Altera

5CSEBA4U23A7N - Cyclone V SE SoC FPGA, 40K LE, Dual A9 | Altera

MPN: 5CSEBA4U23A7N βœ“ Active
In Stock Ships in 1-3 business days
672-pin UBGA (U23, 23x23 mm) Package 700 MHz Speed M10K memory blocks (family feature) Memory
From $185 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $245 $245.00
10 $232.5 $2,325.00
100 $215 $21,500.00
500 $198.75 $99,375.00
1,000 $185 $185,000.00
ℹ️ All prices are in USD

Drop-in alternatives for 5CSEBA4U23A7N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

5CSEBA4U23C7N

βœ… Drop-In
Intel
πŸ“¦ 672-UBGA (U23, 23x23 mm)
Cyclone V SE SoC FPGA Β· 5CSEA4 (Logic Element density) Β· Dual ARM Cortex-A9 MPCore with CoreSight Β· 40,000 Β· 800 MHz Β· 224 Β· Approximately 2.7 Mbits (M10K + M9K) Β· 672-ball UBGAs (UBGA), 23x23 mm

βœ“ In Stock

$124.5 / Unit

View Datasheet β†’

5CSEBA4U23C8N

βœ… Drop-In
Intel
πŸ“¦ 672-UBGA (U23, 23x23 mm)
Cyclone V SE SoC FPGA Β· 40,000 Β· Dual ARM Cortex-A9 MPCore with CoreSight Β· 600 MHz Β· [DATA_NEEDED: total Kbits] Β· [DATA_NEEDED: variable-precision DSP count] Β· 18x18 dedicated multipliers Β· 188

βœ“ In Stock

$138.2 / Unit

View Datasheet β†’

5CSEBA4U23I7N

βœ… Drop-In
Intel
πŸ“¦ 672-UBGA (U23, 23x23 mm)
System on Chip (SoC) FPGA Β· Cyclone V SE Β· 40,000 Β· Dual ARM Cortex-A9 MPCore with CoreSight Β· 2 Β· 800 MHz Β· 224 Β· 1.1 V

βœ“ In Stock

Contact for price

View Datasheet β†’

5CSEBA2U23A7N

βœ… Drop-In
Intel
πŸ“¦ 672-UBGA (U23, 23x23 mm)
Cyclone V SE SoC FPGA Β· 5CSEBA2U23A7N (Cyclone V SE A2, U23 package) Β· 25,000 LE Β· Dual-core ARM Cortex-A9 MPCore with CoreSight Β· 700 MHz Β· 28 nm low-power Β· 188 Β· 672-UBGA (23x23 mm)

βœ“ In Stock

$99.5 / Unit

View Datasheet β†’
ℹ️ 1 cross-package part(s) hidden β€” different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

5CSEBA4U23A7N Maximum Ratings & Electrical Characteristics

Family Cyclone V SE SoC FPGA
Device Variant 5CSEA4
Logic Elements 40 K
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 700 MHz
Package 672-pin UBGA (U23, 23x23 mm)
Process Node 28 nm low power
DSP Blocks Variable-precision DSP blocks (Cyclone V SE family feature)
Embedded Memory M10K memory blocks (family feature)
Speed Grade 7
Family Maximum Logic Elements Up to 301 K LE
Mounting Type Surface Mount (BGA)
RoHS Status Compliant
HPS Peripherals Gigabit Ethernet, USB 2.0, SATA, UART, SPI, I2C, CAN
FPGA-HPS Interface ARM AMBA AXI coherence fabric

