A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip
MPN: A3P600-1FGG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $25.43 | $25.43 |
| 10 | $23.12 | $231.20 |
| 100 | $20.81 | $2,081.00 |
| 500 | $18.5 | $9,250.00 |
| 1,000 | $16.19 | $16,190.00 |
Drop-in alternatives for A3P600-1FGG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600-FGG256I
✅ Drop-In✓ In Stock
$96.23 / Unit
View Datasheet →A3P600-2FGG256I
✅ Drop-In✓ In Stock
$49.8 / Unit
View Datasheet →A3P600L-1FGG256I
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600-FG256I
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →A3P600-1FG256I
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600-1FGG256I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| Number of Logic Elements/Cells | 7KLEs |
| Total RAM Bits | 110592 |
| Number of I/O | 177 |
| Number of Gates | 600K |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FBGA |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Maximum Operating Frequency | 272 MHz |
| Technology | 130nm |
| Core Supply Voltage | 1.5V |
| Embedded Memory | 110592 bits |
| RoHS Status | Compliant |
A3P600-1FGG256I Pin Configuration
| Pin 1 | IO — User I/O |
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| Pin 178 | VCC — Core supply voltage |
| Pin 179 | GND — Ground |
| Pin 180 | VCC — Core supply voltage |
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| Pin 200 | VCC — Core supply voltage |
| Pin 201 | GND — Ground |
| Pin 202 | VCC — Core supply voltage |
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| Pin 204 | VCC — Core supply voltage |
| Pin 205 | GND — Ground |
| Pin 206 | VCC — Core supply voltage |
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| Pin 218 | VCC — Core supply voltage |
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| Pin 224 | VCC — Core supply voltage |
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| Pin 250 | VCC — Core supply voltage |
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| Pin 256 | VCC — Core supply voltage |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-1FGG256I is suitable for 6 applications: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P600-1FGG256I is ideal for industrial control systems due to its reprogrammability, security features, and wide operating temperature range. Its 600K gates provide ample logic for motor control, PLCs, and robotics. The flash-based architecture ensures instant-on operation and immunity to configuration loss, critical in industrial environments. With 177 I/Os, it can interface with multiple sensors and actuators. The device's low power consumption reduces heat dissipation in sealed enclosures. According to Microchip, ProASIC3 FPGAs are used in industrial applications for their reliability and long-term availability.
Recommended
Automotive Electronics
In automotive electronics, the A3P600-1FGG256I is used for in-vehicle networking, driver assistance, and infotainment systems. Its 272 MHz performance handles real-time processing, while the 600K gates accommodate complex logic. The device's security features protect against unauthorized reprogramming, crucial for automotive safety. The 256-FBGA package is suitable for space-constrained ECU designs. Operating from -40°C to 100°C, it meets automotive temperature requirements. Microchip's ProASIC3 family is known for high reliability, making it suitable for long-life automotive applications.
Recommended
Communications Infrastructure
The A3P600-1FGG256I is well-suited for communications infrastructure such as base stations, routers, and switches. Its high I/O count (177) and 272 MHz performance enable efficient data packet processing and protocol handling. The flash-based configuration allows field upgrades without external memory. The device's low power consumption is beneficial for remote installations. With 110,592 bits of RAM, it can buffer data streams. According to Microchip, ProASIC3 FPGAs are used in networking equipment for their reliability and security.
Recommended
Consumer Electronics
In consumer electronics, the A3P600-1FGG256I is used in smart home devices, wearables, and multimedia systems. Its reprogrammability allows firmware updates for feature enhancements. The 600K gates provide sufficient logic for user interfaces and signal processing. The small 256-FBGA package is ideal for compact designs. The device's security features protect against IP theft. With 177 I/Os, it can interface with displays, sensors, and audio codecs. The low power consumption extends battery life in portable devices.
Recommended
Medical Devices
The A3P600-1FGG256I is used in medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its high reliability and long-term availability are critical for medical applications. The flash-based architecture ensures secure configuration, protecting patient data. The device's 272 MHz performance supports real-time signal processing. With 177 I/Os, it can interface with various sensors and ADCs. The wide operating temperature range (-40°C to 100°C) is suitable for medical environments. Microchip's ProASIC3 family is trusted in medical electronics for its robustness.
Recommended
Aerospace and Defense
In aerospace and defense, the A3P600-1FGG256I is used in avionics, radar, and secure communication systems. Its security features prevent reverse engineering and unauthorized modifications. The flash-based FPGA provides instant-on operation, essential for mission-critical systems. The device's 272 MHz performance and 600K gates enable complex signal processing. The 256-FBGA package is suitable for rugged environments. Operating from -40°C to 100°C, it meets military temperature requirements. Microchip's ProASIC3 family is known for high reliability in harsh conditions.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-1FGG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-FGG256I | A3P600-2FGG256I | A3P600L-1FGG256I | A3P600-FG256I | A3P600-1FG256I |
|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA | 256-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | Standard | -2 | -1 | Standard | -1 |
| Maximum Frequency | 272 MHz | 250 MHz | 310 MHz | 272 MHz | 250 MHz | 272 MHz |
| Low Power | No | No | No | Yes | No | No |
| Lead-Free Finish | Yes | Yes | Yes | Yes | No | No |
| Number of I/O | 177 | 177 | 177 | 177 | 177 | 177 |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
Key Differentiators
- Higher speed grade than A3P600-FGG256I (vs A3P600-FGG256I)
- Lead-free finish vs A3P600-FG256I (vs A3P600-FG256I)
- Standard power vs A3P600L-1FGG256I (vs A3P600L-1FGG256I)
Design Notes
The A3P600-1FGG256I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a DC-DC converter to provide a clean 1.5V rail. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the pin as possible. Additionally, use a 10uF bulk capacitor on the board to handle transient currents. According to Microchip's ProASIC3 power management guidelines, proper decoupling is essential to prevent voltage droop during high-speed switching.
The A3P600-1FGG256I in a 256-FBGA package has a thermal resistance (theta_JA) of approximately 20°C/W (estimated from similar packages). At 1.5V and typical dynamic power of 0.5W, the junction temperature rise is about 10°C. Ensure adequate airflow or a thermal pad to the PCB for heat dissipation. For high utilization designs, consider a heatsink or forced cooling. This is an estimate; refer to the datasheet for exact thermal data.
For the 256-FBGA package, use a 4-layer PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm for single-ended). Place decoupling capacitors on the bottom side directly under the FPGA. Follow Microchip's layout guidelines for ProASIC3 to minimize signal integrity issues. Ensure all GND pins are connected to the ground plane with low inductance vias.
Compliance Information
RoHS compliant per Microchip product page. Lead-free finish indicated by 'FGG' in part number. Other compliance data not specified in provided sources.