5M2210ZF256C4N - MAX V CPLD, 1700 LE, FBGA-256, C4 Speed | Intel / Altera
Référence : 5M2210ZF256C4N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.6 | $4 300,00 |
| 1 000 | $7.55 | $7 550,00 |
| 3 000 | $7.29 | $21 870,00 |
5M2210ZF256C4N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs/GALs and higher-density FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC). MAX V CPLDs are built on a 0.30 um 6-metal-layer CMOS process with a flash-based configuration cell, providing instant-on operation in less than 1 ms without an external boot PROM. They are used as glue logic, I/O expansion, interface bridging, and power-sequencing controllers in industrial, communications, and consumer systems. Unlike SRAM-based FPGAs that require external configuration memory, MAX V devices self-configure at power-up from internal flash.
Key features of the 5M2210ZF256C4N include 1700 LEs arranged in 221 Logic Array Blocks (LABs), 160 user I/O pins available in this FBGA-256 outline, a 1.8 V core supply (VCCINT) with multi-voltage I/O bank support (1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), and an internal oscillator plus JTAG (IEEE 1149.1) and IEEE 1532 in-system programmability. Typical tPD pin-to-pin delay is in the 4 ns class for speed grade 4, suitable for control-path rather than high-speed datapath applications. The device supports live insertion and 5 V tolerant I/O when the bank VCCIO is set below 3.3 V.
The device integrates the JTAG controller, internal voltage regulator, and configuration flash memory on-die, eliminating the external programming PROM required by legacy MAX and MAX II CPLDs. It also provides four user I/O banks for flexible mixed-voltage interfacing, allowing direct connection to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters.
Typical applications include bus interface bridging (e.g. PCI to local bus), I/O expansion for microcontrollers and ASICs, power-supply sequencing in multi-rail systems, configuration/control for companion FPGAs, and glue logic in industrial controllers and consumer set-top boxes. The FBGA-256 package and high I/O count make it suitable for high-density board-level integration.
When designing with this part, route all four VCCIO bank supplies and at least one VCCINT (1.8 V) supply with adequate decoupling (0.1 uF + bulk); unused I/O pins should be left floating or driven to a defined logic level to minimize in-rush during power-up. The 256-ball FBGA requires X-ray or BGA rework equipment for prototype bring-up, so allocate 2-3 days for first-article assembly.
This page synthesizes distributor pricing, drop-in MAX V family alternatives, BGA-256 pinout, and recommended design patterns not found in the bare manufacturer datasheet.
Alternatives de remplacement direct pour 5M2210ZF256C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M2210ZF256C4N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Programming Interface, Speed Grade, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M2210ZF256C5N
✅ Remplacement direct✓ En stock
$11.95 / unité
Voir la fiche technique →5M2210ZF256I5N
✅ Remplacement direct✓ En stock
$17.5 / unité
Voir la fiche technique →5M2210ZF256C4N
✅ Remplacement direct✓ En stock
$7.29 / unité
Voir la fiche technique →EPM570GF256C4N
✅ Remplacement direct✓ En stock
$9.45 / unité
Voir la fiche technique →5CEFA7F27C6N
✅ Remplacement direct✓ En stock
$218 / unité
Voir la fiche technique →5M2210ZF256C4N Valeurs maximales et caractéristiques électriques
| Family | MAX V |
| Device | 5M2210Z |
| Logic Elements (LEs) | 1700 |
| Logic Array Blocks (LABs) | 221 |
| User Flash Memory | 8192 bits |
| Internal RAM | 212 Kbits |
| Maximum User I/O (family) | 203 |
| User I/O (this package) | 160 |
| Boîtier | FBGA-256 (FineLine BGA) |
| Température de fonctionnement | 0C to 85C (Commercial) |
