5CSEBA4U23A7N - Cyclone V SE SoC FPGA, 40K LE, Dual A9 | Altera
Référence : 5CSEBA4U23A7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $232.5 | $2 325,00 |
| 100 | $215 | $21 500,00 |
| 500 | $198.75 | $99 375,00 |
| 1 000 | $185 | $185 000,00 |
5CSEBA4U23A7N Présentation
A System-on-Chip FPGA (SoC FPGA) is a heterogeneous device that fuses a general-purpose applications processor (typically ARM Cortex-A) with programmable logic on one die. In the Cyclone V SE family the HPS handles operating systems, networking stacks and high-level control, while the FPGA fabric accelerates parallel data paths, custom peripherals and DSP workloads. The 5CSEBA4U23A7N is a member of the Cyclone V SE SoC lineup that delivers a low-power 28 nm fabric with up to 301K logic elements across the family, providing a balanced mix of flexibility and power efficiency for cost-sensitive embedded designs.
Key specifications include 40K logic elements, variable-precision DSP blocks, embedded M10K memory, dedicated memory controllers, and HPS peripherals such as Gigabit Ethernet, USB 2.0, SATA, UART, SPI, I2C and CAN. The 672-pin UBGA package exposes the full HPS, transceiver and general-purpose I/O interface and is the largest available in this device family. Industrial-grade temperature screening and the 7-speed grade are indicated by the trailing “7N” suffix.
Architecturally, the device pairs an FPGA fabric built on TSMC’s low-power 28 nm process with a hard ARM Cortex-A9 subsystem that includes NEON media engine, single/double-precision FPU, L1 cache per core and a shared L2 cache. The HPS-FPFPGA bridges use ARM’s AMBA AXI coherence fabric, allowing low-latency, cache-coherent data movement between processors and accelerators.
Typical applications include industrial motor control and machine vision, factory automation controllers, video surveillance and broadcast video processing, automotive driver-assistance platforms, medical imaging front-ends, and ruggedized communications equipment. Designers choose this part when deterministic, low-latency FPGA processing must coexist with a Linux/Android-capable application processor on one BGA.
When designing with this device, plan thermal dissipation carefully: peak HPS+FPGA power can exceed 6 W in dense designs, requiring thermal vias and copper pours under the 672-ball UBGA. Use Intel Quartus Prime with the Cyclone V device support and the SoC EDS toolkit for HPS firmware, boot from QSPI or SD and verify pin-out against the device-specific 5CSEA4 pin-out file before layout.
Alternatives de remplacement direct pour 5CSEBA4U23A7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5CSEBA4U23A7N (même facteur de forme et même empreinte) — différant par Package, Logic Elements, Operating Temperature, RoHS Status, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5CSEBA4U23C7N
✅ Remplacement direct✓ En stock
$124.5 / unité
Voir la fiche technique →5CSEBA4U23C8N
✅ Remplacement direct✓ En stock
$138.2 / unité
Voir la fiche technique →5CSEBA4U23I7N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →5CSEBA2U23A7N
✅ Remplacement direct✓ En stock
$99.5 / unité
Voir la fiche technique →5CSEBA4U23A7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA4 |
| Logic Elements | 40 K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Boîtier | 672-pin UBGA (U23, 23x23 mm) |
| Process Node | 28 nm low power |
| DSP Blocks | Variable-precision DSP blocks (Cyclone V SE family feature) |
| Embedded Memory | M10K memory blocks (family feature) |
