A3P250-1FGG256T - ProASIC3 Flash FPGA 250k Gates | Microchip
Référence : A3P250-1FGG256T ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $39.2 | $392,00 |
| 100 | $35.8 | $3 580,00 |
| 500 | $32.6 | $16 300,00 |
| 1 000 | $29.9 | $29 900,00 |
A3P250-1FGG256T Présentation
An FPGA is a semiconductor device containing a matrix of configurable logic blocks (CLBs) connected by programmable interconnects, allowing designers to implement custom digital logic after manufacturing. The ProASIC3 family from Microsemi (now Microchip Technology) is built on flash-based programmable logic technology, which distinguishes it from SRAM-based FPGAs: configuration is stored in on-chip flash cells, so the device is single-chip, instant-on at power-up, and needs no external configuration PROM.
Key features include nonvolatile flash configuration enabling live-at-power-up operation, reprogrammability with high security (FlashLock), low total cost of ownership (TOC) with no boot PROM or configuration controller, and a small footprint package suited to space-constrained boards. The -1 speed grade supports system performance up to approximately 350 MHz toggle capability per distributor listings.
Technically, the A3P250 integrates 6144 versatile VersaTiles in CMOS flash process technology. The fabric supports single-ended and differential I/O standards, and the architecture is targeted at glue logic consolidation, interface bridging, and control-plane functions where a single-chip, low-power, secure solution is preferred over SRAM FPGAs.
Typical applications include industrial automation control, communications line cards, portable and battery-powered instruments, and aerospace/defense subsystems requiring secure, instant-on programmable logic.
Design consideration: verify I/O bank voltage compatibility with adjacent chips and use Microchip Libero SoC design software for synthesis and place-and-route; flash FPGAs cannot be reconfigured in-flight like SRAM devices, so plan static configurations.
This page synthesizes distributor pricing, drop-in family alternatives, design notes, and FAQ content not found in a single manufacturer datasheet.
Alternatives de remplacement direct pour A3P250-1FGG256T — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P250-1FGG256T (même facteur de forme et même empreinte) — différant par Package, Packaging, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P250-1FGG256
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P250-FG256T
✅ Remplacement direct✓ En stock
$32.5 / unité
Voir la fiche technique →A3P250-1FG256
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
A3P250-2FGG256T
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
A3P250-1FGG256T
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$29.9 / unité
Voir la fiche technique →A3P250-1FGG256T Valeurs maximales et caractéristiques électriques
| Family | ProASIC3 |
| System Gates | 250000 |
| Logic Blocks (CLBs) | 6144 |
| Number of Cells | 6144 |
| User I/O | 157 |
| Maximum Frequency | 350 MHz |
| Speed Grade | -1 |
| Programmable Technology | Flash (nonvolatile) |
| Process Technology | CMOS |
| Boîtier | 256-FBGA (PBGA256, 1 mm pitch) |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Statut RoHS | Green (per Jotrin listing) |
| Configuration | Single-chip, instant-on, no external boot device |
Guide de configuration des broches du A3P250-1FGG256T 256-fbga (pbga256, 1 mm pitch)
Configuration des broches du A3P250-1FGG256T (boîtier 256-fbga (pbga256, 1 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3P250-1FGG256T.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3P250-1FGG256T convient pour 6 applications: Industrial Automation Control, Communications Line Cards, Portable and Battery-Powered Instruments, Aerospace and Defense Subsystems, Medical Diagnostic Equipment, Video and Display Interface Logic.
Industrial Automation Control
The A3P250-1FGG256T fits industrial automation because its flash fabric is live at power-up, so PLC I/O modules and motor-control sequencing boards start deterministic operation with zero boot delay - a hard requirement on factory lines where every second of startup counts. With 250,000 gates (6144 CLBs) and 157 user I/Os, it consolidates glue logic, encoder interfaces, and safety interlock logic into one chip, replacing multiple CPLDs and discrete logic. The 1 mm-pitch 256-FBGA saves board area in dense I/O cards, and FlashLock security protects proprietary control IP on shared production equipment. Because configuration is nonvolatile, power glitches during line switching cannot corrupt the programmed design.
Recommandé
Communications Line Cards
In telecom and datacom line cards, the A3P250-1FGG256T serves as a control-plane bridge between backplane connectors, PHYs, and system controllers. Its 157 I/Os handle parallel status/monitor buses across multiple PHY devices, while the -1 speed grade supports the sub-350 MHz state-machine and interface logic typical of management paths. The single-chip flash architecture removes the configuration PROM and its power-up sequencing, simplifying hot-swap design. High security via FlashLock protects firmware-defined network features, and the 250k-gate fabric is sufficient for packet-framing assist logic, LED/alarms aggregation, and I2C/UART expansion that would otherwise need a CPLD farm.