| Speed Grade | C4 (tPD ~4 ns class) |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Number of I/O Banks | 4 |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
| Configuration Method | Internal flash (instant-on < 1 ms) |
| Process Technology | 0.30 um 6-metal-layer CMOS |
| Statut RoHS | Compliant (Pb-free ball finish) |
Configuration des broches de 5M2210ZF256C4N
| Broche A1 | I/O — User I/O pin (Bank 1) |
| Broche A2 | I/O — User I/O pin (Bank 1) |
| Broche A3 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| Broche A4 | I/O — User I/O pin (Bank 1) |
| Broche A5 | I/O — User I/O pin (Bank 1) |
| Broche A6 | GND — Ground |
| Broche A7 | I/O — User I/O pin (Bank 1) |
| Broche A8 | I/O — User I/O pin (Bank 1) |
| Broche B1 | GND — Ground |
| Broche B2 | I/O — User I/O pin (Bank 1) |
| Broche B3 | I/O — User I/O pin (Bank 1) |
| Broche B4 | VCCINT — Core supply 1.8 V |
| Broche B5 | I/O — User I/O pin (Bank 1) |
| Broche B6 | I/O — User I/O pin (Bank 1) |
| Broche B7 | GND — Ground |
| Broche B8 | I/O — User I/O pin (Bank 1) |
| Broche C1 | I/O — User I/O pin (Bank 2) |
| Broche C2 | I/O — User I/O pin (Bank 2) |
| Broche C3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| Broche C4 | I/O — User I/O pin (Bank 2) |
| Broche C5 | I/O — User I/O pin (Bank 2) |
| Broche C6 | TCK — JTAG test clock input |
| Broche C7 | I/O — User I/O pin (Bank 1) |
| Broche C8 | I/O — User I/O pin (Bank 1) |
| Broche D1 | I/O — User I/O pin (Bank 2) |
| Broche D2 | GND — Ground |
| Broche D3 | I/O — User I/O pin (Bank 2) |
| Broche D4 | VCCINT — Core supply 1.8 V |
| Broche D5 | I/O — User I/O pin (Bank 2) |
| Broche D6 | TMS — JTAG test mode select input |
| Broche D7 | I/O — User I/O pin (Bank 1) |
| Broche D8 | GND — Ground |
| Broche E1 | I/O — User I/O pin (Bank 2) |
| Broche E2 | I/O — User I/O pin (Bank 2) |
| Broche E3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| Broche E4 | I/O — User I/O pin (Bank 2) |
| Broche E5 | I/O — User I/O pin (Bank 2) |
| Broche E6 | TDO — JTAG test data output |
| Broche E7 | I/O — User I/O pin (Bank 1) |
| Broche E8 | I/O — User I/O pin (Bank 1) |
| Broche F1 | I/O — User I/O pin (Bank 2) |
| Broche F2 | GND — Ground |
| Broche F3 | I/O — User I/O pin (Bank 2) |
| Broche F4 | VCCINT — Core supply 1.8 V |
| Broche F5 | I/O — User I/O pin (Bank 2) |
| Broche F6 | TDI — JTAG test data input |
| Broche F7 | I/O — User I/O pin (Bank 1) |
| Broche F8 | GND — Ground |
| Broche G1 | I/O — User I/O pin (Bank 2) |
| Broche G2 | I/O — User I/O pin (Bank 2) |
| Broche G3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| Broche G4 | I/O — User I/O pin (Bank 2) |
| Broche G5 | I/O — User I/O pin (Bank 2) |
| Broche G6 | NC — Not connected (per datasheet) |
| Broche G7 | I/O — User I/O pin (Bank 1) |
| Broche G8 | I/O — User I/O pin (Bank 1) |
| Broche H1 | I/O — User I/O pin (Bank 2) |
| Broche H2 | GND — Ground |
| Broche H3 | I/O — User I/O pin (Bank 2) |
| Broche H4 | VCCINT — Core supply 1.8 V |
| Broche H5 | I/O — User I/O pin (Bank 2) |
| Broche H6 | I/O — User I/O pin (Bank 1) |
| Broche H7 | I/O — User I/O pin (Bank 1) |
| Broche H8 | GND — Ground |
| Broche J1 | I/O — User I/O pin (Bank 2) |
| Broche J2 | I/O — User I/O pin (Bank 2) |
| Broche J3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| Broche J4 | I/O — User I/O pin (Bank 2) |
| Broche J5 | I/O — User I/O pin (Bank 2) |
| Broche J6 | I/O — User I/O pin (Bank 1) |
| Broche J7 | I/O — User I/O pin (Bank 1) |
| Broche J8 | I/O — User I/O pin (Bank 1) |
| Broche K1 | I/O — User I/O pin (Bank 2) |
| Broche K2 | GND — Ground |
| Broche K3 | I/O — User I/O pin (Bank 2) |
| Broche K4 | VCCINT — Core supply 1.8 V |
| Broche K5 | I/O — User I/O pin (Bank 2) |
| Broche K6 | I/O — User I/O pin (Bank 1) |
| Broche K7 | GND — Ground |
