5M40ZM64C5N - 32-Macrocell MAX V CPLD, 64-MBGA | Intel / Altera
MPN: 5M40ZM64C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.33 | $2.33 |
| 10 | $2.1 | $21.00 |
| 100 | $1.86 | $186.00 |
| 500 | $1.62 | $810.00 |
| 1,000 | $1.45 | $1,450.00 |
Drop-in alternatives for 5M40ZM64C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5M40ZM64C4N
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View Datasheet →5M40ZM64A5N
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View Datasheet →5M80ZM64C5N
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View Datasheet →5M40ZM64C5N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device Logic Elements | 40 |
| Macrocells | 32 |
| Maximum Internal Frequency | 118.3 MHz |
| Pin-to-Pin Logic Delay (tPD) | 7.5 ns |
| Supply Voltage - Core (VCCINT) | 1.8 V |
| I/O Voltage Banks | 1.5 V / 1.8 V / 2.5 V / 3.3 V tolerant |
| Programmable I/O Pins | 30 (approximate, per MAX V 5M40Z datasheet family) |
| User Flash Memory | 8 Kbits |
| Configuration Method | Non-volatile flash, instant-on, single-chip |
| Programming Interface | JTAG (IEEE 1149.1) ISP |
| Standby Current (ICCSTBY) | 55 µA typical |
| Operating Temperature Range | 0 °C to +85 °C (commercial) |
| Package | 64-ball MBGA, 5 mm × 5 mm |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
5M40ZM64C5N 64-ball mbga, 5 mm × 5 mm Pin Configuration Guide
Complete pinout information for 5M40ZM64C5N (64-ball mbga, 5 mm × 5 mm package) with 30 (approximate, per MAX V 5M40Z datasheet family) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M40ZM64C5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 30 (approximate, per MAX V 5M40Z datasheet family) pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M40ZM64C5N is suitable for 6 applications: I/O Expansion and Bus Bridging, Power-Sequencing and Reset Distribution, Board-Level Glue Logic Replacement, Industrial Control and Sensor Interface, FPGA Configuration and Control Companion, USB Type-C Port Controller and Cable-Orientation Logic.
I/O Expansion and Bus Bridging
The 5M40ZM64C5N excels at expanding MCU or SoC I/O count and bridging between mismatched logic levels. Its multi-voltage I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V directly, eliminating external level-shifters between, for example, a 1.8 V application processor and 3.3 V sensors. With 30 user I/O pins and 7.5 ns tPD, the part can decode address ranges and aggregate interrupts deterministically. The MAX V's instant-on, non-volatile flash configuration means the expansion logic is ready before the host boots, simplifying cold-start firmware. Reference designs pair the 5M40ZM64C5N with NXP Kinetis or STM32 host MCUs to add SPI-to-parallel LCD bridges, GPIO expanders, or keypad scanners in industrial HMI panels.
Recommended
Power-Sequencing and Reset Distribution
The 5M40ZM64C5N is a deterministic power-sequencing controller for multi-rail systems. Its 7.5 ns pin-to-pin delay and multi-voltage I/O let it drive Enable pins on LDOs (such as TPS7A4701) in a fixed order while monitoring Power-Good flags, releasing downstream resets only after all rails are stable. Non-volatile flash configuration eliminates the cold-start race that affects SRAM-based FPGAs, so the sequencer is active before the host processor initializes. With 40 logic elements and 8 Kbits of user flash, the part can store trim values and fault logs for post-mortem debugging. The 55 µA standby current keeps quiescent draw minimal in battery-backed systems.
Recommended
Board-Level Glue Logic Replacement
The 5M40ZM64C5N can replace 4-8 discrete 74-series logic ICs (decoders, multiplexers, latches, flip-flops) with a single 5 mm × 5 mm BGA, dramatically reducing PCB area and BOM count. Designers map address decoding, interrupt aggregation, and status-LED multiplexing into the CPLD's 32 macrocells using Quartus II schematic capture or VHDL. Unlike discrete gates, the CPLD allows late-stage design changes without board rework, accelerating time-to-market. The MAX V's 1.8 V core and 3.3 V-tolerant I/O are drop-in replacements for HC/HCT logic families, and JTAG ISP lets production engineers program boards in-circuit.
Recommended
Industrial Control and Sensor Interface
The 5M40ZM64C5N's 0-85 °C commercial temperature range, 1.8 V low-power operation, and 55 µA standby current suit it for industrial sensor-interface conditioning and PLC I/O conditioning modules. Its JTAG ISP interface supports in-field firmware updates on installed equipment, reducing service-call costs. The CPLD can debounce mechanical switch inputs, implement digital filters on encoder quadrature signals, and synchronize sensor read timing across multiple channels. Pairing the part with a TI MSP430 or Renesas RX host MCU lets the system offload deterministic logic to the CPLD while the host runs higher-level control loops. The 64-MBGA's 5 mm × 5 mm footprint is small enough to fit inside standard industrial push-in terminals.