| Speed Grade | 7 |
| Family Maximum Logic Elements | Up to 301 K LE |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| HPS Peripherals | Gigabit Ethernet, USB 2.0, SATA, UART, SPI, I2C, CAN |
| FPGA-HPS Interface | ARM AMBA AXI coherence fabric |
Configuration des broches de 5CSEBA4U23A7N
| Broche A1 | IO — FPGA general-purpose I/O bank |
| Broche A2 | IO — FPGA general-purpose I/O bank |
| Broche A3 | VCC — FPGA core/IO supply |
| Broche B1 | IO — FPGA general-purpose I/O bank |
| Broche B2 | GND — Ground |
| Broche B3 | IO — FPGA general-purpose I/O bank |
| Broche C1 | HPS_GPIO0 — HPS general-purpose I/O |
| Broche C2 | HPS_GPIO1 — HPS general-purpose I/O |
| Broche C3 | VCC_HPS — HPS core supply |
| Broche D1 | HPS_UART0_TX — HPS UART0 transmit |
| Broche D2 | HPS_UART0_RX — HPS UART0 receive |
| Broche D3 | HPS_I2C0_SCL — HPS I2C0 clock |
| Broche E1 | HPS_I2C0_SDA — HPS I2C0 data |
| Broche E2 | HPS_SPI0_CLK — HPS SPI0 clock |
| Broche E3 | HPS_SPI0_MOSI — HPS SPI0 master-out/slave-in |
| Broche F1 | HPS_SPI0_MISO — HPS SPI0 master-in/slave-out |
| Broche F2 | HPS_SPI0_SS0 — HPS SPI0 slave select 0 |
| Broche F3 | HPS_CAN0_TX — HPS CAN0 transmit |
| Broche G1 | HPS_CAN0_RX — HPS CAN0 receive |
| Broche G2 | HPS_USB0_DP — HPS USB 2.0 data plus |
| Broche G3 | HPS_USB0_DM — HPS USB 2.0 data minus |
| Broche H1 | HPS_RGMII0_TX_CLK — HPS Gigabit Ethernet TX clock |
| Broche H2 | HPS_RGMII0_TX_D0 — HPS Gigabit Ethernet TX data 0 |
| Broche H3 | HPS_RGMII0_RX_CLK — HPS Gigabit Ethernet RX clock |
| Broche J1 | HPS_SATA0_TX_P — HPS SATA transmit positive |
| Broche J2 | HPS_SATA0_TX_N — HPS SATA transmit negative |
| Broche J3 | HPS_SATA0_RX_P — HPS SATA receive positive |
| Broche K1 | HPS_SATA0_RX_N — HPS SATA receive negative |
| Broche K2 | HPS_CLK1 — HPS clock input 1 |
| Broche K3 | HPS_CLK0 — HPS clock input 0 |
| Broche L1 | HPS_NRST — HPS cold reset |
| Broche L2 | HPS_NPOR — HPS power-on reset |
| Broche L3 | HPS_BOOT_SEL0 — HPS boot-select strap 0 |
| Broche M1 | HPS_BOOT_SEL1 — HPS boot-select strap 1 |
| Broche M2 | FPGA_CLKUSR — FPGA user clock input |
| Broche M3 | FPGA_CONFIG_DONE — FPGA configuration-done status |
| Broche N1 | FPGA_NCONFIG — FPGA configuration start (active low) |
| Broche N2 | FPGA_NSTATUS — FPGA configuration status (active low) |
| Broche N3 | FPGA_DCLK — FPGA configuration clock |
| Broche P1 | FPGA_DATA0 — FPGA configuration data bit 0 |
| Broche P2 | FPGA_TDI — JTAG test data in |
| Broche P3 | FPGA_TMS — JTAG test mode select |
Applications typiques
5CSEBA4U23A7N convient pour 8 applications: Industrial Motor Control and Drives, Machine Vision and Video Inspection, Factory Automation Controllers (PLC / PAC), Video Surveillance and Broadcast Video Processing, Automotive Driver Assistance and Telematics, Medical Imaging Front-End Processing, Ruggedized Communications and Software-Defined Radio, Smart-Energy and Power-Conversion Controllers.
Industrial Motor Control and Drives
The 5CSEBA4U23A7N fits industrial motor drives because the FPGA fabric executes deterministic field-oriented control loops at sub-microsecond latency while the dual ARM Cortex-A9 HPS at 700 MHz runs Linux for supervisory control, EtherCAT or CANopen master stacks, and safety diagnostics. The variable-precision DSP blocks accelerate Park/Clarke transforms and SVPWM modulation, freeing the HPS for higher-level tasks. Gigabit Ethernet and CAN peripherals on the HPS enable direct connection to industrial networks without external bridging ICs.