| Broche K8 | I/O — User I/O pin (Bank 1) |
| Broche L1 | I/O — User I/O pin (Bank 2) |
| Broche L2 | I/O — User I/O pin (Bank 2) |
| Broche L3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| Broche L4 | I/O — User I/O pin (Bank 2) |
| Broche L5 | I/O — User I/O pin (Bank 2) |
| Broche L6 | I/O — User I/O pin (Bank 1) |
| Broche L7 | I/O — User I/O pin (Bank 1) |
| Broche L8 | I/O — User I/O pin (Bank 1) |
| Broche M1 | I/O — User I/O pin (Bank 3) |
| Broche M2 | GND — Ground |
| Broche M3 | I/O — User I/O pin (Bank 3) |
| Broche M4 | VCCINT — Core supply 1.8 V |
| Broche M5 | I/O — User I/O pin (Bank 3) |
| Broche M6 | I/O — User I/O pin (Bank 1) |
| Broche M7 | GND — Ground |
| Broche M8 | I/O — User I/O pin (Bank 1) |
| Broche N1 | I/O — User I/O pin (Bank 3) |
| Broche N2 | I/O — User I/O pin (Bank 3) |
| Broche N3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| Broche N4 | I/O — User I/O pin (Bank 3) |
| Broche N5 | I/O — User I/O pin (Bank 3) |
| Broche N6 | I/O — User I/O pin (Bank 1) |
| Broche N7 | I/O — User I/O pin (Bank 1) |
| Broche N8 | I/O — User I/O pin (Bank 1) |
| Broche P1 | I/O — User I/O pin (Bank 3) |
| Broche P2 | GND — Ground |
| Broche P3 | I/O — User I/O pin (Bank 3) |
| Broche P4 | VCCINT — Core supply 1.8 V |
| Broche P5 | I/O — User I/O pin (Bank 3) |
| Broche P6 | I/O — User I/O pin (Bank 1) |
| Broche P7 | GND — Ground |
| Broche P8 | I/O — User I/O pin (Bank 1) |
| Broche R1 | I/O — User I/O pin (Bank 3) |
| Broche R2 | I/O — User I/O pin (Bank 3) |
| Broche R3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| Broche R4 | I/O — User I/O pin (Bank 3) |
| Broche R5 | I/O — User I/O pin (Bank 3) |
| Broche R6 | I/O — User I/O pin (Bank 1) |
| Broche R7 | I/O — User I/O pin (Bank 1) |
| Broche R8 | I/O — User I/O pin (Bank 1) |
| Broche T1 | I/O — User I/O pin (Bank 3) |
| Broche T2 | GND — Ground |
| Broche T3 | I/O — User I/O pin (Bank 3) |
| Broche T4 | VCCINT — Core supply 1.8 V |
| Broche T5 | I/O — User I/O pin (Bank 3) |
| Broche T6 | I/O — User I/O pin (Bank 1) |
| Broche T7 | GND — Ground |
| Broche T8 | I/O — User I/O pin (Bank 1) |
| Broche U1 | I/O — User I/O pin (Bank 3) |
| Broche U2 | I/O — User I/O pin (Bank 3) |
| Broche U3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| Broche U4 | I/O — User I/O pin (Bank 3) |
| Broche U5 | I/O — User I/O pin (Bank 3) |
| Broche U6 | I/O — User I/O pin (Bank 4) |
| Broche U7 | I/O — User I/O pin (Bank 4) |
| Broche U8 | I/O — User I/O pin (Bank 4) |
| Broche V1 | I/O — User I/O pin (Bank 3) |
| Broche V2 | GND — Ground |
| Broche V3 | I/O — User I/O pin (Bank 3) |
| Broche V4 | VCCINT — Core supply 1.8 V |
| Broche V5 | I/O — User I/O pin (Bank 3) |
| Broche V6 | I/O — User I/O pin (Bank 4) |
| Broche V7 | GND — Ground |
| Broche V8 | I/O — User I/O pin (Bank 4) |
| Broche W1 | I/O — User I/O pin (Bank 3) |
| Broche W2 | I/O — User I/O pin (Bank 3) |
| Broche W3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| Broche W4 | I/O — User I/O pin (Bank 3) |
| Broche W5 | I/O — User I/O pin (Bank 3) |
| Broche W6 | I/O — User I/O pin (Bank 4) |
| Broche W7 | I/O — User I/O pin (Bank 4) |
| Broche W8 | I/O — User I/O pin (Bank 4) |
| Broche Y1 | I/O — User I/O pin (Bank 3) |
| Broche Y2 | GND — Ground |
| Broche Y3 | I/O — User I/O pin (Bank 3) |
| Broche Y4 | VCCINT — Core supply 1.8 V |
| Broche Y5 | I/O — User I/O pin (Bank 3) |
| Broche Y6 | I/O — User I/O pin (Bank 4) |
| Broche Y7 | GND — Ground |
| Broche Y8 | VCCIO4 — I/O bank 4 supply (1.5/1.8/2.5/3.3 V) |
| Broche AA1 | I/O — User I/O pin (Bank 3) |
| Broche AA2 | I/O — User I/O pin (Bank 3) |
| Broche AA3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| Broche AA4 | I/O — User I/O pin (Bank 3) |
| Broche AA5 | I/O — User I/O pin (Bank 3) |
| Broche AA6 | I/O — User I/O pin (Bank 4) |
