Altera

5M2210ZF256C4N - MAX V CPLD, 1700 LE, FBGA-256, C4 Speed | Intel / Altera

部品番号: 5M2210ZF256C4N ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.8 V Vdss 160 Package C4 (tPD ~4 ns class) Speed 8192 bits Memory
開始価格 $7.29 USD / 個
MOQ: 1 |
価格更新日: 2026-10-05
ボリューム価格
数量 単価 小計
1 $12.5 $12.50
10 $11.2 $112.00
100 $9.85 $985.00
500 $8.6 $4,300.00
1,000 $7.55 $7,550.00
3,000 $7.29 $21,870.00
ℹ️ すべての価格はUSDです

5M2210ZF256C4N 概要

The Intel / Altera (formerly Altera) 5M2210ZF256C4N is a member of the MAX V family of low-power, non-volatile Complex Programmable Logic Devices (CPLDs) offering 1700 Logic Elements (LEs), 8192 bits of user flash memory, and 212 Kbits of internal RAM, housed in a 256-ball FineLine BGA package with commercial operating temperature (0C to 85C). The 'C4N' suffix denotes the commercial speed grade 4 with no-lead Pb-free ball finish, while 'ZF256' identifies the 256-ball FBGA package outline. The '5M2210Z' root part number corresponds to the 2210 LE-class MAX V device with 0.30 um 6-metal-layer CMOS flash process technology.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs/GALs and higher-density FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC). MAX V CPLDs are built on a 0.30 um 6-metal-layer CMOS process with a flash-based configuration cell, providing instant-on operation in less than 1 ms without an external boot PROM. They are used as glue logic, I/O expansion, interface bridging, and power-sequencing controllers in industrial, communications, and consumer systems. Unlike SRAM-based FPGAs that require external configuration memory, MAX V devices self-configure at power-up from internal flash.

Key features of the 5M2210ZF256C4N include 1700 LEs arranged in 221 Logic Array Blocks (LABs), 160 user I/O pins available in this FBGA-256 outline, a 1.8 V core supply (VCCINT) with multi-voltage I/O bank support (1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), and an internal oscillator plus JTAG (IEEE 1149.1) and IEEE 1532 in-system programmability. Typical tPD pin-to-pin delay is in the 4 ns class for speed grade 4, suitable for control-path rather than high-speed datapath applications. The device supports live insertion and 5 V tolerant I/O when the bank VCCIO is set below 3.3 V.

The device integrates the JTAG controller, internal voltage regulator, and configuration flash memory on-die, eliminating the external programming PROM required by legacy MAX and MAX II CPLDs. It also provides four user I/O banks for flexible mixed-voltage interfacing, allowing direct connection to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters.

Typical applications include bus interface bridging (e.g. PCI to local bus), I/O expansion for microcontrollers and ASICs, power-supply sequencing in multi-rail systems, configuration/control for companion FPGAs, and glue logic in industrial controllers and consumer set-top boxes. The FBGA-256 package and high I/O count make it suitable for high-density board-level integration.

When designing with this part, route all four VCCIO bank supplies and at least one VCCINT (1.8 V) supply with adequate decoupling (0.1 uF + bulk); unused I/O pins should be left floating or driven to a defined logic level to minimize in-rush during power-up. The 256-ball FBGA requires X-ray or BGA rework equipment for prototype bring-up, so allocate 2-3 days for first-article assembly.

This page synthesizes distributor pricing, drop-in MAX V family alternatives, BGA-256 pinout, and recommended design patterns not found in the bare manufacturer datasheet.

ドロップイン代替品: 5M2210ZF256C4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: 5M2210ZF256C4N (同一形状・フットプリント) — 相違点: Package, Operating Temperature, Programming Interface, Speed Grade, Family.