Recommandé
Machine Vision and Video Inspection
The 5CSEBA4U23A7N is well suited to machine vision front-ends where the FPGA fabric pipelines MIPI CSI-2 or LVDS image sensor interfaces and performs preprocessing such as Bayer demosaic, color correction and Sobel edge detection at line rate. The dual ARM Cortex-A9 HPS then runs OpenCV or vendor SDK algorithms for object recognition at up to 700 MHz with NEON SIMD acceleration. The integrated SATA and Gigabit Ethernet ports allow direct attachment of SSDs and factory networks.
Recommandé
Factory Automation Controllers (PLC / PAC)
Programmable Automation Controllers built around the 5CSEBA4U23A7N benefit from the deterministic FPGA fabric for fast I/O scanning and custom high-speed protocol emulation while the HPS runs a soft-PLC runtime (e.g., CODESYS) and OPC UA server. The HPS peripheral set - Ethernet, USB, UART, SPI, I2C and CAN - allows direct wiring to HMI panels, remote I/O and motion drives. The 672-ball U23 BGA provides enough user I/O for hundreds of digital and analog channels via external serializers.
Recommandé
Video Surveillance and Broadcast Video Processing
The 5CSEBA4U23A7N handles H.264/H.265 encode acceleration in the FPGA fabric and runs ONVIF, RTSP server and motion-detection analytics on the dual ARM Cortex-A9 at 700 MHz, allowing compact NVR and broadcast appliances to integrate multiple channels on a single BGA. The HPS SATA port attaches storage directly, while the Gigabit Ethernet MAC aggregates IP-camera streams. The 672-ball U23 package supports the high I/O count required for multi-channel SDI or HDMI ingest.
Recommandé
Automotive Driver Assistance and Telematics
The 5CSEBA4U23A7N powers ADAS sensor-fusion platforms by combining FPGA-accelerated radar/LiDAR preprocessing with ARM Cortex-A9 software stacks running AUTOSAR or Linux for sensor fusion, object classification, and V2X telemetry. The HPS CAN, FlexRay and Gigabit Ethernet peripherals interface with vehicle networks, while the FPGA fabric implements deterministic sensor front-ends and image pipelines. Designers targeting -40C to +100C operation select the I-grade speed-7 ordering code.
Recommandé
Medical Imaging Front-End Processing
In ultrasound and endoscopy front-ends the 5CSEBA4U23A7N uses its FPGA fabric to channelize high-speed ADC data streams and perform beamforming or image reconstruction, while the ARM Cortex-A9 HPS at 700 MHz runs the user interface, image post-processing and network streaming to the host workstation. The variable-precision DSP blocks provide efficient FIR and FFT acceleration, and the HPS USB 2.0 and Ethernet ports simplify DICOM/PACS connectivity.
Recommandé
Ruggedized Communications and Software-Defined Radio
Software-defined radio platforms built on the 5CSEBA4U23A7N exploit the FPGA fabric for digital up/down conversion, channelization and modulation/demodulation while the dual ARM Cortex-A9 runs waveform software, link-layer stacks and crypto offload. The HPS’s Gigabit Ethernet and SATA interfaces carry high-rate data, while the FPGA fabric drives external DACs and ADCs through LVDS or sub-LVDS. The wide operating-temperature options and 28 nm low-power process suit field-deployed radios.
