5M80ZE64C5N - MAX V CPLD 64-Macrocell 118.3 MHz 64-EQFP | Intel
Référence : 5M80ZE64C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.45 | $7,45 |
| 10 | $6.78 | $67,80 |
| 100 | $5.92 | $592,00 |
| 500 | $5.1 | $2 550,00 |
| 1 000 | $4.38 | $4 380,00 |
5M80ZE64C5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile, low-density programmable logic device that combines multiple PAL-like macrocell blocks with a programmable interconnect matrix. In the broader taxonomy, a CPLD sits below an FPGA in density but offers deterministic timing, predictable propagation delays, and instant-on operation, making it ideal for glue logic, I/O expansion, bus bridging, and power-up sequencing. The MAX V family specifically targets low-power applications where battery life, board area, and design simplicity are critical.
Key features include 4.5 ns maximum global clock setup time, IEEE 1149.1 JTAG boundary-scan support, an internal oscillator, programmable LVTTL/LVCMOS I/O standards at 1.5 V, 1.8 V, 2.5 V, and 3.3 V, and built-in flash configuration storage. The 64-pin EQFP package provides 54 usable I/Os plus an exposed bottom pad that must be soldered to the PCB ground plane for electrical connectivity and mechanical stability.
The 5M80ZE64C5N architecture is a classic AND-OR PLA-style fabric with JTAG-based in-system programmability. Its flash configuration cells retain bitstream data without a battery, eliminating boot PROM cost and BOM. Compared to the earlier MAX II family, MAX V offers higher macro density and lower static power, while remaining compatible with the Quartus II / Intel Quartus Prime design flow, enabling portable IP reuse across MAX generations.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing logic in multi-rail systems, glue logic in networking line cards, and feature-enabling logic in low-cost consumer electronics. The combination of instant-on, low power, and small footprint also makes the part suitable for battery-powered portable devices and automotive body modules where deterministic start-up behavior is required.
When designing with the E64 package, engineers must connect the exposed bottom pad to the ground plane to meet datasheet electrical and mechanical requirements. Designers should also note I/O bank voltage constraints and use external level shifters when interfacing mixed-voltage rails. The device is non-volatile, so no configuration download step is needed at power-up.
This page synthesizes live distributor pricing, drop-in alternatives within the MAX V family, and practical design notes - information gain that complements the official Intel MAX V Device Handbook.
Alternatives de remplacement direct pour 5M80ZE64C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M80ZE64C5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Operating Temperature, Configuration Memory, Logic Elements (LE).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M80ZE64I5N
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →5M80ZE64C5
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
5M160ZE64C5N
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →5M40ZE64C5N
✅ Remplacement direct✓ En stock
$4.85 / unité
Voir la fiche technique →5M80ZE64C5N Valeurs maximales et caractéristiques électriques
| Family | MAX V |
| Device Type | CPLD - Complex Programmable Logic Device |
| Number of Macrocells | 64 |
| Number of Logic Elements | 80 |
| Number of User I/Os | 54 |
| Maximum Internal Frequency | 118.3 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 7.5 ns |
| Global Clock Setup Time | 4.5 ns max |
| Core Supply Voltage | 1.8 V |
| I/O Standards Supported | LVTTL, LVCMOS (1.5 V, 1.8 V, 2.5 V, 3.3 V) |
| Configuration Memory | Non-volatile flash |
| Programming Interface | JTAG (IEEE 1149.1) |
| Boîtier | 64-EQFP (7x7 mm) with exposed pad |
| Plage de température de fonctionnement | 0C to +85C (TJ) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Sans halogène | Yes |
Configuration des broches de 5M80ZE64C5N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O pin (bank 3) |
| Broche 24 | I/O — User I/O pin (bank 3) |
| Broche 25 | I/O — User I/O pin (bank 3) |
| Broche 26 | I/O — User I/O pin (bank 3) |
| Broche 27 | I/O — User I/O pin (bank 3) |
| Broche 28 | I/O — User I/O pin (bank 3) |
| Broche 29 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 30 | I/O — User I/O pin (bank 3) |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O pin (bank 4) |