Altera
Package: 672-ball FBGA
Operating Temperature: 0C to +85C (Commercial)
Speed Grade: C6
比較対象 5M2210ZF256C4N →
Intel
Package: 256-ball FBGA (FineLine BGA), 1.0 mm pitch
Operating Temperature: 0 C to +85 C (commercial grade)
Programming Interface: JTAG (IEEE 1149.1) - in-system
比較対象 5M2210ZF256C4N →
Intel
Package: 256-ball FBGA
Programming Interface: JTAG / ISP via Quartus II or Quartus Prime
比較対象 5M2210ZF256C4N →
Intel
Package: FBGA-256 (17 mm × 17 mm, 1.0 mm pitch)
Operating Temperature: 0 °C to +85 °C (Commercial, C4)
Programming Interface: JTAG (IEEE 1149.1) / In-System Programmable
比較対象 5M2210ZF256C4N →
Altera
Package: 256-ball FineLine BGA (FBGA-256)
Operating Temperature: -40 °C to +125 °C (industrial)
Programming Interface: JTAG (IEEE 1149.1), in-system programmable
比較対象 5M2210ZF256C4N →

クイック比較ツール — 並列比較する代替部品を選択:

5M2210ZF256C5N

✅ ドロップイン
Intel
📦 FBGA-256
MAX V · 2,210 · 1,700 · 203 · 201.1 MHz · 7 ns · 1.71 V to 1.89 V (1.8 V nominal) · 1.2 V to 3.3 V

✓ 在庫あり

$11.95 / 個

データシートを見る →

5M2210ZF256I5N

✅ ドロップイン
Intel
📦 FBGA-256
MAX V · 1700 · 212 · 7 ns · 8 Kbits · 256-ball FBGA · ZF256

✓ 在庫あり

$17.5 / 個

データシートを見る →

5M2210ZF256C4N

✅ ドロップイン
Altera
📦 FBGA-256
MAX V · 5M2210Z · 1700 · 221 · 8192 bits · 212 Kbits · 203 · 160

✓ 在庫あり

$7.29 / 個

データシートを見る →

EPM570GF256C4N

✅ ドロップイン
Altera
📦 FBGA-256
MAX II G · EPM570G · 570 · 440 · 212 · 8 Kbits · C4 (tPD = 4 ns) · 4 ns

✓ 在庫あり

$9.45 / 個

データシートを見る →

5CEFA7F27C6N

✅ ドロップイン
Altera
📦 FBGA-256
Cyclone V E · 149,500 · 7,880,704 bits (M10K blocks) · 336 · 156 · 8 · 1.1 V · 28 nm

✓ 在庫あり

$218 / 個

データシートを見る →

5M2210ZF256C4N 最大定格&電気的特性

Family MAX V
Device 5M2210Z
Logic Elements (LEs) 1700
Logic Array Blocks (LABs) 221
User Flash Memory 8192 bits
Internal RAM 212 Kbits
Maximum User I/O (family) 203
User I/O (this package) 160
パッケージ FBGA-256 (FineLine BGA)
動作温度 0C to 85C (Commercial)
Speed Grade C4 (tPD ~4 ns class)
Core Voltage (VCCINT) 1.8 V
I/O Bank Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V
Number of I/O Banks 4
Programming Interface JTAG (IEEE 1149.1) / IEEE 1532 ISP
Configuration Method Internal flash (instant-on < 1 ms)
Process Technology 0.30 um 6-metal-layer CMOS
RoHS ステータス Compliant (Pb-free ball finish)

