 19x19 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC |
| Logic Elements | 25,000 LE | 25,000 LE | 25,000 LE | ~40,000 LE (+60%) | ~85,000 LE (+240%) | 25,000 LE |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore |
| Temperature Grade | Commercial (A7N, 0C to +85C) | Commercial (A7N) | Industrial (I7N, -40C to +100C) | Industrial (I7N) | Industrial (I7N) | Industrial (I7N) |
| Process / Core Voltage | 28 nm / 1.1 V typical | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V |
Principaux différenciateurs
- Lowest-density Cyclone V SE SoC variant for cost-sensitive designs (vs 5CSEBA5U23I7N)
- Commercial A7N grade at lower cost than industrial I7N (vs 5CSEMA2U23I7N)
- Dual-core Cortex-A9 HPS at 700 MHz on a single SoC (vs 5CGXBC7C7F23C8N (Cyclone V GX FPGA without HPS))
Notes de conception
Cyclone V SE SoC devices use a multi-rail supply scheme: VCCINT (core, typically 1.1 V), VCCAUX/VAUX, VCCPD (I/O pre-drivers), per-bank VCCIO, plus HPS-specific VCC_HPS, VCC_HPS_IO, DDR_VTT. Decouple each rail with 0.1 uF + bulk ceramic near each BGA pin group; the HPS core rail in particular needs a 22 uF + 0.1 uF pair for boot inrush. Use the Cyclone V SE Pin Connection Guidelines to identify every power pin and recommended bulk/cap values. Power sequencing must follow the device datasheet - failure to sequence HPS rails can prevent boot.
Estimated: at full utilization (FPGA fabric 80% toggle rate, HPS at 700 MHz dual-core), the 672-UBGA package dissipates approximately 5-8 W. The U23 23x23 mm BGA has a typical theta_JA around 15 C/W with sufficient PCB copper pour (8-layer, 2 oz inner layers, dedicated thermal via array under the exposed die pad). For fan-less enclosures, attach a heatsink with thermal interface material to the package top; for sealed IP67 enclosures, derate to I7N industrial grade which has higher thermal margin. Always simulate in Quartus Prime PowerPlay early in the design cycle.
The 672-UBGA at 0.8 mm or 1.0 mm pitch (verify from device-specific package drawing) requires HDI PCB stack-up with microvias and 1 oz finished copper on outer layers. Route DDR3 traces from the HPS controller as fly-by topology with matched lengths (within +/- 25 mil on byte lanes); use the Cyclone V SE External Memory Interface Handbook for the exact tDVBP/tDS constraints. Keep HPS clock traces short and reference continuous ground pour; place the 25 MHz HPS reference crystal within 200 mils of the CLK1 pins with a guard ring.
Common pitfalls on Cyclone V SE SoC designs include: (1) assuming the FPGA fabric boots automatically - the HPS must boot first from QSPI/NAND/SD and load the fabric bitstream via the HPS-to-FPGA bridge; (2) forgetting to configure the HPS pin multiplexing - most HPS pins have up to 8 alternate functions set in System Manager; (3) under-budgeting M10K blocks - each EMIF interface and soft CPU implementation consumes M10K; (4) missing BSDL/IBIS models for production test - generate via Quartus Prime before tape-out. Always validate boot via the SoC EDS prebuilt U-Boot image on hardware before custom firmware.
Informations de conformité
RoHS compliant and lead-free per ampheo listing. REACH, halogen-free, and conflict-mineral status should be requested from Intel product compliance portal. Not AEC-Q100 qualified - the SE family is not automotive-grade; for automotive, see Cyclone V SE Auto variants.