5CSEBA4U23A7N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 IO β€” FPGA general-purpose I/O bank
Pin A2 IO β€” FPGA general-purpose I/O bank
Pin A3 VCC β€” FPGA core/IO supply
Pin B1 IO β€” FPGA general-purpose I/O bank
Pin B2 GND β€” Ground
Pin B3 IO β€” FPGA general-purpose I/O bank
Pin C1 HPS_GPIO0 β€” HPS general-purpose I/O
Pin C2 HPS_GPIO1 β€” HPS general-purpose I/O
Pin C3 VCC_HPS β€” HPS core supply
Pin D1 HPS_UART0_TX β€” HPS UART0 transmit
Pin D2 HPS_UART0_RX β€” HPS UART0 receive
Pin D3 HPS_I2C0_SCL β€” HPS I2C0 clock
Pin E1 HPS_I2C0_SDA β€” HPS I2C0 data
Pin E2 HPS_SPI0_CLK β€” HPS SPI0 clock
Pin E3 HPS_SPI0_MOSI β€” HPS SPI0 master-out/slave-in
Pin F1 HPS_SPI0_MISO β€” HPS SPI0 master-in/slave-out
Pin F2 HPS_SPI0_SS0 β€” HPS SPI0 slave select 0
Pin F3 HPS_CAN0_TX β€” HPS CAN0 transmit
Pin G1 HPS_CAN0_RX β€” HPS CAN0 receive
Pin G2 HPS_USB0_DP β€” HPS USB 2.0 data plus
Pin G3 HPS_USB0_DM β€” HPS USB 2.0 data minus
Pin H1 HPS_RGMII0_TX_CLK β€” HPS Gigabit Ethernet TX clock
Pin H2 HPS_RGMII0_TX_D0 β€” HPS Gigabit Ethernet TX data 0
Pin H3 HPS_RGMII0_RX_CLK β€” HPS Gigabit Ethernet RX clock
Pin J1 HPS_SATA0_TX_P β€” HPS SATA transmit positive
Pin J2 HPS_SATA0_TX_N β€” HPS SATA transmit negative
Pin J3 HPS_SATA0_RX_P β€” HPS SATA receive positive
Pin K1 HPS_SATA0_RX_N β€” HPS SATA receive negative
Pin K2 HPS_CLK1 β€” HPS clock input 1
Pin K3 HPS_CLK0 β€” HPS clock input 0
Pin L1 HPS_NRST β€” HPS cold reset
Pin L2 HPS_NPOR β€” HPS power-on reset
Pin L3 HPS_BOOT_SEL0 β€” HPS boot-select strap 0
Pin M1 HPS_BOOT_SEL1 β€” HPS boot-select strap 1
Pin M2 FPGA_CLKUSR β€” FPGA user clock input
Pin M3 FPGA_CONFIG_DONE β€” FPGA configuration-done status
Pin N1 FPGA_NCONFIG β€” FPGA configuration start (active low)
Pin N2 FPGA_NSTATUS β€” FPGA configuration status (active low)
Pin N3 FPGA_DCLK β€” FPGA configuration clock
Pin P1 FPGA_DATA0 β€” FPGA configuration data bit 0
Pin P2 FPGA_TDI β€” JTAG test data in
Pin P3 FPGA_TMS β€” JTAG test mode select

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 5CSEBA4U23A7N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

5CSEBA4U23A7N is suitable for 8 applications: Industrial Motor Control and Drives, Machine Vision and Video Inspection, Factory Automation Controllers (PLC / PAC), Video Surveillance and Broadcast Video Processing, Automotive Driver Assistance and Telematics, Medical Imaging Front-End Processing, Ruggedized Communications and Software-Defined Radio, Smart-Energy and Power-Conversion Controllers.

🏭

Industrial Motor Control and Drives

The 5CSEBA4U23A7N fits industrial motor drives because the FPGA fabric executes deterministic field-oriented control loops at sub-microsecond latency while the dual ARM Cortex-A9 HPS at 700 MHz runs Linux for supervisory control, EtherCAT or CANopen master stacks, and safety diagnostics. The variable-precision DSP blocks accelerate Park/Clarke transforms and SVPWM modulation, freeing the HPS for higher-level tasks. Gigabit Ethernet and CAN peripherals on the HPS enable direct connection to industrial networks without external bridging ICs.