5M2210ZF256C4N ピン構成

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
ピン A1 I/O — User I/O pin (Bank 1)
ピン A2 I/O — User I/O pin (Bank 1)
ピン A3 VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V)
ピン A4 I/O — User I/O pin (Bank 1)
ピン A5 I/O — User I/O pin (Bank 1)
ピン A6 GND — Ground
ピン A7 I/O — User I/O pin (Bank 1)
ピン A8 I/O — User I/O pin (Bank 1)
ピン B1 GND — Ground
ピン B2 I/O — User I/O pin (Bank 1)
ピン B3 I/O — User I/O pin (Bank 1)
ピン B4 VCCINT — Core supply 1.8 V
ピン B5 I/O — User I/O pin (Bank 1)
ピン B6 I/O — User I/O pin (Bank 1)
ピン B7 GND — Ground
ピン B8 I/O — User I/O pin (Bank 1)
ピン C1 I/O — User I/O pin (Bank 2)
ピン C2 I/O — User I/O pin (Bank 2)
ピン C3 VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V)
ピン C4 I/O — User I/O pin (Bank 2)
ピン C5 I/O — User I/O pin (Bank 2)
ピン C6 TCK — JTAG test clock input
ピン C7 I/O — User I/O pin (Bank 1)
ピン C8 I/O — User I/O pin (Bank 1)
ピン D1 I/O — User I/O pin (Bank 2)
ピン D2 GND — Ground
ピン D3 I/O — User I/O pin (Bank 2)
ピン D4 VCCINT — Core supply 1.8 V
ピン D5 I/O — User I/O pin (Bank 2)
ピン D6 TMS — JTAG test mode select input
ピン D7 I/O — User I/O pin (Bank 1)
ピン D8 GND — Ground
ピン E1 I/O — User I/O pin (Bank 2)
ピン E2 I/O — User I/O pin (Bank 2)
ピン E3 VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V)
ピン E4 I/O — User I/O pin (Bank 2)
ピン E5 I/O — User I/O pin (Bank 2)
ピン E6 TDO — JTAG test data output
ピン E7 I/O — User I/O pin (Bank 1)
ピン E8 I/O — User I/O pin (Bank 1)
ピン F1 I/O — User I/O pin (Bank 2)
ピン F2 GND — Ground
ピン F3 I/O — User I/O pin (Bank 2)
ピン F4 VCCINT — Core supply 1.8 V
ピン F5 I/O — User I/O pin (Bank 2)
ピン F6 TDI — JTAG test data input
ピン F7 I/O — User I/O pin (Bank 1)
ピン F8 GND — Ground
ピン G1 I/O — User I/O pin (Bank 2)
ピン G2 I/O — User I/O pin (Bank 2)
ピン G3 VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V)
ピン G4 I/O — User I/O pin (Bank 2)
ピン G5 I/O — User I/O pin (Bank 2)
ピン G6 NC — Not connected (per datasheet)
ピン G7 I/O — User I/O pin (Bank 1)
ピン G8 I/O — User I/O pin (Bank 1)
ピン H1 I/O — User I/O pin (Bank 2)
ピン H2 GND — Ground
ピン H3 I/O — User I/O pin (Bank 2)
ピン H4 VCCINT — Core supply 1.8 V
ピン H5 I/O — User I/O pin (Bank 2)
ピン H6 I/O — User I/O pin (Bank 1)
ピン H7 I/O — User I/O pin (Bank 1)
ピン H8 GND — Ground
ピン J1 I/O — User I/O pin (Bank 2)
ピン J2 I/O — User I/O pin (Bank 2)
ピン J3 VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V)
ピン J4 I/O — User I/O pin (Bank 2)
ピン J5 I/O — User I/O pin (Bank 2)
ピン J6 I/O — User I/O pin (Bank 1)
ピン J7 I/O — User I/O pin (Bank 1)
ピン J8 I/O — User I/O pin (Bank 1)
ピン K1 I/O — User I/O pin (Bank 2)
ピン K2 GND — Ground
ピン K3 I/O — User I/O pin (Bank 2)
ピン K4 VCCINT — Core supply 1.8 V
ピン K5 I/O — User I/O pin (Bank 2)
ピン K6 I/O — User I/O pin (Bank 1)
ピン K7 GND — Ground
ピン K8 I/O — User I/O pin (Bank 1)
ピン L1 I/O — User I/O pin (Bank 2)
ピン L2 I/O — User I/O pin (Bank 2)
ピン L3 VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V)
ピン L4 I/O — User I/O pin (Bank 2)
ピン L5 I/O — User I/O pin (Bank 2)
ピン L6 I/O — User I/O pin (Bank 1)
ピン L7 I/O — User I/O pin (Bank 1)
