EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
MPN: EPM570GF256C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.75 | $14.75 |
| 10 | $13.28 | $132.80 |
| 100 | $11.82 | $1,182.00 |
| 500 | $10.5 | $5,250.00 |
| 1,000 | $9.45 | $9,450.00 |
Drop-in alternatives for EPM570GF256C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM570GF256C4N Maximum Ratings & Electrical Characteristics
| Family | MAX II G |
| Device Series | EPM570G |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 212 |
| User Flash Memory (UFM) | 8 Kbits |
| Speed Grade | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | 4 ns |
| Internal fMAX | 304 MHz |
| Package | 256-ball FineLine BGA (FBGA-256) |
| Ball Pitch | 1.0 mm |
| Package Dimensions | 17 x 17 mm |
| Core Voltage | 1.8 V |
| I/O Bank Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | -40 °C to +125 °C (industrial) |
| Configuration Memory | Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Lead-Free / RoHS | Lead-free, FBGA package |
| Mounting Type | Surface Mount (BGA) |
EPM570GF256C4N 17 x 17 mm Pin Configuration Guide
Complete pinout information for EPM570GF256C4N (17 x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570GF256C4N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GF256C4N is suitable for 7 applications: Industrial I/O Expansion & Bus Bridging, Networking Line-Card Glue Logic, Power-Up Sequencer for Multi-Rail SoC Systems, Address Decoding & Memory Interfacing, Protocol Bridge (Legacy 5V to Modern 1.8V), FPGA Configuration Manager (Watchdog / Multi-Boot), Automotive ECU Glue Logic.
Industrial I/O Expansion & Bus Bridging
The EPM570GF256C4N is well-suited for industrial I/O expansion and bus bridging in PLC and motor-controller boards where its 212 user I/Os (in FBGA-256) allow direct fan-out from a host MCU to dozens of 24 V digital inputs, encoder channels, and opto-isolated outputs. The 4 ns tPD C4 speed grade delivers deterministic glue-logic timing for SPI-to-parallel address decoding between an ARM Cortex-M host and legacy peripherals. Industrial temp grade (-40 to +125 C) plus MultiVolt I/O banks (1.5 V to 3.3 V) let one CPLD bridge between a 1.8 V SoC and 3.3 V or 5 V-tolerant industrial buses without external level shifters. The non-volatile Flash configuration guarantees deterministic instant-on behavior required for safety-critical machine start-up sequences.
Recommended
Networking Line-Card Glue Logic
In networking line cards, the EPM570GF256C4N serves as power-up sequencer and bus arbiter between the switch ASIC, PHY transceivers, and management CPU. Its 4 ns C4 tPD provides deterministic arbitration between multiple Gigabit Ethernet MACs sharing a common SPI or I2C management bus. The 8 Kbit UFM block stores board-ID straps, MAC address backup, and manufacturing data accessible via the JTAG or self-instantiated SPI interface. The instant-on Flash configuration is critical for hot-swap line-card insertion scenarios where the switch fabric must see valid control logic before the management CPU has booted from its larger boot Flash.
Recommended
Power-Up Sequencer for Multi-Rail SoC Systems
The EPM570GF256C4N is ideal as a multi-rail power-up sequencer in SoC systems that require strict rail-ordering before the processor can boot. Its non-volatile Flash ensures the sequencing state machine is active within microseconds of 1.8 V core supply presence, even before the main SoC has loaded its firmware. The 212 user I/Os allow direct PG (power-good) feedback from each regulator's TPS or load switch, with dedicated outputs driving each enable pin. Designers can implement complex sequencing rules (time delays, voltage-monitor thresholds, fault latching) that would otherwise require a costly supervisor IC plus discrete logic.
Recommended
Address Decoding & Memory Interfacing
In MCU/SoC systems with multiple memory banks (Flash, SRAM, FRAM, peripherals), the EPM570GF256C4N replaces discrete 74-series glue logic with a single chip that decodes the full address range in 4 ns. The MultiVolt I/O banks allow direct connection between a 1.8 V MCU address bus and 3.3 V memories, eliminating external level shifters. The 8 Kbit UFM can store boot-configuration tables, calibration data, or revision identifiers accessed by firmware at startup. Industrial temp grade makes it suitable for automotive under-hood and industrial cabinet deployments.
Recommended
Protocol Bridge (Legacy 5V to Modern 1.8V)
The EPM570GF256C4N serves as a protocol bridge between legacy 5 V peripherals (parallel-port ASICs, 5 V sensors, 5 V MCUs) and modern 1.8 V SoCs. With separate VCCIO banks powered at 3.3 V (legacy side) and 1.8 V (modern side), the CPLD performs bidirectional voltage translation plus protocol conversion (parallel-to-SPI, UART-to-SPI, etc.) in a single device. The 212 user I/Os comfortably accommodate 8-bit to 32-bit bus widths. Industrial temp grade supports factory-floor equipment upgrades without replacing the entire control board.