| Broche 34 | I/O — User I/O pin (bank 4) |
| Broche 35 | I/O — User I/O pin (bank 4) |
| Broche 36 | I/O — User I/O pin (bank 4) |
| Broche 37 | I/O — User I/O pin (bank 4) |
| Broche 38 | I/O — User I/O pin (bank 4) |
| Broche 39 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 40 | I/O — User I/O pin (bank 4) |
| Broche 41 | I/O — User I/O pin (bank 4) |
| Broche 42 | GND — Ground |
| Broche 43 | TDI — JTAG test data input |
| Broche 44 | TMS — JTAG test mode select |
| Broche 45 | TCK — JTAG test clock |
| Broche 46 | TDO — JTAG test data output |
| Broche 47 | nSTATUS — Configuration status (open-drain) |
| Broche 48 | nCONFIG — Configuration control input |
| Broche 49 | CONF_DONE — Configuration complete (open-drain) |
| Broche 50 | DEV_CLRn — Device-wide clear (active low) |
| Broche 51 | DEV_OE — Device-wide output enable |
| Broche 52 | GND — Ground |
| Broche 53 | VCCINT — Core supply voltage (1.8 V) |
| Broche 54 | I/O — User I/O pin (bank 1) |
| Broche 55 | I/O — User I/O pin (bank 1) |
| Broche 56 | I/O — User I/O pin (bank 1) |
| Broche 57 | I/O — User I/O pin (bank 1) |
| Broche 58 | I/O — User I/O pin (bank 1) |
| Broche 59 | I/O — User I/O pin (bank 1) |
| Broche 60 | I/O — User I/O pin (bank 1) |
| Broche 61 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 62 | I/O — User I/O pin (bank 1) |
| Broche 63 | I/O — User I/O pin (bank 1) |
| Broche 64 | I/O — User I/O pin (bank 1) |
| Broche EP | GND (EP) — Exposed pad - must be soldered to PCB ground plane |
Applications typiques
5M80ZE64C5N convient pour 7 applications: Industrial I/O Expansion and Bus Bridging, Power-Up Sequencing in Multi-Rail Systems, Networking Line Card Glue Logic, Consumer Electronics Feature Logic, Battery-Powered Portable Device Control, Automotive Body Electronics and Infotainment Modules, Legacy Board Replacement and Obsolescence Bridging.
Industrial I/O Expansion and Bus Bridging
The 5M80ZE64C5N excels at I/O expansion and bus bridging in industrial controllers where deterministic timing and instant-on behavior are required. Its 64 macrocells provide sufficient logic capacity to translate between SPI, I2C, UART, and parallel interfaces without external glue logic. The 7.5 ns pin-to-pin propagation delay ensures consistent bus-cycle latency, while the non-volatile flash memory eliminates boot time at power-up - critical for PLCs and HMI panels that must respond to operator input within milliseconds of power-on. The 64-EQFP footprint fits within 7x7 mm, simplifying layout on densely populated industrial controller boards.
Recommandé
Power-Up Sequencing in Multi-Rail Systems
The 5M80ZE64C5N is widely used to implement power-up and power-down sequencing logic in multi-rail systems such as servers, networking switches, and FPGA-based boards. Its 80 logic elements and 54 user I/Os can monitor PG (power-good) signals from multiple DC-DC converters and assert enable signals in the correct order. The 1.8 V core supply and 3.3 V-tolerant I/O banks simplify interface with modern POL regulators. Because the device is non-volatile, the sequencing state machine is active the moment power rails stabilize, with no firmware boot delay.
Recommandé
Networking Line Card Glue Logic
In networking line cards, the 5M80ZE64C5N serves as a flexible glue-logic layer between PHY chips, MACs, FPGAs, and switch fabrics. Its JTAG-based ISP (in-system programmability) allows late-stage design changes via boundary-scan without board rework. The 118.3 MHz maximum frequency supports gigabit Ethernet sideband signaling and MDIO/MDC interfaces, while the 64-EQFP exposed-pad package provides the mechanical robustness required for high-vibration telecom environments. The low static power of the MAX V family is also beneficial for thermally constrained line-card designs.
Recommandé
Consumer Electronics Feature Logic
The 5M80ZE64C5N is an excellent fit for consumer products such as set-top boxes, smart-home hubs, and small appliances that need a few dozen logic functions without paying for an FPGA. Its low unit cost at high volumes, combined with the Quartus Prime Lite free design toolchain, makes it attractive for cost-sensitive consumer designs. Instant-on behavior means the part can wake up the rest of the system and handshake with display or sensor subsystems the moment power is applied, eliminating perceived boot lag. The compact 7x7 mm EQFP footprint also simplifies single-sided PCB layouts.