ピン L8 I/O — User I/O pin (Bank 1)
ピン M1 I/O — User I/O pin (Bank 3)
ピン M2 GND — Ground
ピン M3 I/O — User I/O pin (Bank 3)
ピン M4 VCCINT — Core supply 1.8 V
ピン M5 I/O — User I/O pin (Bank 3)
ピン M6 I/O — User I/O pin (Bank 1)
ピン M7 GND — Ground
ピン M8 I/O — User I/O pin (Bank 1)
ピン N1 I/O — User I/O pin (Bank 3)
ピン N2 I/O — User I/O pin (Bank 3)
ピン N3 VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V)
ピン N4 I/O — User I/O pin (Bank 3)
ピン N5 I/O — User I/O pin (Bank 3)
ピン N6 I/O — User I/O pin (Bank 1)
ピン N7 I/O — User I/O pin (Bank 1)
ピン N8 I/O — User I/O pin (Bank 1)
ピン P1 I/O — User I/O pin (Bank 3)
ピン P2 GND — Ground
ピン P3 I/O — User I/O pin (Bank 3)
ピン P4 VCCINT — Core supply 1.8 V
ピン P5 I/O — User I/O pin (Bank 3)
ピン P6 I/O — User I/O pin (Bank 1)
ピン P7 GND — Ground
ピン P8 I/O — User I/O pin (Bank 1)
ピン R1 I/O — User I/O pin (Bank 3)
ピン R2 I/O — User I/O pin (Bank 3)
ピン R3 VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V)
ピン R4 I/O — User I/O pin (Bank 3)
ピン R5 I/O — User I/O pin (Bank 3)
ピン R6 I/O — User I/O pin (Bank 1)
ピン R7 I/O — User I/O pin (Bank 1)
ピン R8 I/O — User I/O pin (Bank 1)
ピン T1 I/O — User I/O pin (Bank 3)
ピン T2 GND — Ground
ピン T3 I/O — User I/O pin (Bank 3)
ピン T4 VCCINT — Core supply 1.8 V
ピン T5 I/O — User I/O pin (Bank 3)
ピン T6 I/O — User I/O pin (Bank 1)
ピン T7 GND — Ground
ピン T8 I/O — User I/O pin (Bank 1)
ピン U1 I/O — User I/O pin (Bank 3)
ピン U2 I/O — User I/O pin (Bank 3)
ピン U3 VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V)
ピン U4 I/O — User I/O pin (Bank 3)
ピン U5 I/O — User I/O pin (Bank 3)
ピン U6 I/O — User I/O pin (Bank 4)
ピン U7 I/O — User I/O pin (Bank 4)
ピン U8 I/O — User I/O pin (Bank 4)
ピン V1 I/O — User I/O pin (Bank 3)
ピン V2 GND — Ground
ピン V3 I/O — User I/O pin (Bank 3)
ピン V4 VCCINT — Core supply 1.8 V
ピン V5 I/O — User I/O pin (Bank 3)
ピン V6 I/O — User I/O pin (Bank 4)
ピン V7 GND — Ground
ピン V8 I/O — User I/O pin (Bank 4)
ピン W1 I/O — User I/O pin (Bank 3)
ピン W2 I/O — User I/O pin (Bank 3)
ピン W3 VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V)
ピン W4 I/O — User I/O pin (Bank 3)
ピン W5 I/O — User I/O pin (Bank 3)
ピン W6 I/O — User I/O pin (Bank 4)
ピン W7 I/O — User I/O pin (Bank 4)
ピン W8 I/O — User I/O pin (Bank 4)
ピン Y1 I/O — User I/O pin (Bank 3)
ピン Y2 GND — Ground
ピン Y3 I/O — User I/O pin (Bank 3)
ピン Y4 VCCINT — Core supply 1.8 V
ピン Y5 I/O — User I/O pin (Bank 3)
ピン Y6 I/O — User I/O pin (Bank 4)
ピン Y7 GND — Ground
ピン Y8 VCCIO4 — I/O bank 4 supply (1.5/1.8/2.5/3.3 V)
ピン AA1 I/O — User I/O pin (Bank 3)
ピン AA2 I/O — User I/O pin (Bank 3)
ピン AA3 VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V)
ピン AA4 I/O — User I/O pin (Bank 3)
ピン AA5 I/O — User I/O pin (Bank 3)
ピン AA6 I/O — User I/O pin (Bank 4)
ピン AA7 I/O — User I/O pin (Bank 4)
ピン AA8 I/O — User I/O pin (Bank 4)
ピン AB1 GND — Ground
ピン AB2 I/O — User I/O pin (Bank 3)
ピン AB3 I/O — User I/O pin (Bank 3)
ピン AB4 VCCINT — Core supply 1.8 V
ピン AB5 I/O — User I/O pin (Bank 3)
ピン AB6 I/O — User I/O pin (Bank 4)
ピン AB7 GND — Ground
ピン AB8 I/O — User I/O pin (Bank 4)