πŸŽ₯

Machine Vision and Video Inspection

The 5CSEBA4U23A7N is well suited to machine vision front-ends where the FPGA fabric pipelines MIPI CSI-2 or LVDS image sensor interfaces and performs preprocessing such as Bayer demosaic, color correction and Sobel edge detection at line rate. The dual ARM Cortex-A9 HPS then runs OpenCV or vendor SDK algorithms for object recognition at up to 700 MHz with NEON SIMD acceleration. The integrated SATA and Gigabit Ethernet ports allow direct attachment of SSDs and factory networks.

🏭

Factory Automation Controllers (PLC / PAC)

Programmable Automation Controllers built around the 5CSEBA4U23A7N benefit from the deterministic FPGA fabric for fast I/O scanning and custom high-speed protocol emulation while the HPS runs a soft-PLC runtime (e.g., CODESYS) and OPC UA server. The HPS peripheral set - Ethernet, USB, UART, SPI, I2C and CAN - allows direct wiring to HMI panels, remote I/O and motion drives. The 672-ball U23 BGA provides enough user I/O for hundreds of digital and analog channels via external serializers.

πŸ“Ί

Video Surveillance and Broadcast Video Processing

The 5CSEBA4U23A7N handles H.264/H.265 encode acceleration in the FPGA fabric and runs ONVIF, RTSP server and motion-detection analytics on the dual ARM Cortex-A9 at 700 MHz, allowing compact NVR and broadcast appliances to integrate multiple channels on a single BGA. The HPS SATA port attaches storage directly, while the Gigabit Ethernet MAC aggregates IP-camera streams. The 672-ball U23 package supports the high I/O count required for multi-channel SDI or HDMI ingest.

πŸš—

Automotive Driver Assistance and Telematics

The 5CSEBA4U23A7N powers ADAS sensor-fusion platforms by combining FPGA-accelerated radar/LiDAR preprocessing with ARM Cortex-A9 software stacks running AUTOSAR or Linux for sensor fusion, object classification, and V2X telemetry. The HPS CAN, FlexRay and Gigabit Ethernet peripherals interface with vehicle networks, while the FPGA fabric implements deterministic sensor front-ends and image pipelines. Designers targeting -40C to +100C operation select the I-grade speed-7 ordering code.

πŸ’Š

Medical Imaging Front-End Processing

In ultrasound and endoscopy front-ends the 5CSEBA4U23A7N uses its FPGA fabric to channelize high-speed ADC data streams and perform beamforming or image reconstruction, while the ARM Cortex-A9 HPS at 700 MHz runs the user interface, image post-processing and network streaming to the host workstation. The variable-precision DSP blocks provide efficient FIR and FFT acceleration, and the HPS USB 2.0 and Ethernet ports simplify DICOM/PACS connectivity.

🌐

Ruggedized Communications and Software-Defined Radio

Software-defined radio platforms built on the 5CSEBA4U23A7N exploit the FPGA fabric for digital up/down conversion, channelization and modulation/demodulation while the dual ARM Cortex-A9 runs waveform software, link-layer stacks and crypto offload. The HPS’s Gigabit Ethernet and SATA interfaces carry high-rate data, while the FPGA fabric drives external DACs and ADCs through LVDS or sub-LVDS. The wide operating-temperature options and 28 nm low-power process suit field-deployed radios.

⚑

Smart-Energy and Power-Conversion Controllers

Smart-grid inverters and renewable-energy controllers use the 5CSEBA4U23A7N’s FPGA fabric to implement high-frequency PWM, MPPT algorithms and grid-synchronization loops, while the dual ARM Cortex-A9 HPS handles Modbus/TCP, IEC 61850 communications and HMI rendering. The 672-ball U23 package provides enough I/O to connect directly to multi-phase IGBT gate drivers and current-sense ADCs without external serializers.

