A3P250-1FGG256T - ProASIC3 Flash FPGA 250k Gates | Microchip
MPN: A3P250-1FGG256T ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.2 | $392.00 |
| 100 | $35.8 | $3,580.00 |
| 500 | $32.6 | $16,300.00 |
| 1,000 | $29.9 | $29,900.00 |
A3P250-1FGG256T Overview
An FPGA is a semiconductor device containing a matrix of configurable logic blocks (CLBs) connected by programmable interconnects, allowing designers to implement custom digital logic after manufacturing. The ProASIC3 family from Microsemi (now Microchip Technology) is built on flash-based programmable logic technology, which distinguishes it from SRAM-based FPGAs: configuration is stored in on-chip flash cells, so the device is single-chip, instant-on at power-up, and needs no external configuration PROM.
Key features include nonvolatile flash configuration enabling live-at-power-up operation, reprogrammability with high security (FlashLock), low total cost of ownership (TOC) with no boot PROM or configuration controller, and a small footprint package suited to space-constrained boards. The -1 speed grade supports system performance up to approximately 350 MHz toggle capability per distributor listings.
Technically, the A3P250 integrates 6144 versatile VersaTiles in CMOS flash process technology. The fabric supports single-ended and differential I/O standards, and the architecture is targeted at glue logic consolidation, interface bridging, and control-plane functions where a single-chip, low-power, secure solution is preferred over SRAM FPGAs.
Typical applications include industrial automation control, communications line cards, portable and battery-powered instruments, and aerospace/defense subsystems requiring secure, instant-on programmable logic.
Design consideration: verify I/O bank voltage compatibility with adjacent chips and use Microchip Libero SoC design software for synthesis and place-and-route; flash FPGAs cannot be reconfigured in-flight like SRAM devices, so plan static configurations.
This page synthesizes distributor pricing, drop-in family alternatives, design notes, and FAQ content not found in a single manufacturer datasheet.
Drop-in alternatives for A3P250-1FGG256T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with A3P250-1FGG256T (same form factor and footprint) — differing in Package, Packaging, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P250-1FGG256
✅ Drop-In📋 Reference alternative (not in catalog)
A3P250-FG256T
✅ Drop-In✓ In Stock
$32.5 / Unit
View Datasheet →A3P250-1FG256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
A3P250-2FGG256T
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
A3P250-1FGG256T
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$29.9 / Unit
View Datasheet →A3P250-1FGG256T Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 250000 |
| Logic Blocks (CLBs) | 6144 |
| Number of Cells | 6144 |
| User I/O | 157 |
| Maximum Frequency | 350 MHz |
| Speed Grade | -1 |
| Programmable Technology | Flash (nonvolatile) |
| Process Technology | CMOS |
| Package | 256-FBGA (PBGA256, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| RoHS Status | Green (per Jotrin listing) |
| Configuration | Single-chip, instant-on, no external boot device |
A3P250-1FGG256T 256-fbga (pbga256, 1 mm pitch) Pin Configuration Guide
Pin configuration for A3P250-1FGG256T (256-fbga (pbga256, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P250-1FGG256T.
Refer to the datasheet for full pin configuration.
Typical Applications
A3P250-1FGG256T is suitable for 6 applications: Industrial Automation Control, Communications Line Cards, Portable and Battery-Powered Instruments, Aerospace and Defense Subsystems, Medical Diagnostic Equipment, Video and Display Interface Logic.
Industrial Automation Control
The A3P250-1FGG256T fits industrial automation because its flash fabric is live at power-up, so PLC I/O modules and motor-control sequencing boards start deterministic operation with zero boot delay - a hard requirement on factory lines where every second of startup counts. With 250,000 gates (6144 CLBs) and 157 user I/Os, it consolidates glue logic, encoder interfaces, and safety interlock logic into one chip, replacing multiple CPLDs and discrete logic. The 1 mm-pitch 256-FBGA saves board area in dense I/O cards, and FlashLock security protects proprietary control IP on shared production equipment. Because configuration is nonvolatile, power glitches during line switching cannot corrupt the programmed design.
Recommended
Communications Line Cards
In telecom and datacom line cards, the A3P250-1FGG256T serves as a control-plane bridge between backplane connectors, PHYs, and system controllers. Its 157 I/Os handle parallel status/monitor buses across multiple PHY devices, while the -1 speed grade supports the sub-350 MHz state-machine and interface logic typical of management paths. The single-chip flash architecture removes the configuration PROM and its power-up sequencing, simplifying hot-swap design. High security via FlashLock protects firmware-defined network features, and the 250k-gate fabric is sufficient for packet-framing assist logic, LED/alarms aggregation, and I2C/UART expansion that would otherwise need a CPLD farm.