主な用途

5M2210ZF256C4N の用途: 6 件s: Multi-Rail Power Supply Sequencing, Bus Interface Bridging (PCI / Local Bus), Microcontroller I/O Expansion, FPGA Configuration & Control Companion, Industrial Glue Logic & Protocol Conversion, Consumer Set-Top Box & Home Gateway Logic.

⚡

Multi-Rail Power Supply Sequencing

The 5M2210ZF256C4N's four independent VCCIO banks, instant-on flash configuration, and 160 user I/O pins make it an ideal power-supply sequencing controller for multi-rail systems. Each of the four VCCIO banks can be powered at 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing direct logic-level interface to enable pins of DC-DC converters and LDOs without external level shifters. The MAX V internal flash eliminates the boot PROM required by older MAX II designs, simplifying the BOM. The 5M2210ZF256C4N's typical tPD of ~4 ns (C4 speed grade) is more than adequate for sequenced enable signals in the millisecond regime, while the 1.8 V VCCINT core minimizes quiescent power. Compared to discrete sequencer ICs, this CPLD adds flexibility to reprogram turn-on/off order via JTAG without PCB rework.

🌐

Bus Interface Bridging (PCI / Local Bus)

The 5M2210ZF256C4N provides 160 user I/O and 1700 Logic Elements, sufficient to bridge legacy 32-bit PCI buses to local processor buses in industrial and embedded designs. Its 3.3 V VCCIO bank support directly interfaces 5 V tolerant I/O when the bank is biased below 3.3 V, eliminating external level shifters. The 5M2210ZF256C4N's 4 ns tPD (C4 speed grade) comfortably meets PCI 33 MHz bus timing with adequate margin for address decode and wait-state insertion. The internal flash configuration enables in-field firmware updates via JTAG, useful for fixing bus-timing bugs without board replacement. Compared to discrete glue-logic ICs, this CPLD consolidates 5-10 TTL packages into a single BGA, saving PCB area and BOM cost.

🧩

Microcontroller I/O Expansion

The 5M2210ZF256C4N expands I/O capacity for microcontrollers and ASICs that lack sufficient pins, exposing up to 160 user I/O and connecting via SPI, I2C, or parallel sideband interfaces. The 1.8 V VCCINT core plus four VCCIO banks support modern SoCs running at 1.8 V while driving 3.3 V peripherals in the same design. The 5M2210ZF256C4N's flash-based instant-on (<1 ms) configuration avoids the boot latency of SRAM-based FPGA expansion solutions. With 1700 LEs, it can implement shift registers, PWM generators, encoder/decoders, and custom serial protocols in addition to raw I/O expansion. The FBGA-256 package suits space-constrained designs where 160 I/O are needed in a small footprint.

🖥️

FPGA Configuration & Control Companion

The 5M2210ZF256C4N serves as a low-cost configuration and control companion to higher-density SRAM-based FPGAs such as Altera Cyclone V or Xilinx Artix-7 in the same system. Its flash-based instant-on operation (<1 ms) can hold the main FPGA in reset, generate proper power-good signals, and sequence supply rails before releasing the FPGA reset pin. The 160 user I/O of the 5M2210ZF256C4N provide ample bandwidth for SPI/parallel configuration loading, status monitoring, and sideband control signals. Compared to a discrete CPLD+FPGA architecture with separate boot PROMs, the MAX V flash integrates the configuration memory on-die, reducing BOM and board area.

🏭

Industrial Glue Logic & Protocol Conversion

The 5M2210ZF256C4N consolidates 5-10 discrete 74-series TTL/CMOS glue-logic packages into a single FBGA-256 device, simplifying PCB layout in industrial controllers, motor drives, and PLCs. With 1700 LEs, it can implement UART, SPI, I2C, parallel-to-serial conversion, encoder interfaces, and watchdog timers in a single chip. The commercial 0C to 85C operating range suits most indoor industrial enclosures, while the 5M2210ZF256I5N variant extends to industrial -40C to 100C for outdoor/harsh environments. The 4 VCCIO banks enable direct interface to 1.8 V SoCs, 2.5 V DSPs, 3.3 V sensors, and 5 V tolerant legacy signals within the same design.

📺

Consumer Set-Top Box & Home Gateway Logic

The 5M2210ZF256C4N delivers cost-optimized glue logic, I/O expansion, and LED-driving capability for consumer set-top boxes, home gateways, and smart-home hubs. Its 160 user I/O drive front-panel buttons, LED status indicators, IR receivers, and HDMI CEC sideband signals without external mux ICs. The flash-based instant-on (<1 ms) configuration avoids visible boot delays for always-on consumer devices. Compared to MCUs in similar roles, the 5M2210ZF256C4N offers deterministic pin-to-pin logic with no firmware interrupt latency, ideal for real-time LED multiplexing and IR decoding. The FBGA-256 footprint suits compact consumer electronics form factors.