Recommandé
Portable and Battery-Powered Instruments
Battery-powered test and measurement instruments benefit from the ProASIC3 flash FPGA's low static power profile relative to SRAM FPGAs of similar density, since there is no configuration storage overhead and no external boot device drawing current. The 256-FBGA's 1 mm pitch supports compact handheld layouts, while 250,000 gates implement display controllers, sensor aggregation FSMs, and trigger logic. Instant-on operation means the instrument is measuring within milliseconds of the power switch - critical for intermittent-use field tools. The 157 I/Os connect ADCs, keypads, and displays without an additional I/O expander, reducing BOM cost and quiescent budget.
Recommandé
Aerospace and Defense Subsystems
Microsemi (now Microchip) ProASIC3 flash FPGAs have a long heritage in aerospace and defense because flash configuration is inherently resistant to configuration upset compared with SRAM cells, and the single-chip design reduces component count in high-reliability boards. The A3P250-1FGG256T implements telemetry formatting, redundancy voting, and interface protocol conversion in satellite payloads and avionics test equipment. FlashLock provides design IP protection, which is frequently mandated in defense supply chains. Designers should select the appropriate military/extended temperature ordering variant when required and verify lot traceability with Microchip for qualified programs.
Recommandé
Medical Diagnostic Equipment
Medical diagnostics such as blood analyzers and imaging front ends use the A3P250-1FGG256T to sequence motors, valves, and detector readout with deterministic instant-on behavior. The 6144-CLB fabric implements timing controllers for sensor arrays and interfaces to precision ADCs like the ADS131M08, while 157 I/Os integrate pumps, heaters, and user-interface elements without external expansion logic. Nonvolatile flash means sterilization-related power cycles never require reconfiguration, and the secure single-chip design supports the audit and IP-protection requirements of regulated medical device programs. Low-power flash operation suits portable point-of-care instruments.
Recommandé
Video and Display Interface Logic
The 350 MHz-class fabric of the A3P250-1FGG256T supports video timing generation, scan conversion glue logic, and panel control interfaces in industrial displays and signage. With 157 user I/Os, the FPGA drives parallel RGB or LVDS-adjacent control streams to panel drivers while monitoring backlight and thermal feedback loops. Instant-on flash configuration ensures the display subsystem is ready before the video source enumerates - avoiding blank-frame faults at power-up. The 256-FBGA footprint fits behind panel driver boards, and FlashLock protects proprietary display-timing IP shipped inside commercial display products.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P250-1FGG256T — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P250-1FGG256 | A3P250-FG256T | A3P250-2FGG256T |
|---|---|---|---|---|
| Package | 256-FBGA (1 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250000 | 250000 | 250000 | 250000 |
| CLBs / Cells | 6144 | 6144 | 6144 | 6144 |
| User I/O | 157 | 157 | 157 | 157 |
| Configuration Technology | Nonvolatile flash, single-chip | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
| Max Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz (higher graded timing) |
Principaux différenciateurs
- Single-chip instant-on flash configuration (vs SRAM-based competitor FPGAs)
- Identical footprint across speed grades (vs A3P250-2FGG256T)
- Balanced density/IO for glue logic consolidation (vs Larger A3P1000 devices)
Notes de conception
ProASIC3 flash FPGAs require core and I/O bank supply rails; verify the exact voltage rails and sequencing from the ProASIC3 datasheet before finalizing the power tree. Estimated: with 250k gates of flash fabric, static power is substantially lower than an equivalent SRAM FPGA, but dynamic power scales with clock frequency and toggle rate - run Microchip's power estimator in Libero SoC with your post-layout netlist for an accurate budget. Decouple each supply ball with 0.1 uF ceramics placed within 2 mm of the ball via short vias to the plane.
The 256-FBGA with 1 mm pitch allows via-in-pad or dog-house fanout with 0.3 mm drilled vias and 4-5 mil trace/space on BGA breakout layers. Use at least a four-layer board with dedicated ground plane under the BGA. Pin 1 (ball A1) is identified by the package dot; orient per the datasheet mechanical drawing. Follow IPC guidelines referenced in the Microchip packaging document for reflow profile - FBGA parts are moisture sensitive, so bake and follow the MSL rating printed on the reel label.
Common pitfall: assuming all 256 balls are user I/Os - only 157 are user-accessible, and I/O banks impose voltage-compatibility grouping, so check bank assignments before assigning signals. Second pitfall: the T suffix denotes tape and reel, not a different die; do not create separate approval documents for A3P250-1FGG256T versus A3P250-1FGG256. Third: the -1 speed grade has lower Fmax than -2; obtain timing-verified results in Libero SoC before freezing the -1 choice.
Informations de conformité
Jotrin listing describes the package as GREEN, indicating RoHS/green body compliance. Full REACH, lead-free, and halogen-free status must be confirmed against the official Microchip product compliance documents.