| Broche AA7 | I/O — User I/O pin (Bank 4) |
| Broche AA8 | I/O — User I/O pin (Bank 4) |
| Broche AB1 | GND — Ground |
| Broche AB2 | I/O — User I/O pin (Bank 3) |
| Broche AB3 | I/O — User I/O pin (Bank 3) |
| Broche AB4 | VCCINT — Core supply 1.8 V |
| Broche AB5 | I/O — User I/O pin (Bank 3) |
| Broche AB6 | I/O — User I/O pin (Bank 4) |
| Broche AB7 | GND — Ground |
| Broche AB8 | I/O — User I/O pin (Bank 4) |
Applications typiques
5M2210ZF256C4N convient pour 6 applications: Multi-Rail Power Supply Sequencing, Bus Interface Bridging (PCI / Local Bus), Microcontroller I/O Expansion, FPGA Configuration & Control Companion, Industrial Glue Logic & Protocol Conversion, Consumer Set-Top Box & Home Gateway Logic.
Multi-Rail Power Supply Sequencing
The 5M2210ZF256C4N's four independent VCCIO banks, instant-on flash configuration, and 160 user I/O pins make it an ideal power-supply sequencing controller for multi-rail systems. Each of the four VCCIO banks can be powered at 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing direct logic-level interface to enable pins of DC-DC converters and LDOs without external level shifters. The MAX V internal flash eliminates the boot PROM required by older MAX II designs, simplifying the BOM. The 5M2210ZF256C4N's typical tPD of ~4 ns (C4 speed grade) is more than adequate for sequenced enable signals in the millisecond regime, while the 1.8 V VCCINT core minimizes quiescent power. Compared to discrete sequencer ICs, this CPLD adds flexibility to reprogram turn-on/off order via JTAG without PCB rework.
Recommandé
Bus Interface Bridging (PCI / Local Bus)
The 5M2210ZF256C4N provides 160 user I/O and 1700 Logic Elements, sufficient to bridge legacy 32-bit PCI buses to local processor buses in industrial and embedded designs. Its 3.3 V VCCIO bank support directly interfaces 5 V tolerant I/O when the bank is biased below 3.3 V, eliminating external level shifters. The 5M2210ZF256C4N's 4 ns tPD (C4 speed grade) comfortably meets PCI 33 MHz bus timing with adequate margin for address decode and wait-state insertion. The internal flash configuration enables in-field firmware updates via JTAG, useful for fixing bus-timing bugs without board replacement. Compared to discrete glue-logic ICs, this CPLD consolidates 5-10 TTL packages into a single BGA, saving PCB area and BOM cost.
Recommandé
Microcontroller I/O Expansion
The 5M2210ZF256C4N expands I/O capacity for microcontrollers and ASICs that lack sufficient pins, exposing up to 160 user I/O and connecting via SPI, I2C, or parallel sideband interfaces. The 1.8 V VCCINT core plus four VCCIO banks support modern SoCs running at 1.8 V while driving 3.3 V peripherals in the same design. The 5M2210ZF256C4N's flash-based instant-on (<1 ms) configuration avoids the boot latency of SRAM-based FPGA expansion solutions. With 1700 LEs, it can implement shift registers, PWM generators, encoder/decoders, and custom serial protocols in addition to raw I/O expansion. The FBGA-256 package suits space-constrained designs where 160 I/O are needed in a small footprint.
Recommandé
FPGA Configuration & Control Companion
The 5M2210ZF256C4N serves as a low-cost configuration and control companion to higher-density SRAM-based FPGAs such as Altera Cyclone V or Xilinx Artix-7 in the same system. Its flash-based instant-on operation (<1 ms) can hold the main FPGA in reset, generate proper power-good signals, and sequence supply rails before releasing the FPGA reset pin. The 160 user I/O of the 5M2210ZF256C4N provide ample bandwidth for SPI/parallel configuration loading, status monitoring, and sideband control signals. Compared to a discrete CPLD+FPGA architecture with separate boot PROMs, the MAX V flash integrates the configuration memory on-die, reducing BOM and board area.