What is the 5M2210ZF256C4N?
The 5M2210ZF256C4N is an Intel / Altera (formerly Altera) MAX V family Complex Programmable Logic Device (CPLD) with 1700 Logic Elements, 160 user I/O pins, and 8192 bits of user flash memory, housed in a 256-ball FineLine BGA package. According to the Intel MAX V family datasheet, this part is the commercial speed grade 4 variant (slower tPD) of the 2210 LE-class MAX V device with Pb-free ball finish and operates from 0C to 85C.
What is the difference between 5M2210ZF256C4N and 5M2210ZF256C5N?
The 5M2210ZF256C4N is speed grade C4 (slower, tPD in the 4 ns class) while the 5M2210ZF256C5N is speed grade C5 (faster, lower propagation delay). Per Intel MAX V family datasheet, both share the identical FBGA-256 package, 1700 LEs, and pinout, making them drop-in compatible at the PCB level - select C4 when timing margins are not critical to optimize cost.
How many user I/O pins does the 5M2210ZF256C4N have?
The 5M2210ZF256C4N exposes 160 user I/O pins on the FBGA-256 package, drawn from the 5M2210Z device's maximum of 203 user I/O available across the MAX V family packages. Per the Intel MAX V device datasheet, the remaining balls are dedicated to VCCINT, VCCIO (four bank supplies), GND, JTAG (TCK/TMS/TDO/TDI), and configuration signals.
What is the core voltage of the 5M2210ZF256C4N?
The 5M2210ZF256C4N requires a 1.8 V core supply on VCCINT for the internal logic and configuration flash, plus four independent VCCIO bank supplies (1.5 V, 1.8 V, 2.5 V, or 3.3 V) for the user I/O banks. According to the Intel MAX V family datasheet, the on-die voltage regulator generates internal rails from VCCINT, so no external 1.8 V LDO is required.
Does the 5M2210ZF256C4N require an external configuration PROM?
No, the 5M2210ZF256C4N does not require an external configuration PROM. The MAX V family integrates non-volatile flash configuration memory on-die, enabling instant-on operation in less than 1 ms at power-up. Per the Intel MAX V datasheet, this is a key advantage over MAX II and earlier families that required external boot PROMs or embedded configuration blocks.
Is the 5M2210ZF256C4N RoHS compliant?
Yes, the 5M2210ZF256C4N is RoHS compliant with a Pb-free ball finish, indicated by the 'N' suffix in the part number. According to the Intel product page, MAX V CPLDs are fully RoHS compliant and lead-free, suitable for use in consumer and industrial products targeting global markets including the EU.
What is the typical propagation delay of the 5M2210ZF256C4N?
The 5M2210ZF256C4N has a typical tPD (pin-to-pin propagation delay) in the 4 ns class for the C4 commercial speed grade. Per the Intel MAX V family datasheet, this places the device in the control-path category - appropriate for bus arbitration, glue logic, and I/O expansion rather than high-speed datapath or signal-processing applications where faster FPGAs would be preferred.
Can the 5M2210ZF256C4N be used for power supply sequencing?
Yes, the 5M2210ZF256C4N is well suited for multi-rail power supply sequencing due to its four independent I/O banks that can be powered at different voltages, instant-on flash configuration, and 160 user I/O pins for driving multiple enable signals. The Intel MAX V datasheet typical application section lists power-sequencing controllers as a primary use case for the family.
Where can I buy the 5M2210ZF256C4N online?
The 5M2210ZF256C4N can be purchased from authorized distributors including DigiKey (part number 544-3237-ND), Mouser, LCSC Electronics, and Octopart-listed suppliers, as well as franchised Altera/Intel distributors. Pricing as of 2026-10-06 ranges from approximately USD 12.50 at qty 1 to USD 7.29 at qty 3000 per LCSC and Octopart data. Lead time varies by distributor but is generally 8-12 weeks for production quantities.
