5CSEBA5U23I7N - Cyclone V SE SoC FPGA 85K LE | Intel
MPN: 5CSEBA5U23I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $140.25 | $70,125.00 |
| 1,000 | $132.1 | $132,100.00 |
Drop-in alternatives for 5CSEBA5U23I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSEBA5U23I7LN
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View Datasheet →5CSEBA5U23C7N
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View Datasheet →5CSEBA4U23I7N
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View Datasheet →5CSEBA2U23I7N
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View Datasheet →5CSEBA5U23I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85,000 |
| Process Technology | 28 nm |
| Core Voltage | 1.1 V |
| HPS CPU | Dual ARM Cortex-A9 MPCore |
| Debug | ARM CoreSight |
| Maximum HPS Clock | 800 MHz |
| Package | 672-UBGA (23x23 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Hot Swap Support | Yes |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Lead Free | Yes |
| HPS Peripherals | EMAC, USB, SD/MMC, NAND, SPI, UART, I2C |
5CSEBA5U23I7N Pin Configuration
| Pin 1 | VCC — Core supply voltage |
| Pin 2 | GND — Ground reference |
| Pin 3 | HPS_VCC — Hard processor system supply |
| Pin 4 | IO_BANK_1 — FPGA I/O bank reference |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA5U23I7N is suitable for 7 applications: Industrial Motor Control, Machine Vision Systems, Software Defined Radio, Factory Automation Controllers, Medical Imaging Pre-Processing, Military and Aerospace Signal Processing, Smart Energy and Grid Edge.
Industrial Motor Control
The 5CSEBA5U23I7N suits industrial motor drives because its dual ARM Cortex-A9 HPS executes real-time FOC control loops while the 85K-LE FPGA fabric generates PWM modulators, encoder interfaces, and Sigma-Delta modulators. With 800 MHz HPS clock and hardware AXI bridges, feedback latency from ADC sample to PWM update stays under 1 microsecond. The -40C to +100C industrial temperature range and hot-swap support meet factory-floor cabinet requirements. Typical implementation uses one Cortex-A9 core for EtherCAT or Profinet fieldbus and the second for the control loop; the FPGA fabric offloads PWM, dead-time insertion, and resolver excitation. Reference designs in the Cyclone V SoC embedded design suite ship full motor-control firmware and Quartus RTL.
Recommended
Machine Vision Systems
The 5CSEBA5U23I7N is well matched to industrial machine vision because the FPGA fabric can ingest MIPI CSI-2 or parallel image-sensor streams at line rate while the dual Cortex-A9 HPS runs OpenCV-based inspection algorithms. The shared HPS-FPGA DDR interface allows zero-copy frame buffers for full-HD video at 60 fps without external memory contention. The 85K LEs accommodate hardware Sobel, thresholding, and connectivity pre-processing that offload the CPUs to track multiple objects per frame. The integrated EMAC and USB OTG simplify GigE Vision and USB3 Vision host connectivity, eliminating an external PHY controller.
Recommended
Software Defined Radio
The 5CSEBA5U23I7N enables entry-level SDR designs by mapping DDC/DUC and channelizer FFTs into the 85K-LE FPGA fabric while the dual Cortex-A9 HPS runs GNU Radio or a custom signal-processing stack. The shared DDR3 controller (in the HPS) lets the FPGA fabric stream complex baseband samples directly to the processors for demodulation, with hardware DMA via the AXI bridges reducing CPU interrupt load. With on-chip transceivers absent in this SE variant, external ADC/DAC pairs interface over LVDS - the 85K LEs comfortably host a 16-tap polyphase filter bank for LTE channelization. Hot-swap capability simplifies insertion into modular SDR chassis.
Recommended
Factory Automation Controllers
The 5CSEBA5U23I7N is an ideal PLC and PAC platform because the dual Cortex-A9 HPS runs a real-time Linux or VxWorks distribution with EtherCAT, Profinet, or Modbus TCP stacks while the FPGA fabric implements custom industrial I/O - high-speed counters, PWM, frequency measurement, and isolated digital interfaces. The integrated EMAC, USB, and SD/MMC peripherals reduce external component count on the carrier PCB. Industrial temperature grade -40C to +100C plus hot-swap support allow cabinet-free mounting and live rack replacement during production line changes.
Recommended
Medical Imaging Pre-Processing
The 5CSEBA5U23I7N fits medical ultrasound and endoscopy pre-processing because the FPGA fabric can run beamforming, FFT, and I/Q demodulation pipelines with deterministic latency while the dual Cortex-A9 HPS handles patient interface, image reconstruction, and DICOM stack. The HPS-FPGA shared DDR allows raw RF samples to flow directly into preprocessing buffers without an external frame grabber. The 85K-LE budget supports 32-channel beamformers used in portable ultrasound carts; lower-channel systems can move to 5CSEBA4U23I7N for cost reduction. Industrial temperature and lifecycle longevity make the part viable for medical device certification paths.