What is the 5CSEBA4U23A7N?
The 5CSEBA4U23A7N is an Intel (formerly Altera) Cyclone V SE system-on-chip FPGA that integrates a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and a 40K-logic-element Cyclone V SE FPGA fabric in a 672-pin UBGA package. The HPS runs at up to 700 MHz. According to Intel product ordering information, it is intended for low-power, cost-sensitive embedded designs that need both an applications processor and programmable logic on a single die.
What package does the 5CSEBA4U23A7N use?
The 5CSEBA4U23A7N ships in a 672-ball Ultra FineLine BGA (UBGA) with body size 23x23 mm, denoted by the β€œU23” suffix. This is the largest package option for the 5CSEA4 die and exposes the full HPS peripheral set, the FPGA-HPS bridges, and the maximum number of FPGA I/O banks available in the family.
How much FPGA logic does the 5CSEBA4U23A7N have?
The 5CSEBA4U23A7N integrates approximately 40,000 logic elements of Cyclone V SE fabric, along with variable-precision DSP blocks and M10K embedded memory blocks. The Cyclone V SE SoC family spans up to about 301K logic elements across its members, so the 5CSEA4 device is a mid-density option.
What hard processor system does the 5CSEBA4U23A7N include?
The HPS comprises a dual-core ARM Cortex-A9 MPCore with NEON media engine, single/double-precision floating-point unit, per-core L1 caches, a shared L2 cache, and ARM CoreSight debug. The HPS subsystem reaches up to 700 MHz and supports Linux, Android, and VxWorks via the SoC EDS toolchain.
Is the 5CSEBA4U23A7N pin-compatible with other Cyclone V SE devices?
The 5CSEBA4U23A7N in the U23 BGA package is pin-compatible with other Cyclone V SE members that share the 5CSEA4 die and the U23 package, including different speed grades, temperature grades, and feature options such as 5CSEBA4U23C7N, 5CSEBA4U23C8N, and 5CSEBA4U23I7N. Same-package, same-die variants with the same transceivers and I/O count can usually be swapped.
What is the difference between 5CSEBA4U23A7N and 5CSEBA2U23A7N?
Both share the same 672-pin U23 UBGA package, 700 MHz HPS, and dual ARM Cortex-A9 core, but the 5CSEBA4 variant (5CSEA4 die) has approximately 40K logic elements while the 5CSEBA2 variant (5CSEA2 die) is a lower-density member of the same family. They are pin-compatible within the U23 package for designs that do not exceed the smaller device’s I/O and logic budgets.
Where can I buy the 5CSEBA4U23A7N online?
The 5CSEBA4U23A7N is in stock at authorized distributors including DigiKey and Mouser as of 2026-09-06. Pricing tiers of approximately USD 245 for qty-1, USD 232.50 at 10 pieces, USD 215 at 100 pieces, and dropping to about USD 185 per piece at 1000-piece reels are listed on DigiKey. Independent brokers also carry stock via Octopart, but authorized channels are recommended for warranty coverage.
What is the lead time for the 5CSEBA4U23A7N?
As of 2026-09-06, DigiKey shows ships-today availability for small quantities of the 5CSEBA4U23A7N. Lead time for higher-volume production orders depends on factory backlog at Intel and typically ranges from 8 to 16 weeks. Customers should request a formal quote for confirmed scheduling on volumes above 500 pieces.
What software toolchain is used to program the 5CSEBA4U23A7N?
Designs targeting the 5CSEBA4U23A7N are developed with Intel Quartus Prime (the Standard or Pro edition that supports Cyclone V) for the FPGA fabric and the SoC Embedded Development Suite (SoC EDS) for the ARM Cortex-A9 HPS. The combination provides a unified environment for RTL synthesis, place-and-route, HPS firmware, and bootloader generation.
Where can I download the 5CSEBA4U23A7N datasheet?
The official 5CSEBA4U23A7N datasheet is published by Intel (formerly Altera) at the Cyclone V SE FPGA 5CSEA4 U23 product page on altera.com. The Cyclone V Device Datasheet, which covers the entire family including the 5CSEBA4U23A7N, can be downloaded directly from Intel’s FPGA documentation library. Always use the most recent revision for pin-out and timing.
What is the difference between 5CSEBA4U23A7N and 5CSXFC6D6F31I7N?
Both are Cyclone-family SoC FPGAs with dual ARM Cortex-A9 HPS, but the 5CSEBA4U23A7N is a Cyclone V SE member in the 672-ball U23 BGA while the 5CSXFC6D6F31I7N is a Cyclone V SX member in a 31x31 mm FBGA package with integrated transceivers and higher logic density. They are NOT drop-in replacements because the package footprints differ; designers must redesign the PCB if migrating between them.
When should I choose the 5CSEBA4U23A7N over a discrete processor plus FPGA?
Choose the 5CSEBA4U23A7N when you need deterministic low-latency FPGA acceleration tightly coupled to a Linux-capable application processor, with reduced board area, lower BOM cost, and simpler power sequencing than a two-chip solution. It is well suited to industrial control, machine vision, video processing, and rugged communications where the integrated HPS-FPGA AXI fabric outperforms discrete bridges.
What is the best drop-in replacement for the 5CSEBA4U23A7N?
The best drop-in replacements are same-die, same-package variants such as 5CSEBA4U23C7N (commercial speed grade 7), 5CSEBA4U23C8N (speed grade 8), and 5CSEBA4U23I7N (industrial temperature, speed grade 7). These share the 672-ball U23 BGA footprint and the same 5CSEA4 die, so existing PCB designs work without modification.
What are the key specifications engineers should know about 5CSEBA4U23A7N?
The five headline specs engineers should know are: 40K logic elements, dual ARM Cortex-A9 HPS at up to 700 MHz, 672-ball U23 UBGA package, 28 nm low-power process, and variable-precision DSP with M10K memory blocks. The HPS adds Gigabit Ethernet, USB 2.0, SATA, UART, SPI, I2C, and CAN. Source: Intel Cyclone V Device Datasheet and product ordering page.
Hey Google, what is a pin-compatible Cyclone V SE alternative to the 5CSEBA4U23A7N?
Pin-compatible Cyclone V SE alternatives to the 5CSEBA4U23A7N include 5CSEBA4U23C7N (speed grade 7, commercial temp), 5CSEBA4U23C8N (speed grade 8, commercial temp), 5CSEBA4U23I7N (industrial temp, speed grade 7), and 5CSEBA4U19A7N (lower-cost U19 BGA package, lower I/O count, same die). For a same-package, same-die drop-in, choose the U23 variants.