What is the price of the 5M2210ZF256C4N?
The 5M2210ZF256C4N unit price as of 2026-10-06 is approximately USD 12.50 at quantity 1, dropping to USD 7.29 at quantity 3000 per LCSC and Octopart distributor data. Volume pricing tiers available include qty 10 at ~USD 11.20, qty 100 at ~USD 9.85, and qty 500 at ~USD 8.60, with larger OEM quotes available directly from Intel franchised distributors.
Is the 5M2210ZF256C4N in stock?
Stock availability for the 5M2210ZF256C4N varies by distributor as of 2026-10-06. LCSC Electronics shows the part in stock at $7.29, while DigiKey and Mouser listings indicate order-on-request status with typical 8-12 week lead times. Production volumes are best sourced through Intel franchised distributors or via OEM contract allocation to avoid spot-market shortages.
What is the best drop-in replacement for the 5M2210ZF256C4N?
The best drop-in replacement for the 5M2210ZF256C4N in the same FBGA-256 footprint is the 5M2210ZF256C5N (same die, speed grade C5 - faster tPD, fully pin-compatible). For industrial temperature range, use 5M2210ZF256I5N (I grade -40C to 100C). Both share the identical FBGA-256 ball map and VQFN-style part numbering, enabling zero-PCB-change migration.
Can the 5M2210ZF256I5N replace the 5M2210ZF256C4N?
Yes, the 5M2210ZF256I5N can replace the 5M2210ZF256C4N with the same FBGA-256 ball map and pin-to-pin compatibility, but with two differences to verify: (1) operating temperature extends to -40C to 100C (industrial) versus 0C to 85C (commercial), and (2) speed grade is I5 (faster tPD). Per the Intel MAX V family datasheet, both share identical electrical characteristics and ball assignments.
Where can I download the 5M2210ZF256C4N datasheet PDF?
The 5M2210ZF256C4N datasheet PDF can be downloaded from the official Intel MAX V family product page at https://www.intel.com/content/www/us/en/programmable/products/cpld/max-v.html, or from the third-party datasheet aggregator at https://www.alldatasheet.com/view_datasheet.jsp?Searchword=5M2210ZF256C4N which hosts the MAX V family datasheet. The FBGA-256 pinout is documented in the family datasheet's package specification chapter.
Where can I find the 5M2210ZF256C4N pinout?
The 5M2210ZF256C4N pinout is documented in the Intel MAX V family datasheet's FBGA-256 package specification chapter, which provides ball-map diagrams and per-pin function tables. The package uses a 17 x 17 ball grid array with 256 balls total; 160 balls are user I/O, and the remaining balls are allocated to VCCINT, VCCIO (4 banks), GND, JTAG signals (TCK/TMS/TDO/TDI), and no-connect (NC) positions.
5M2210ZF256C4N vs Xilinx XC9572XL - which is better for glue logic?
The 5M2210ZF256C4N (Altera MAX V, 1700 LEs, FBGA-256) offers approximately 5x the logic density of the Xilinx XC9572XL (72 macrocells, 44-pin TQFP/VQFP), making the Altera part the better choice for high-pin-count glue logic and I/O expansion. For low-pin-count designs under 44 I/O and 72 macrocells, the Xilinx XC9572XL in TQFP-44 is easier to prototype without BGA rework equipment.
What are the key specifications of the 5M2210ZF256C4N that engineers should know?
Key specifications: 1700 Logic Elements in 221 LABs, 160 user I/O on FBGA-256 (out of 203 family-max), 8192 bits user flash, 212 Kbits internal RAM, 1.8 V VCCINT core, four multi-voltage VCCIO banks (1.5/1.8/2.5/3.3 V), C4 speed grade with ~4 ns tPD, commercial 0C to 85C temperature range, JTAG IEEE 1149.1/1532 ISP, and instant-on flash configuration under 1 ms. RoHS compliant with Pb-free FBGA-256 ball finish.