Recommandé
Battery-Powered Portable Device Control
The MAX V family's low static power makes the 5M80ZE64C5N suitable for battery-powered portable devices such as handheld instruments, IoT edge nodes, and wearable accessories. The 1.8 V core supply draws minimal quiescent current, while flash configuration eliminates the inrush surge of an FPGA boot sequence. The device can implement low-duty-cycle sensor wake-up logic, button-debounce circuits, and LED drivers in a single 7x7 mm package, freeing the main microcontroller from repetitive interrupt service routines. The 0C to +85C operating range covers typical consumer portable environments.
Recommandé
Automotive Body Electronics and Infotainment Modules
The 5M80ZE64C5N is used in non-safety automotive body modules such as infotainment, instrument cluster backlight drivers, and HVAC control panels where its 0C to +85C operating range and non-volatile configuration are valuable. It can implement CAN bus wake-up logic, body-control message routing, and display-matrix scanning with deterministic 7.5 ns timing. For under-hood or AEC-Q100-mandated applications, however, designers should select the MAX V 'A' grade variants or an automotive-qualified CPLD family, since the standard 5M80ZE64C5N is not AEC-Q100 certified.
Recommandé
Legacy Board Replacement and Obsolescence Bridging
The 5M80ZE64C5N serves as a modern, active-lifecycle replacement for end-of-life CPLDs in legacy industrial, telecom, and test equipment designs. Designers migrating from the older MAX 7000 or MAX II families can port designs to MAX V using the same Quartus Prime toolchain with minimal code changes, while gaining flash non-volatility and lower power. With a documented EOL horizon around 2026 per industry sources, engineers planning long-life-cycle systems should consider the higher-density MAX V siblings (5M160Z, 5M240Z) or monitor Intel's product roadmap for continued MAX V supply.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M80ZE64C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M80ZE64I5N | 5M80ZE64C5 | 5M160ZE64C5N | 5M40ZE64C5N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 64-EQFP (7x7) | 64-EQFP (7x7) - same | 64-EQFP (7x7) - same | 64-EQFP (7x7) - same | 64-EQFP (7x7) - same |
| Macrocells | 64 | 64 | 64 | 160 | 40 |
| Logic Elements | 80 | 80 | 80 | 160 | 40 |
| Maximum Frequency | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz |
| Pin-to-Pin Delay (tPD) | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| User I/Os | 54 | 54 | 54 | 54 | 54 |
Principaux différenciateurs
- Non-volatile flash configuration with instant-on behavior (vs SRAM-based small FPGAs)
- Lowest static power in the 64-macroclass MAX V family (vs MAX II EPM570F100C5N)
- Wide I/O voltage support on each bank (vs 5M160ZE64C5N (same family, higher density))
Notes de conception
The 64-EQFP package includes a central exposed pad (pin EP) that MUST be soldered to the PCB ground plane. Use an array of thermal vias (typically 9-16 vias in a 3x3 or 4x4 pattern) directly under the EP to provide a low-impedance ground path and to meet the datasheet's mechanical mounting requirements. The EP serves electrical grounding and mechanical stability - not primarily thermal dissipation for this low-power CPLD.
The 5M80ZE64C5N requires two supply rails: VCCINT at 1.8 V for the core logic and VCCIO1/VCCIO2/VCCIO3/VCCIO4 for each I/O bank. Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 2-3 mm of the package pin, plus a bulk 10 uF tantalum or ceramic capacitor near the device. Bank voltages can be mixed (1.5 V, 1.8 V, 2.5 V, or 3.3 V) but each bank must be tied to a single rail - level shifting between banks requires external circuitry.
Do not assume the 5M80ZE64C5N is pin-compatible with MAX II CPLDs in the same E64 package - while pin counts match, several power and JTAG pins are reassigned between MAX II and MAX V. Always re-import the MAX V pinout file into your Quartus Prime project. Also note that the device is non-volatile, so design changes require JTAG re-programming; budget 3-5 seconds for ISP via JTAG during production.
Keep JTAG signals (TDI, TMS, TCK, TDO) routed with short, parallel traces and a ground reference to minimize noise coupling. The nSTATUS, nCONFIG, and CONF_DONE signals are open-drain and require external pull-up resistors (typically 4.7 kohm to 10 kohm) to VCCIO. Place these pull-ups close to the CPLD, not at the programming header, to ensure clean ISP operation.
Informations de conformité
RoHS compliant and halogen-free per the manufacturer datasheet and GlobalSpec listing. Not AEC-Q100 qualified - use MAX V 'A' grade variants or dedicated automotive CPLDs for AEC-Q100 applications.