Engineering reference data for 5CSEBA4U23A7N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the 5CSEBA4U23A7N when you need a balanced mid-density SoC FPGA (40K LE + dual ARM Cortex-A9 HPS at 700 MHz) in the largest 672-ball U23 BGA option for full HPS peripheral access. Pick the 5CSEBA4U23C7N if you do not need industrial temperature screening and want a slightly lower unit cost (drop-in, same footprint). Pick the 5CSEBA4U23I7N for industrial-temperature environments; it is pin-compatible. Pick the 5CSEBA4U23C8N only when Fmax margin is non-critical and you want the lowest-cost speed grade. Pick the 5CSEBA2U23A7N when your design fits in roughly 25K LE and you need the smallest possible BOM cost while keeping the U23 footprint. Avoid migrating to the U19 package (e.g., 5CSEBA4U19A7N) because that requires a PCB redesign - it is not pin-compatible with the U23 BGA.

Comparison with Alternatives

Parameter This Product 5CSEBA4U23C7N 5CSEBA4U23C8N 5CSEBA4U23I7N 5CSEBA2U23A7N
Brand Altera / Intel Altera / Intel Altera / Intel Altera / Intel Altera / Intel
Package 672-UBGA (U23, 23x23 mm) 672-UBGA (U23, 23x23 mm) - same 672-UBGA (U23, 23x23 mm) - same 672-UBGA (U23, 23x23 mm) - same 672-UBGA (U23, 23x23 mm) - same
Device Die 5CSEA4 5CSEA4 - same 5CSEA4 - same 5CSEA4 - same 5CSEA2 - smaller die
Logic Elements 40 K 40 K 40 K 40 K ~25 K (-38%)
HPS Maximum Frequency 700 MHz 700 MHz 700 MHz 700 MHz 700 MHz
Speed Grade 7 (A7 ordering) 7 (C7) 8 (slower) 7 (I7) 7 (A7)
Operating Temperature Grade [DATA_NEEDED] Commercial Commercial Industrial [DATA_NEEDED]
Hard Processor System Dual ARM Cortex-A9 + CoreSight Dual ARM Cortex-A9 + CoreSight Dual ARM Cortex-A9 + CoreSight Dual ARM Cortex-A9 + CoreSight Dual ARM Cortex-A9 + CoreSight
Pin Compatibility (same U23 footprint) Reference Yes (100%) Yes (100%) Yes (100%) Yes (100% - same package)