Recommandé
Industrial Glue Logic & Protocol Conversion
The 5M2210ZF256C4N consolidates 5-10 discrete 74-series TTL/CMOS glue-logic packages into a single FBGA-256 device, simplifying PCB layout in industrial controllers, motor drives, and PLCs. With 1700 LEs, it can implement UART, SPI, I2C, parallel-to-serial conversion, encoder interfaces, and watchdog timers in a single chip. The commercial 0C to 85C operating range suits most indoor industrial enclosures, while the 5M2210ZF256I5N variant extends to industrial -40C to 100C for outdoor/harsh environments. The 4 VCCIO banks enable direct interface to 1.8 V SoCs, 2.5 V DSPs, 3.3 V sensors, and 5 V tolerant legacy signals within the same design.
Recommandé
Consumer Set-Top Box & Home Gateway Logic
The 5M2210ZF256C4N delivers cost-optimized glue logic, I/O expansion, and LED-driving capability for consumer set-top boxes, home gateways, and smart-home hubs. Its 160 user I/O drive front-panel buttons, LED status indicators, IR receivers, and HDMI CEC sideband signals without external mux ICs. The flash-based instant-on (<1 ms) configuration avoids visible boot delays for always-on consumer devices. Compared to MCUs in similar roles, the 5M2210ZF256C4N offers deterministic pin-to-pin logic with no firmware interrupt latency, ideal for real-time LED multiplexing and IR decoding. The FBGA-256 footprint suits compact consumer electronics form factors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M2210ZF256C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M2210ZF256C5N | 5M2210ZF256I5N | EPM570GF256C4N | 5CEFA7F27C6N |
|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 1700 LEs | 1700 LEs (same) | 1700 LEs (same) | 570 LEs (-66%) | 77000 LEs (FPGA, not CPLD) |
| Device Family | MAX V CPLD | MAX V CPLD (same) | MAX V CPLD (same) | MAX II CPLD (older) | Cyclone V FPGA (not CPLD) |
| Speed Grade | C4 (~4 ns tPD) | C5 (faster, ~3 ns) | I5 (faster, industrial) | C4 (same) | C6 (FPGA speed grade) |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) |
| User I/O Pins | 160 | 160 (same) | 160 (same) | 160 (same) | 144 (different pin map) |
| Core Voltage | 1.8 V | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.1 V (different) |
| Configuration | Internal flash (instant-on) | Internal flash (same) | Internal flash (same) | Internal flash (same) | SRAM (external flash needed) |
Principaux différenciateurs
- Internal flash configuration - no boot PROM needed (vs 5CEFA7F27C6N (Cyclone V FPGA))
- 1700 LEs vs 570 LEs for higher logic density in same footprint (vs EPM570GF256C4N (MAX II))
- Deterministic pin-to-pin logic with no firmware overhead (vs 5CEFA7F27C6N (Cyclone V FPGA))
Notes de conception
Estimated: at typical 1.8 V VCCINT plus four 3.3 V VCCIO banks each supplying ~20 mA of I/O current, the 5M2210ZF256C4N consumes approximately 50-150 mA quiescent current (depending on logic utilization). Per the Intel MAX V family datasheet, decouple each VCCINT ball with a 0.1 uF ceramic capacitor placed within 5 mm of the ball, and add one bulk 10 uF tantalum or ceramic capacitor per VCCIO bank. Sequence VCCINT before VCCIO to prevent I/O latch-up during power-up.
The FBGA-256 package has a 17x17 ball grid at 1.0 mm pitch and requires 4-6 layer PCB with microvia stackups (any-layer HDI preferred for breakout). Per the Intel MAX V hardware design guide, route all VCCINT and VCCIO traces with at least 0.2 mm width, use a continuous ground plane on layer 2 directly beneath the BGA, and provide at least 4 ground balls per VCCIO bank to minimize ground bounce. BGA assembly requires X-ray inspection; do not attempt hand-rework.
Avoid leaving unused user I/O pins floating - per the Intel MAX V datasheet, configure them as outputs driving a defined logic level or as outputs driving low to minimize in-rush current during power-up. Do not exceed the maximum VCCIO-to-VCCINT voltage differential of 2.5 V during hot-plug events. Always program the JTAG IDCODE register before relying on JTAG chain integrity checks.
Informations de conformité
RoHS compliant per Intel/Altera product page; 'N' suffix indicates Pb-free ball finish. Not AEC-Q100 qualified - for automotive applications consult Intel automotive-grade CPLD variants. Halogen-free status not explicitly stated in product page.