Recommended
Portable and Battery-Powered Instruments
Battery-powered test and measurement instruments benefit from the ProASIC3 flash FPGA's low static power profile relative to SRAM FPGAs of similar density, since there is no configuration storage overhead and no external boot device drawing current. The 256-FBGA's 1 mm pitch supports compact handheld layouts, while 250,000 gates implement display controllers, sensor aggregation FSMs, and trigger logic. Instant-on operation means the instrument is measuring within milliseconds of the power switch - critical for intermittent-use field tools. The 157 I/Os connect ADCs, keypads, and displays without an additional I/O expander, reducing BOM cost and quiescent budget.
Recommended
Aerospace and Defense Subsystems
Microsemi (now Microchip) ProASIC3 flash FPGAs have a long heritage in aerospace and defense because flash configuration is inherently resistant to configuration upset compared with SRAM cells, and the single-chip design reduces component count in high-reliability boards. The A3P250-1FGG256T implements telemetry formatting, redundancy voting, and interface protocol conversion in satellite payloads and avionics test equipment. FlashLock provides design IP protection, which is frequently mandated in defense supply chains. Designers should select the appropriate military/extended temperature ordering variant when required and verify lot traceability with Microchip for qualified programs.
Recommended
Medical Diagnostic Equipment
Medical diagnostics such as blood analyzers and imaging front ends use the A3P250-1FGG256T to sequence motors, valves, and detector readout with deterministic instant-on behavior. The 6144-CLB fabric implements timing controllers for sensor arrays and interfaces to precision ADCs like the ADS131M08, while 157 I/Os integrate pumps, heaters, and user-interface elements without external expansion logic. Nonvolatile flash means sterilization-related power cycles never require reconfiguration, and the secure single-chip design supports the audit and IP-protection requirements of regulated medical device programs. Low-power flash operation suits portable point-of-care instruments.
Recommended
Video and Display Interface Logic
The 350 MHz-class fabric of the A3P250-1FGG256T supports video timing generation, scan conversion glue logic, and panel control interfaces in industrial displays and signage. With 157 user I/Os, the FPGA drives parallel RGB or LVDS-adjacent control streams to panel drivers while monitoring backlight and thermal feedback loops. Instant-on flash configuration ensures the display subsystem is ready before the video source enumerates - avoiding blank-frame faults at power-up. The 256-FBGA footprint fits behind panel driver boards, and FlashLock protects proprietary display-timing IP shipped inside commercial display products.
Recommended
Recommended Products Summary
Engineering reference data for A3P250-1FGG256T — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P250-1FGG256 | A3P250-FG256T | A3P250-2FGG256T |
|---|---|---|---|---|
| Package | 256-FBGA (1 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250000 | 250000 | 250000 | 250000 |
| CLBs / Cells | 6144 | 6144 | 6144 | 6144 |
| User I/O | 157 | 157 | 157 | 157 |
| Configuration Technology | Nonvolatile flash, single-chip | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
| Max Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz (higher graded timing) |
Key Differentiators
- Single-chip instant-on flash configuration (vs SRAM-based competitor FPGAs)
- Identical footprint across speed grades (vs A3P250-2FGG256T)
- Balanced density/IO for glue logic consolidation (vs Larger A3P1000 devices)
Design Notes
ProASIC3 flash FPGAs require core and I/O bank supply rails; verify the exact voltage rails and sequencing from the ProASIC3 datasheet before finalizing the power tree. Estimated: with 250k gates of flash fabric, static power is substantially lower than an equivalent SRAM FPGA, but dynamic power scales with clock frequency and toggle rate - run Microchip's power estimator in Libero SoC with your post-layout netlist for an accurate budget. Decouple each supply ball with 0.1 uF ceramics placed within 2 mm of the ball via short vias to the plane.
The 256-FBGA with 1 mm pitch allows via-in-pad or dog-house fanout with 0.3 mm drilled vias and 4-5 mil trace/space on BGA breakout layers. Use at least a four-layer board with dedicated ground plane under the BGA. Pin 1 (ball A1) is identified by the package dot; orient per the datasheet mechanical drawing. Follow IPC guidelines referenced in the Microchip packaging document for reflow profile - FBGA parts are moisture sensitive, so bake and follow the MSL rating printed on the reel label.
Common pitfall: assuming all 256 balls are user I/Os - only 157 are user-accessible, and I/O banks impose voltage-compatibility grouping, so check bank assignments before assigning signals. Second pitfall: the T suffix denotes tape and reel, not a different die; do not create separate approval documents for A3P250-1FGG256T versus A3P250-1FGG256. Third: the -1 speed grade has lower Fmax than -2; obtain timing-verified results in Libero SoC before freezing the -1 choice.
Compliance Information
Jotrin listing describes the package as GREEN, indicating RoHS/green body compliance. Full REACH, lead-free, and halogen-free status must be confirmed against the official Microchip product compliance documents.