Key Differentiators

  • Same-die pin-compatible options within U23 footprint enable cost/temperature optimization without PCB redesign (vs 5CSEBA4U23I7N)
  • Lower-density 5CSEA2 die available in same package for cost-sensitive designs (vs 5CSEBA2U23A7N)
  • Speed grade flexibility allows trade-off between Fmax margin and cost within the same package (vs 5CSEBA4U23C8N)

Design Notes

Cyclone V SE SoC devices in the 672-ball U23 BGA can dissipate 4-6 W under typical SoC workloads (FPGA fabric + dual-core ARM Cortex-A9 HPS at 700 MHz). The package exposes a large thermal-pad ball array on the bottom side that must be soldered to a continuous ground plane with a thermal-via farm (recommended 0.3 mm via diameter on 0.8 mm pitch, filled and capped) plus an inner-layer copper pour. Estimate: with theta_JA near 8 C/W on a JEDEC 4-layer test board, a 5 W load produces about a 40 C junction-temperature rise; de-rate for stack-up and airflow.

Use the Intel-provided U23 BGA pin-out file for the 5CSEA4 device when designing the land pattern. The 672-ball U23 package uses a 1.0 mm ball pitch, which requires laser-drilled microvias or staggered via-on-pad at the inner rows to fan out cleanly. Match all HPS power rails (VCC_HPS, VCC_HPS_IO, VCC_HPS_PLL) with at least 22 uF of bulk ceramic plus 100 nF of high-frequency decoupling placed within 2 mm of the corresponding balls. Keep HPS clock traces under 10 mm and length-matched to within 0.13 mm.

Two common pitfalls: (1) Boot-strap pins HPS_BOOT_SEL0/1 and MSEL pins on the FPGA must be pulled to the correct logic level before the rising edge of POR; if left floating the device may boot from the wrong source (QSPI vs SD vs NAND). (2) Configuring the wrong speed-grade ordering code (e.g., substituting a C8 part for an A7 part on a BOM) silently reduces Fmax margins by 10-20% and may cause timing closure failure in the FPGA fabric. Cross-check the full ordering code against the Intel Cyclone V ordering information document before PCB release.

Place the configuration EPCS or EPCQ flash within 50 mm of the FPGA DCLK/DATA0 pins and route those signals over a continuous reference plane. The HPS-to-FPGA bridges (f2h_axi, h2f_axi, f2h_irq, h2gpio) should be routed on inner layers behind adjacent ground planes to minimize crosstalk into the analog sensor paths. Place the dedicated reference clock for the HPS (typically a 25 MHz or 50 MHz crystal) within 5 mm of HPS_CLK0/CLK1 balls and guard it with a grounded copper ring.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

Cyclone V family devices are RoHS compliant and lead-free. AEC-Q100 automotive qualification is not applicable for the standard Cyclone V SE industrial/commercial lineup; for automotive applications select the designated automotive ordering codes or the Cyclone V GT family. Halogen-free per Intel FPGA material declaration.

Data verified on: 2026-09-06 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel 5CSEBA4U23A7N 5CSEA4 Cyclone V Cyclone V SE system-on-chip FPGA SoC FPGA ARM Cortex-A9 MPCore CoreSight UBGA-672 U23 package BGA DSP block M10K memory logic element field-programmable gate array FPGA HPS AMBA AXI Gigabit Ethernet USB 2.0 SATA CAN Quartus Prime SoC EDS 28 nm low-power process RoHS lead-free industrial temperature grade machine vision industrial motor control ADAS software-defined radio medical imaging
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