Recommended
Military and Aerospace Signal Processing
The 5CSEBA5U23I7N targets ruggedized signal processing in defense and avionics subsystems because the dual Cortex-A9 HPS runs secure boot, while the 85K-LE FPGA fabric handles encryption, packet processing, and radar or EW pre-processing. The industrial temperature range -40C to +100C and hot-swap support suit avionics bays and shipboard electronics. Although the SE variant lacks transceivers, external serializer/deserializer parts interface over LVDS through FPGA I/O. Long lifecycle commitments from the Cyclone V generation and Intel's continued silicon supply make this part suitable for multi-year defense programs.
Recommended
Smart Energy and Grid Edge
The 5CSEBA5U23I7N fits grid-edge intelligent electronic devices because the dual Cortex-A9 HPS runs secure communication stacks (DLMS/COSEM, IEC 61850) while the FPGA fabric executes high-speed sampling for power-quality monitoring and protective relays. The 85K LEs accommodate multi-channel 16-bit sigma-delta decimation chains. Hot-swap support simplifies live maintenance of grid-edge cabinets, and the industrial temperature range meets outdoor substation requirements. Integrated EMAC and USB streamline connection to distribution automation networks.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U23I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U23I7LN | 5CSEBA5U23I7 | 5CSEBA5U23C8N | 5CSEBA5U23C7N | 5CSEBA4U23I7N | 5CSEBA2U23I7N |
|---|---|---|---|---|---|---|---|
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 85,000 | 85,000 | 85,000 | 85,000 | 85,000 | 40,000 | 25,000 |
| HPS Cores | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -7 | -8 | -7 | -8 | -7 | -7 | -7 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Hot Swap Support | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx Unit Price (1 pc) | $185.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Lower (40K LE) | Lower (25K LE) |
Key Differentiators
- Highest logic element count within the 5CSEBA5 UBGFA-672 family (vs 5CSEBA2U23I7N)
- Industrial temperature grade with hot-swap support (vs 5CSEBA5U23C7N)
- Faster speed grade than -8 alternatives (vs 5CSEBA5U23C8N)
- Same-package upgrade path to higher logic capacity (vs 5CSEBA4U23I7N)
Design Notes
The 672-ball UBGFA package requires a multi-layer PCB with laser-drilled microvias for the inner-row balls. Use Intel's provided UBGFA-672 symbol and footprint directly from the Quartus installation - never derive the footprint from a generic BGA library, as the ball pitch and ball-matrix dimensions vary between Cyclone V packages. Estimated: the UBGFA-672 (23x23 mm) at the package code used here is typically 0.5 mm pitch; verify in the device handbook pin-information file before finalizing the carrier PCB stackup.
Cyclone V SoC devices require multiple sequenced rails: VCC (1.1 V core), VCCPD, VCCIO banks, HPS_VCC, and DDRx_VTT. The HPS and FPGA rails must satisfy the bring-up order described in the Cyclone V SoC power management user guide - failure to sequence correctly can prevent the Cortex-A9 cores from booting. Reference Intel's power-tree reference designs for the typical sequencing controller (e.g., LTC or TI PMIC) recommended for each Cyclone V speed grade.
At -7 speed grade and full FPGA+HPS utilization, the 5CSEBA5U23I7N can dissipate 3-5 W depending on toggle rate and I/O loading. Industrial enclosures should mount the device with a thermal pad or heat spreader to the chassis wall; the UBGFA-672 package does not have an integrated heat spreader lid, so cooling depends entirely on PCB copper and external heat-sinking. Estimated: a 4-layer PCB with continuous inner ground plane typically yields theta-JA of approximately 15-20 C/W for UBGFA-672; verify with the package thermal model file in the Cyclone V device handbook.
Do not bypass the configuration-mode jumper for the MSEL pins - incorrect MSEL settings prevent the FPGA fabric from loading from the chosen boot source (e.g., SD card, QSPI flash, JTAG). Always check the Cyclone V configuration user guide for the resistor pull values on MSEL[3:0]. A common mistake is leaving the HPS boot source defined in the preloader image inconsistent with the FPGA configuration mode - this causes the HPS to boot Linux before the fabric is ready, hanging the application.
Route the HPS-to-FPGA AXI bridges on inner striplines with matched length within each byte lane. The HPS DDR3 controller has stringent skew requirements - route byte lanes with <50 mil skew and maintain a clean reference plane. Place the HPS reset and JTAG pins on a dedicated header or test point cluster to simplify debug, since recovering a misconfigured boot sequence typically requires JTAG access.
Compliance Information
RoHS compliant per distributor listings. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade IC; AEC-Q100 is not applicable to programmable logic. Halogen-free status not stated in available data; consult Intel RoHS declaration letter for confirmation.