Recommended
FPGA Configuration and Control Companion
The 5M40ZM64C5N is widely used as a configuration and control companion to larger FPGAs such as Cyclone IV/V or Lattice ECP5. The CPLD can hold user-mode control signals (reset, mode-select, LED-status) for the FPGA, freeing FPGA general-purpose I/O for application logic. Its instant-on behavior means configuration-control signals are valid at t=0, while the FPGA is still loading from flash, avoiding race conditions. Engineers also use the MAX V's 8 Kbits of user flash to store board serial number, MAC address, or calibration constants read by the FPGA over SPI at boot. The 64-MBGA footprint is small enough to mount on the underside of the FPGA footprint area.
Recommended
USB Type-C Port Controller and Cable-Orientation Logic
The 5M40ZM64C5N's small MBGA footprint and 7.5 ns tPD make it a fit-and-forget USB Type-C cable-orientation and CC-pin controller in accessories, hubs, and docking stations. The MAX V can detect CC1/CC2 pull-up/pull-down states, swap the USB SuperSpeed differential pair routing via a 2:1 mux, and present the correct Rp/Rd combination to the upstream Type-C host - all without external configuration memory. With 55 µA standby current, the part contributes negligibly to the always-on accessory power budget. The 64-MBGA's 5 × 5 mm area fits inside the USB-C connector shroud, enabling single-board Type-C dongles that previously required an MCU.
Recommended
Recommended Products Summary
Engineering reference data for 5M40ZM64C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M40ZM64C4N | 5M40ZM64A5N | 5M40ZE64C5N | 5M80ZM64C5N | 5M40ZM64C5 |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 64-MBGA (5 × 5 mm) | 64-MBGA (5 × 5 mm) - same | 64-MBGA (5 × 5 mm) - same | 64-EQFP (different) | 64-MBGA - same | 64-MBGA - same |
| Macrocells | 32 | 32 | 32 | 32 | 64 | 32 |
| Logic Elements | 40 | 40 | 40 | 40 | 80 | 40 |
| Maximum Internal Frequency | 118.3 MHz | [DATA_NEEDED] | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz |
| Pin-to-Pin Delay (tPD) | 7.5 ns | 8.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +125 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Standby Current (typ) | 55 µA | 55 µA | [DATA_NEEDED] | 55 µA | [DATA_NEEDED] | 55 µA |
| User I/O Pins | 30 | 30 | 30 | 30 | 30 | 30 |
Key Differentiators
- Smallest-footprint 32-macrocell MAX V CPLD with full I/O voltage flexibility (vs 5M40ZE64C5N (64-EQFP))
- Extended-temperature variant available in the same MBGA footprint (vs 5M40ZM64C5N vs 5M40ZM64A5N)
- Dual density options in identical package simplify design upgrades (vs 5M40ZM64C5N vs 5M80ZM64C5N)
Design Notes
The 64-MBGA (5 × 5 mm) has a 0.5 mm ball pitch, which requires laser-drilled or micro-via PCB stack-ups (typical 4-layer 1 oz copper). Use NSMD (non-solder-mask-defined) pads to increase solder-joint reliability under thermal cycling. Place 0.1 µF and 1 µF X7R 0402/0201 ceramic decoupling capacitors within 1 mm of each VCCINT and VCCIO ball pair. A solid ground plane on layer 2 directly under the BGA improves thermal dissipation and reduces simultaneous-switching noise on the JTAG and I/O banks.
Do not confuse the M-package 5M40ZM64C5N (64-MBGA) with the E-package 5M40ZE64C5N (64-EQFP); they share the same die but have different land patterns and are not interchangeable on the same PCB. Always verify the package code (M vs E) and ball/lead count before ordering. Also note that 5M40Z series parts are 1.8 V core and require a separate 3.3 V-to-1.8 V regulator for VCCINT even when I/O banks run at 3.3 V - omitting this regulator is a common first-prototype error.
JTAG signals (TDI, TDO, TMS, TCK, TRST) must be routed with 50 Ω controlled impedance and pulled up to VCCIO through 10 kΩ resistors on TDI, TMS, and TCK. Keep the JTAG chain under 6 inches and avoid splitting the JTAG bus across multiple voltage domains without a level shifter - use a dedicated JTAG buffer (such as SN74LVC1G125 or FTDI FT2232H) when chaining multiple 1.8 V and 3.3 V CPLDs/FPGAs. According to the MAX V handbook, JTAG TCK frequencies above 16 MHz require termination at the TCK source to prevent reflections.
Compliance Information
RoHS compliant and lead-free per Altera/Intel product page and distributor listings. Not AEC-Q100 qualified - choose 5M40ZM64A5N for automotive-temp applications. Halogen-free status not explicitly stated in the verified data and should be confirmed with the latest manufacturer material declaration before IEC 61249-2-21 compliance checks.