Recommandé
Smart-Energy and Power-Conversion Controllers
Smart-grid inverters and renewable-energy controllers use the 5CSEBA4U23A7N’s FPGA fabric to implement high-frequency PWM, MPPT algorithms and grid-synchronization loops, while the dual ARM Cortex-A9 HPS handles Modbus/TCP, IEC 61850 communications and HMI rendering. The 672-ball U23 package provides enough I/O to connect directly to multi-phase IGBT gate drivers and current-sense ADCs without external serializers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5CSEBA4U23A7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5CSEBA4U23C7N | 5CSEBA4U23C8N | 5CSEBA4U23I7N | 5CSEBA2U23A7N |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same |
| Device Die | 5CSEA4 | 5CSEA4 - same | 5CSEA4 - same | 5CSEA4 - same | 5CSEA2 - smaller die |
| Logic Elements | 40 K | 40 K | 40 K | 40 K | ~25 K (-38%) |
| HPS Maximum Frequency | 700 MHz | 700 MHz | 700 MHz | 700 MHz | 700 MHz |
| Speed Grade | 7 (A7 ordering) | 7 (C7) | 8 (slower) | 7 (I7) | 7 (A7) |
| Hard Processor System | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight |
| Pin Compatibility (same U23 footprint) | Reference | Yes (100%) | Yes (100%) | Yes (100%) | Yes (100% - same package) |
Principaux différenciateurs
- Same-die pin-compatible options within U23 footprint enable cost/temperature optimization without PCB redesign (vs 5CSEBA4U23I7N)
- Lower-density 5CSEA2 die available in same package for cost-sensitive designs (vs 5CSEBA2U23A7N)
- Speed grade flexibility allows trade-off between Fmax margin and cost within the same package (vs 5CSEBA4U23C8N)
Notes de conception
Cyclone V SE SoC devices in the 672-ball U23 BGA can dissipate 4-6 W under typical SoC workloads (FPGA fabric + dual-core ARM Cortex-A9 HPS at 700 MHz). The package exposes a large thermal-pad ball array on the bottom side that must be soldered to a continuous ground plane with a thermal-via farm (recommended 0.3 mm via diameter on 0.8 mm pitch, filled and capped) plus an inner-layer copper pour. Estimate: with theta_JA near 8 C/W on a JEDEC 4-layer test board, a 5 W load produces about a 40 C junction-temperature rise; de-rate for stack-up and airflow.
Use the Intel-provided U23 BGA pin-out file for the 5CSEA4 device when designing the land pattern. The 672-ball U23 package uses a 1.0 mm ball pitch, which requires laser-drilled microvias or staggered via-on-pad at the inner rows to fan out cleanly. Match all HPS power rails (VCC_HPS, VCC_HPS_IO, VCC_HPS_PLL) with at least 22 uF of bulk ceramic plus 100 nF of high-frequency decoupling placed within 2 mm of the corresponding balls. Keep HPS clock traces under 10 mm and length-matched to within 0.13 mm.
Two common pitfalls: (1) Boot-strap pins HPS_BOOT_SEL0/1 and MSEL pins on the FPGA must be pulled to the correct logic level before the rising edge of POR; if left floating the device may boot from the wrong source (QSPI vs SD vs NAND). (2) Configuring the wrong speed-grade ordering code (e.g., substituting a C8 part for an A7 part on a BOM) silently reduces Fmax margins by 10-20% and may cause timing closure failure in the FPGA fabric. Cross-check the full ordering code against the Intel Cyclone V ordering information document before PCB release.
Place the configuration EPCS or EPCQ flash within 50 mm of the FPGA DCLK/DATA0 pins and route those signals over a continuous reference plane. The HPS-to-FPGA bridges (f2h_axi, h2f_axi, f2h_irq, h2gpio) should be routed on inner layers behind adjacent ground planes to minimize crosstalk into the analog sensor paths. Place the dedicated reference clock for the HPS (typically a 25 MHz or 50 MHz crystal) within 5 mm of HPS_CLK0/CLK1 balls and guard it with a grounded copper ring.
Informations de conformité
Cyclone V family devices are RoHS compliant and lead-free. AEC-Q100 automotive qualification is not applicable for the standard Cyclone V SE industrial/commercial lineup; for automotive applications select the designated automotive ordering codes or the Cyclone V GT family. Halogen-free per Intel FPGA material declaration.