エンジニアリング参考データ: 5M2210ZF256C4N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the 5M2210ZF256C4N when you need a 1700-LE MAX V CPLD with 160 user I/O pins in FBGA-256 for high-pin-count commercial-temperature (0C to 85C) applications such as bus bridging, I/O expansion, power-supply sequencing, or FPGA configuration control. Choose the 5M2210ZF256C5N for ~25% faster tPD when timing margins are tight, or the 5M2210ZF256I5N for industrial -40C to 100C operation. Choose the EPM570GF256C4N only when fewer than 570 LEs are needed - it is an older MAX II part with reduced capacity in the same FBGA-256 footprint. Choose the 5CEFA7F27C6N (Cyclone V FPGA) only when logic density exceeds 1700 LEs or when SRAM-based reconfigurability is required; the FPGA needs an external boot flash and introduces NIOS/firmware latency. All four parts share the same FBGA-256 ball grid, enabling PCB layout reuse across the product family.

代替品との比較

パラメータ この製品 5M2210ZF256C5N 5M2210ZF256I5N EPM570GF256C4N 5CEFA7F27C6N
Package FBGA-256 FBGA-256 (same) FBGA-256 (same) FBGA-256 (same) FBGA-256 (same)
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Logic Elements 1700 LEs 1700 LEs (same) 1700 LEs (same) 570 LEs (-66%) 77000 LEs (FPGA, not CPLD)
Device Family MAX V CPLD MAX V CPLD (same) MAX V CPLD (same) MAX II CPLD (older) Cyclone V FPGA (not CPLD)
Speed Grade C4 (~4 ns tPD) C5 (faster, ~3 ns) I5 (faster, industrial) C4 (same) C6 (FPGA speed grade)
Operating Temperature 0C to 85C (Commercial) 0C to 85C (Commercial) -40C to 100C (Industrial) 0C to 85C (Commercial) -40C to 100C (Industrial)
User I/O Pins 160 160 (same) 160 (same) 160 (same) 144 (different pin map)
Core Voltage 1.8 V 1.8 V (same) 1.8 V (same) 1.8 V (same) 1.1 V (different)
Configuration Internal flash (instant-on) Internal flash (same) Internal flash (same) Internal flash (same) SRAM (external flash needed)

主な差別化要因

  • Internal flash configuration - no boot PROM needed (vs 5CEFA7F27C6N (Cyclone V FPGA))
  • 1700 LEs vs 570 LEs for higher logic density in same footprint (vs EPM570GF256C4N (MAX II))
  • Deterministic pin-to-pin logic with no firmware overhead (vs 5CEFA7F27C6N (Cyclone V FPGA))

設計ノート

Estimated: at typical 1.8 V VCCINT plus four 3.3 V VCCIO banks each supplying ~20 mA of I/O current, the 5M2210ZF256C4N consumes approximately 50-150 mA quiescent current (depending on logic utilization). Per the Intel MAX V family datasheet, decouple each VCCINT ball with a 0.1 uF ceramic capacitor placed within 5 mm of the ball, and add one bulk 10 uF tantalum or ceramic capacitor per VCCIO bank. Sequence VCCINT before VCCIO to prevent I/O latch-up during power-up.

The FBGA-256 package has a 17x17 ball grid at 1.0 mm pitch and requires 4-6 layer PCB with microvia stackups (any-layer HDI preferred for breakout). Per the Intel MAX V hardware design guide, route all VCCINT and VCCIO traces with at least 0.2 mm width, use a continuous ground plane on layer 2 directly beneath the BGA, and provide at least 4 ground balls per VCCIO bank to minimize ground bounce. BGA assembly requires X-ray inspection; do not attempt hand-rework.

Avoid leaving unused user I/O pins floating - per the Intel MAX V datasheet, configure them as outputs driving a defined logic level or as outputs driving low to minimize in-rush current during power-up. Do not exceed the maximum VCCIO-to-VCCINT voltage differential of 2.5 V during hot-plug events. Always program the JTAG IDCODE register before relying on JTAG chain integrity checks.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS compliant per Intel/Altera product page; 'N' suffix indicates Pb-free ball finish. Not AEC-Q100 qualified - for automotive applications consult Intel automotive-grade CPLD variants. Halogen-free status not explicitly stated in product page.

データ検証日: 2026-10-06 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

5M2210ZF256C4N 5M2210ZF256C4N datasheet Altera MAX V CPLD FBGA-256 1700 LE CPLD 160 user I/O MAX V CPLD FBGA-256 commercial 5M2210ZF256C4N power supply sequencing 5M2210ZF256C4N vs 5M2210ZF256C5N 5M2210ZF256C4N drop-in replacement buy 5M2210ZF256C4N online MAX V CPLD pinout FBGA-256 5M2210ZF256C4N PCI bus bridge Intel Altera CPLD 1.8V core 1700 LE

関連部品&用語

Altera Intel Intel Programmable Solutions Group 5M2210ZF256C4N 5M2210ZF256C5N 5M2210ZF256I5N EPM570GF256C4N 5CEFA7F27C6N MAX V MAX II Cyclone V CPLD Complex Programmable Logic Device FPGA Logic Element Logic Array Block FBGA-256 FineLine BGA JTAG IEEE 1149.1 IEEE 1532 RoHS Pb-free VCCINT VCCIO flash configuration instant-on PCI bus I/O expansion glue logic power supply sequencing
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