Recommended
FPGA Configuration Manager (Watchdog / Multi-Boot)
The EPM570GF256C4N is commonly used as an FPGA configuration watchdog or multi-boot manager, monitoring the FPGA's CONFIG_DONE / nSTATUS pins and toggling nCONFIG to recover from a corrupted bitstream. The CPLD can hold two fallback bitstreams in its 8 Kbit UFM (up to 4 Mbit raw bitstream compressed) and present them via a custom SPI-like interface to the FPGA. With 4 ns tPD, the watchdog reacts within nanoseconds of a failed boot, far faster than any MCU-based supervisor. This is a standard pattern in aerospace, defense, and industrial FPGA designs where deterministic configuration recovery is required.
Recommended
Automotive ECU Glue Logic
In automotive ECUs (engine control, transmission control, ADAS sensor fusion), the EPM570GF256C4N provides deterministic glue logic between MCUs, sensor ASICs, and actuator drivers. Its industrial temp grade (-40 to +125 C) handles under-hood thermal stress, and the MultiVolt I/O banks interface with both 3.3 V sensor ICs and 5 V actuator drivers. The 4 ns tPD enables real-time encoder pulse processing and motor commutation logic at high RPM. The non-volatile Flash configuration eliminates boot time, critical for systems that must respond within milliseconds of ignition-on.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GF256C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GF256C4 | EPM570GF256C3N | EPM570GF256C3 | EPM1270GF256C4N | EPM2210GF256C4N | EPM570F256C4N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-256 (17x17 mm, 1.0 mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Family | MAX II G | MAX II G | MAX II G | MAX II G | MAX II G | MAX II G | MAX II (non-G) |
| Logic Elements | 570 | 570 | 570 | 570 | 1270 | 2210 | 570 |
| User I/Os | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| Speed Grade (tPD) | C4 (4 ns) | C4 (4 ns) | C3 (3 ns) | C3 (3 ns) | C4 (4 ns) | C4 (4 ns) | C4 (4 ns) |
| Operating Temperature | -40 to +125 C (industrial) | 0 to +85 C (commercial) | -40 to +125 C (industrial) | 0 to +85 C (commercial) | -40 to +125 C (industrial) | -40 to +125 C (industrial) | -40 to +125 C (industrial) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | None (non-G) |
Key Differentiators
- 570 LEs vs EPM1270G / EPM2210G in identical FBGA-256 footprint (vs EPM2210GF256C4N)
- MAX II G family with UFM block vs non-G MAX II (EPM570F) (vs EPM570F256C4N)
- C4 speed grade (4 ns tPD) for latency-critical glue logic (vs EPM570GF256C5N)
Design Notes
Estimated: The EPM570GF256C4N requires a clean 1.8 V core supply (VCCINT) and four independent VCCIO bank supplies (typically 3.3 V, 2.5 V, 1.8 V, 1.5 V depending on interface needs). A bulk 100 uF tantalum plus 10 uF ceramic per VCC rail, with 0.1 uF and 0.01 uF ceramic bypass capacitors placed within 5 mm of each BGA supply ball, is recommended. Power sequencing of VCCINT before VCCIO prevents I/O latch-up; the MAX II Device Handbook recommends VCCINT reaching 90% of nominal before any VCCIO bank exceeds 0.5 V.
The FBGA-256 package with 1.0 mm ball pitch requires a 4-layer PCB minimum with a continuous ground plane on layer 2 directly beneath the BGA for return-path integrity. Microvia technology (laser-drilled 0.1 mm vias in pad) is recommended for breakout routing; dog-bone fan-out is acceptable but consumes more board area. Total BGA land pattern area is 17 x 17 mm, leaving room for eight signal layers in a typical 4-layer stack-up. Maintain 50 ohm controlled impedance on all high-speed clock and JTAG signals.
The EPM570GF256C4N C4 grade provides 4 ns pin-to-pin delay, but actual propagation on the PCB depends heavily on signal integrity. Series-terminate clock outputs (CLK0-CLK3) with 33 ohm resistors if trace length exceeds 50 mm or if the load is more than four inputs. Avoid routing clock signals parallel to JTAG or high-speed I/O for more than 25 mm to prevent crosstalk. The MAX II I/O buffers support programmable drive strength (default 12 mA); use 4 mA or 8 mA settings on bussed signals to reduce SSO noise.
Three pitfalls are common when migrating from non-G MAX II (EPM570F) to MAX II G (EPM570G): (1) the G family adds a User Flash Memory (UFM) block accessible via dedicated interface pins - if unused, leave the UFM interface pins in their default Quartus-assigned state; (2) the JTAG TDO pin drive strength may differ - verify with Quartus pin-report before PCB layout; (3) the C4 speed grade in MAX II G is 4 ns tPD, while MAX II non-G C4 is also 4 ns - same speed grade, same package, but verify I/O standard support for MultiVolt banks matches your design before substitution.
Dedicate the top PCB layer beneath the FBGA-256 to a solid ground pour stitched with 0.5 mm-pitch ground vias around the entire BGA perimeter. This serves both as thermal dissipation (CPLD can dissipate up to 0.5 W under full I/O toggle at industrial temp) and as a low-impedance return path. Avoid routing signals through the BGA field; use inner layers for breakout. Reserve layer 4 for additional ground stitching or slow control signals (I2C, JTAG).
Compliance Information
FBGA-256 package is lead-free per FindIC datasheet excerpt; RoHS status confirmed by distributor listings. Not AEC-Q100 qualified - the MAX II family does not target automotive-grade certification. Use MAX V or Cyclone families for AEC-Q100 CPLD/FPGA applications.
